Patents by Inventor Sumio Okada

Sumio Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11213757
    Abstract: The present disclosure relates to an information processing apparatus, an information processing method, and a program making it possible to further enhance entertainability. A play state recognition unit recognizes a play state of a game. The effect rendering unit performs image processing for adding an effect to an image representing the state of the commentator that makes a gaming commentary on the basis of the play state of the game recognized by the play state recognition unit. For example, a game status indicating predetermined information is displayed at a predetermined location on the game screen of the game in accordance with the play state of the game. The play state recognition unit analyzes the game status to recognize the play state of the game. The present technology can be applied to a video distribution service that distributes a video of a game screen, for example.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: January 4, 2022
    Assignee: SONY CORPORATION
    Inventors: Takaaki Nakagawa, Hiromasa Doi, Hirotake Goto, Takahisa Fujita, Sumio Okada, Keita Ishikawa
  • Patent number: 11146863
    Abstract: Provided is an information processing device, an information processing method, and a moving image distribution system enabled to provide a moving image distribution service having higher interactivity. The information acquisition unit acquires information indicating that an additional image is caused to move from one to another of a distribution moving image display area and an outer area, the additional image being displayed on the distribution moving image display area for displaying a distribution moving image or on the outer area provided outside the distribution moving image display area. The display control unit controls display of the additional image on the basis of the information in a case where the additional image moves between the distribution moving image display area and the outer area.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: October 12, 2021
    Assignee: SONY CORPORATION
    Inventors: Takahisa Fujita, Hirotake Goto, Sumio Okada, Takaaki Nakagawa
  • Publication number: 20190069041
    Abstract: The present disclosure relates to an information processing device, an information processing method, a program, and a moving image distribution system enabled to provide a moving image distribution service having higher interactivity. The information acquisition unit acquires information indicating that an additional image is caused to move from one to another of a distribution moving image display area and an outer area, the additional image being displayed on the distribution moving image display area for displaying a distribution moving image or on the outer area provided outside the distribution moving image display area. The display control unit controls display of the additional image on the basis of the information in a case where the additional image moves between the distribution moving image display area and the outer area. The present technology can be applied to, for example, a moving image distribution system that provides a moving image distribution service having interactivity.
    Type: Application
    Filed: March 2, 2017
    Publication date: February 28, 2019
    Inventors: TAKAHISA FUJITA, HIROTAKE GOTO, SUMIO OKADA, TAKAAKI NAKAGAWA
  • Publication number: 20190009178
    Abstract: The present disclosure relates to an information processing apparatus, an information processing method, and a program making it possible to further enhance entertainability. A play state recognition unit recognizes a play state of a game. The effect rendering unit performs image processing for adding an effect to an image representing the state of the commentator that makes a gaming commentary on the basis of the play state of the game recognized by the play state recognition unit. For example, a game status indicating predetermined information is displayed at a predetermined location on the game screen of the game in accordance with the play state of the game. The play state recognition unit analyzes the game status to recognize the play state of the game. The present technology can be applied to a video distribution service that distributes a video of a game screen, for example.
    Type: Application
    Filed: March 24, 2017
    Publication date: January 10, 2019
    Applicant: SONY CORPORATION
    Inventors: Takaaki NAKAGAWA, Hiromasa DOI, Hirotake GOTO, Takahisa FUJITA, Sumio OKADA, Keita ISHIKAWA
  • Patent number: 9652598
    Abstract: There is provided an information processing device including a communication unit configured to receive editing information of content data, an accumulation unit configured to accumulate the editing information, and a control unit configured to control whether to return the editing information to an external device in accordance with a right to use content corresponding to a requestor's identification information included in request information for requesting the editing information, the request information being received from the external device via the communication unit.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: May 16, 2017
    Assignee: SONY CORPORATION
    Inventors: Sumio Okada, Hiroshi Nakayama, Ryota Sakamoto, Chika Miura, Tsutomu Kawachi, Masayuki Chatani, Eiji Miyakawa
  • Publication number: 20150242596
    Abstract: There is provided an information processing device including a communication unit configured to receive editing information of content data, an accumulation unit configured to accumulate the editing information, and a control unit configured to control whether to return the editing information to an external device in accordance with a right to use content corresponding to a requestor's identification information included in request information for requesting the editing information, the request information being received from the external device via the communication unit.
    Type: Application
    Filed: February 18, 2015
    Publication date: August 27, 2015
    Applicant: Sony Corporation
    Inventors: Sumio OKADA, Hiroshi NAKAYAMA, Ryota SAKAMOTO, Chika MIURA, Tsutomu KAWACHI, Masayuki CHATANI, Eiji MIYAKAWA
  • Patent number: 5304512
    Abstract: A chip 12 having an electric circuit and a plurality of leads 8 connected electrically with the chip 12 are molded in a resin-sealed package 46 by a molding material containing a main component of a resin, by introducing a molding compound sheet 20 into the cavities 33 of molds 31, 32 before the molds are clamped, by melting the molding compound sheet 20 in the cavities 33 into a liquid molding material 45 after the mold clamping action to pressure fill up the inside of the cavities 33, and by setting the liquid molding material 45 integrally.
    Type: Grant
    Filed: December 22, 1992
    Date of Patent: April 19, 1994
    Assignee: Hitachi, Ltd.
    Inventors: Katsuo Arai, Sumio Okada, Takashi Ooba, Kazuya Takahashi, Mayumi Kaneko
  • Patent number: 5150193
    Abstract: The present invention consists in that a through hole of large area is provided in a die pad or a tab, thereby to prevent a resin from cracking at the rear surface of a surface-packaging resin package in a high-temperature soldering atmosphere of vapor-phase reflow or the like, whereby a resin-molded surface-packaged IC of high reliability is provided.
    Type: Grant
    Filed: February 11, 1991
    Date of Patent: September 22, 1992
    Assignees: Hitachi, Ltd., Hitachi Tobu Semiconductor, Ltd.
    Inventors: Toshihiro Yasuhara, Masachika Masuda, Gen Murakami, Kunihiko Nishi, Masanori Sakimoto, Ichio Shimizu, Akio Hoshi, Sumio Okada, Tooru Nagamine
  • Patent number: 4920074
    Abstract: The present invention provides a surface mount Gull-Wing type resin-encapsulating package for encapsulating a semiconductor chip, wherein the cut face (outer tip end) of each outer lead is formed to have a smaller cross-sectional area than that of each outer lead, for improving the extension of solder to the cut face of that lead. Such relatively smaller cross-sectional area of the outer tip end of each outer lead reduces the exposed area of the lead material when disconnecting the leads from the frame in separating the device from the frame.
    Type: Grant
    Filed: February 25, 1988
    Date of Patent: April 24, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Ichio Shimizu, Akio Hoshi, Sumio Okada, Soichiro Nakamura