Abstract: An adhesive sheet includes a first face and a second face opposite to each other. The first face includes a thermally expandable thermosetting adhesive layer A, and the second face includes a thermally expandable thermosetting adhesive layer B having a different composition from that of the thermally expandable thermosetting adhesive layer A. The thermally expandable thermosetting adhesive layer B is laminated on one face of the thermally expandable thermosetting adhesive layer A directly or through another layer. The first face has a higher shear adhesive strength than a shear adhesive strength of the second face. The thermally expandable thermosetting adhesive layer A and the thermally expandable thermosetting adhesive layer B each have a thickness direction expansion rate after heating at 150° C. for 60 minutes of 130% or more.

Abstract: An adhesive sheet expandable by heating is provided. The adhesive sheet, before expansion, achieve temporary fixability at room temperature and ease of insertion when inserting one member into a cavity of another member. The adhesive sheet, after expansion, maintains excellent adhesive strength to enable the members to be firmly bonded together even under high temperature environments. An adhesive sheet includes a first principal face and a second principal face opposite to each other. The first principal face includes a thermally expandable thermosetting adhesive layer and a plurality of sticky parts provided on a first principal face of the thermally expandable thermosetting adhesive layer in a patterned manner. The second principal face includes the thermally expandable thermosetting adhesive layer forming the first principal face of the adhesive sheet or another thermally expandable thermosetting adhesive layer.

Abstract: An object of the present invention relates to a thermosetting adhesive sheet that, without the use of a metal reinforcement sheet, which is regarded as a major factor responsible for an increase in thickness of electronic devices and other devices, reinforces a flexible printed circuit to such a level that detachment of mounted components, for example, is prevented, prevents warping, and has good electrical conductivity. The present invention relates to a thermosetting adhesive sheet configured to be used to reinforce a flexible printed circuit. The thermosetting adhesive sheet includes a woven fabric, a nonwoven fabric, or a metal base of 50 ?m or less thickness and a thermosetting adhesive layer adjacent to at least one surface of the woven fabric, the nonwoven fabric, or the metal base of 50 ?m or less thickness.

Abstract: An object of the present invention relates to a thermosetting adhesive sheet that, without the use of a metal reinforcement sheet, which is regarded as a major factor responsible for an increase in thickness of electronic devices and other devices, reinforces a flexible printed circuit to such a level that detachment of mounted components, for example, is prevented, prevents warping, and has good electrical conductivity. The present invention relates to a thermosetting adhesive sheet configured to be used to reinforce a flexible printed circuit. The thermosetting adhesive sheet includes a woven fabric, a nonwoven fabric, or a metal base of 50 ?m or less thickness and a thermosetting adhesive layer adjacent to at least one surface of the woven fabric, the nonwoven fabric, or the metal base of 50 ?m or less thickness.

Abstract: An object of the present invention is to provide a thermosetting material capable of forming a reinforcing member with which a flexible printed circuit board can be reinforced at a level high enough to prevent, for example, detachment of components even without using a reinforcing metal plate, which increases the thickness of an electronic device or the like. The present invention relates to a thermosetting material used for reinforcing a flexible printed circuit board. The thermosetting material has a modulus of tensile elasticity (×1) of 50 to 2,500 MPa at 25° C. A heat-cured product of the thermosetting material has a modulus of tensile elasticity (×2) of 2,500 MPa or more at 25° C.