Abstract: A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.

Abstract: A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.

Abstract: A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.

Abstract: A method of manufacturing a semiconductor device includes, in this order: preparing a bottom plate having an upper surface and a lower surface, wherein the upper surface includes an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part, and wherein the lower surface of the bottom plate includes a reference part and a recess positioned above the reference part, at least a part of the recess being disposed directly below the outer peripheral part; joining a frame member to the outer peripheral part of the bottom plate, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the inside part of the bottom plate.

Abstract: A method of manufacturing a semiconductor device includes, in this order: preparing a bottom plate having an upper surface and a lower surface, wherein the upper surface includes an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part, and wherein the lower surface of the bottom plate includes a reference part and a recess positioned above the reference part, at least a part of the recess being disposed directly below the outer peripheral part; joining a frame member to the outer peripheral part of the bottom plate, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the inside part of the bottom plate.

Abstract: A starting light source for radiating the UV-light to a discharge chamber upon starting lighting of a high pressure discharge lamp includes a discharge tube for generating the UV-light by a starting voltage applied upon starting lighting the lamp, the discharge tube includes an internal electrode extended from a pinch seal portion formed at one end to a light-emitting portion thereof and an external electrode disposed close to or in contact with both of the light-emitting portion and the pinch seal portion, at least a portion of the external electrode disposed for the light-emitting portion includes a holder formed by bending fabrication of a metal sheet into such a shape of gripping and holding the discharge tube, and a terminal is formed to the holder for fixing and electrically connecting the external electrode to a conductor part having a polarity opposite to that of the internal electrode.

Abstract: A light utilization efficiency of a high-pressure discharge lamp is improved even in a case of reducing the size of a reflection mirror without using an auxiliary reflection mirror. In a lamp device where a portion of lights emitted from a discharge bulb to the periphery thereof in forward and backward directions for a predetermined range of angle is reflected at a concave reflection mirror and illuminated to a light collection area of a predetermined size formed forward of the lamp, a prism surface having an angle of refracting or deflecting at least a portion of lights emitted from the discharge bulb that is not reflected at the concave reflection mirror to the light collection area is formed to the outer peripheral surface of the discharge bulb.

Abstract: A necessary and sufficient amount of a UV-light is radiated to a high pressure discharge lamp for enabling reliable improvement in the starting performance by a starting light source of a simple configuration not increasing the manufacturing cost.

Abstract: The invention relates to a light source device having a high-voltage discharge lamp (1) on which a trigger line (10) for triggering the lamp is attached. The high-voltage discharge lamp (1) is formed such that an arc tube (7) having a pair of substantially cylindrical sealing portions (9R, 9L) formed on both sides in the longitudinal direction with a light emitting portion (8) in between is sealed with electrode assemblies (3R, 3L). The trigger line (10) is formed such that its one end (10a) is connected to a power supply lead (6), which is of the electrode assembly (3L) and protruded from the one sealing portion (9L), and its other end (10c) is wound around the outer circumference of the other sealing portion (9R).

Abstract: A light utilization efficiency of a high-pressure discharge lamp is improved even in a case of reducing the size of a reflection mirror without using an auxiliary reflection mirror. In a lamp device where a portion of lights emitted from a discharge bulb to the periphery thereof in forward and backward directions for a predetermined range of angle is reflected at a concave reflection mirror and illuminated to a light collection area of a predetermined size formed forward of the lamp, a prism surface having an angle of refracting or deflecting at least a portion of lights emitted from the discharge bulb that is not reflected at the concave reflection mirror to the light collection area is formed to the outer peripheral surface of the discharge bulb.

Abstract: The invention relates to a light source device having a high-voltage discharge lamp (1) on which a trigger line (10) for triggering the lamp is attached. The high-voltage discharge lamp (1) is formed such that an arc tube (7) having a pair of substantially cylindrical sealing portions (9R, 9L) formed on both sides in the longitudinal direction with a light emitting portion (8) in between is sealed with electrode assemblies (3R, 3L). The trigger line (10) is formed such that its one end (10a) is connected to a power supply lead (6), which is of the electrode assembly (3L) and protruded from the one sealing portion (9L), and its other end (10c) is wound around the outer circumference of the other sealing portion (9R).

Abstract: A semiconductor module 10 in which respective upper surfaces of semiconductor elements 17, 17 on both sides of a rectangular circuit board 11 are covered with radiator plates 12a, 12b attached to both sides of the circuit board 11 so that their outer peripheral edges are not projected from the board surfaces of the circuit board 11. In this semiconductor module, by projections serving as a pair of attachments 42, 42 formed in the vicinity of the center area in a longitudinal direction of the circuit board 11, the radiator plates 12a, 12b are located at predetermined positions. The projections abuts on the corresponding board surface of the circuit board 11 so that a part of the load applied to the vicinity of the center area of each the radiator plates 12a, 12b can be supported by the circuit board 11.

Abstract: In a semiconductor module 10 in which a semiconductor device 17 is mounted on both surfaces of a circuit board 11 and heat radiation plates 12a, 12b are provided to both surfaces of the circuit board to cover the semiconductor device, a fitting hole via which the heat radiation plates 12a, 12b are fitted is formed in the circuit board 11, and a housing recess portion 18 in which the semiconductor devices 11 are housed is provided to both heat radiation plates 12a, 12b fitted to both surfaces of the circuit board 11 respectively and a fitting edge portion 25 is provided in a position of both heat radiation plates that overlaps with a position in which the fitting hole is formed, and also a fixing means 20 for fixing both heat radiation plates 12a, 12b to the circuit board 11 by caulking to align with the fitting hole is provided to fitting edge portions 25 integrally with the heat radiation plates 12a, 12b.

Abstract: A radiator plate 20 is mounted on a back surface of a semiconductor element 11 on a substrate 10 so that heat is radiated from the semiconductor element 11. The radiator plate 20 includes first radiating fins 20b formed on the one side which is opposite to the surface facing the substrate 10 and second radiating fins 20c formed on the other side which faces the substrate 10. The second radiating fins 20c are arranged in the same direction as the first radiating fins 20b and at positions not interfering the semiconductor element 11.

Abstract: A semiconductor module 10 in which respective upper surfaces of semiconductor elements 17, 17 on both sides of a rectangular circuit board 11 are covered with radiator plates 12a, 12b attached to both sides of the circuit board 11 so that their outer peripheral edges are not projected from the board surfaces of the circuit board 11. In this semiconductor module, by projections serving as a pair of attachments 42, 42 formed in the vicinity of the center area in a longitudinal direction of the circuit board 11, the radiator plates 12a, 12b are located at predetermined positions. The projections abuts on the corresponding board surface of the circuit board 11 so that a part of the load applied to the vicinity of the center area of each the radiator plates 12a, 12b can be supported by the circuit board 11.

Abstract: In a semiconductor module 10 in which a semiconductor device 17 is mounted on both surfaces of a circuit board 11 and heat radiation plates 12a, 12b are provided to both surfaces of the circuit board to cover the semiconductor device, a fitting hole via which the heat radiation plates 12a, 12b are fitted is formed in the circuit board 11, and a housing recess portion 18 in which the semiconductor devices 11 are housed is provided to both heat radiation plates 12a, 12b fitted to both surfaces of the circuit board 11 respectively and a fitting edge portion 25 is provided in a position of both heat radiation plates that overlaps with a position in which the fitting hole is formed, and also a fixing means 20 for fixing both heat radiation plates 12a, 12b to the circuit board 11 by caulking to align with the fitting hole is provided to fitting edge portions 25 integrally with the heat radiation plates 12a, 12b.

Abstract: There are provided a step of forming a structure in which a first concave portion is formed in a predetermined portion on one surface of a metal plate and also a convex portion that protrudes from other surface of the metal plate is formed by formation of the first concave portion and a second concave portion is formed in a predetermined portion on an outside of a peripheral portion of the convex portion, by shaping the metal plate by means of stamping using a die, and a step of cutting the convex portion formed on the other surface of the metal plate.

Abstract: There are provided a step of forming a structure in which a first concave portion is formed in a predetermined portion on one surface of a metal plate and also a convex portion that protrudes from other surface of the metal plate is formed by formation of the first concave portion and a second concave portion is formed in a predetermined portion on an outside of a peripheral portion of the convex portion, by shaping the metal plate by means of stamping using a die, and a step of cutting the convex portion formed on the other surface of the metal plate.

Abstract: There is provided a soft ice cream in which even materials such as a strawberry easily changed in properties and containing an acid component can be used, and the unique flavor of the material other than a soft ice cream mix, such as strawberry jam and chocolate, can sufficiently be enjoyed. In the soft ice cream obtained by charging the cream flow of a cooled and semi-hardened soft ice cream mix discharged from a discharge nozzle into a cup so that the discharge shape is maintained as much as possible, the part formed of the strawberry jam is continuously disposed in the part formed of the soft ice cream mix along the cream flow charged into the cup.