Patents by Inventor Sumire Yamazaki

Sumire Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210367351
    Abstract: A circuit substrate includes a multi-layer substrate in which a plurality of dielectric layers are stacked, and a millimeter wave absorber provided inside the multi-layer substrate and having an electromagnetic wave absorption peak within a region of 30 to 300 GHz. An antenna element includes the circuit substrate described above, a power feeder provided inside the multi-layer substrate of the circuit substrate, and an antenna provided on a surface of the circuit substrate and connected to the power feeder. A method for reducing noise in a circuit substrate including a multi-layer substrate includes, by a millimeter wave absorber provided inside the multi-layer substrate and having an electromagnetic wave absorption peak within a region of 30 to 300 GHz, absorbing unnecessary electromagnetic waves diffused in the multi-layer substrate to reduce noise in the circuit substrate.
    Type: Application
    Filed: February 12, 2020
    Publication date: November 25, 2021
    Inventors: Shin-ichi Ohkoshi, Marie Yoshikiyo, Asuka Namai, Masayuki Asanuma, Yukihiro Shibuya, Sumire Yamazaki, Naomasa Ueda