Patents by Inventor Sumitomo Inomata
Sumitomo Inomata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8758087Abstract: In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion of the wafer so as to form a reformed layer at the portion of the wafer, and a polishing tool is brought into contact with the portion of wafer while rotating so as to polish the portion of the wafer.Type: GrantFiled: May 24, 2011Date of Patent: June 24, 2014Assignee: DENSO CORPORATIONInventors: Kyohei Koutake, Hiromichi Morita, Fumiyoshi Kano, Tetsuji Yamaguchi, Sumitomo Inomata, Masatake Nagaya
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Publication number: 20110294403Abstract: In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion of the wafer so as to form a reformed layer at the portion of the wafer, and a polishing tool is brought into contact with the portion of wafer while rotating so as to polish the portion of the wafer.Type: ApplicationFiled: May 24, 2011Publication date: December 1, 2011Applicant: DENSO CORPORATIONInventors: Kyohei KOUTAKE, Hiromichi Morita, Fumiyoshi Kano, Tetsuji Yamaguchi, Sumitomo Inomata, Masatake Nagaya
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Publication number: 20110147493Abstract: A method is for forming a periodic groove arrangement. According to the method, a base material made of metal is provided. Furthermore, the periodic groove arrangement, which includes a plurality of periodic grooves, is formed on a surface of the base material by irradiating and scanning the surface of the base material with a pulsed laser. A fuel injection system includes a nozzle hole forming part and the periodic groove arrangement formed by the method. The nozzle hole forming part includes a nozzle hole, which passes through the nozzle hole forming part and through which fuel is injected. The periodic groove arrangement is formed on an outer surface of the nozzle hole forming part.Type: ApplicationFiled: December 17, 2010Publication date: June 23, 2011Applicant: DENSO CORPORATIONInventors: Yoshihito MITSUOKA, Kazunori Suzuki, Yasuo Kitou, Sumitomo Inomata
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Patent number: 7091109Abstract: A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together. After that, the semiconductor wafer is cut into semiconductor chips by dicing along the grooves of the protective sheet. Because the protective sheet is not cut by dicing, no scraps of the protective sheet is produced, thereby preventing contamination to the chips.Type: GrantFiled: July 22, 2004Date of Patent: August 15, 2006Assignee: Denso CorporationInventors: Tetsuo Fujii, Hiroshi Muto, Shinji Yoshihara, Sumitomo Inomata
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Publication number: 20060065648Abstract: A burr removing device for removing a burr, which is formed at a connection between a first hole and a second hole that are angled relative to each other inside a workpiece. According to the burr removing device, a generated high-density energy beam is converged by a converging lens, which is located outside of the first and second holes of the workpiece. Then, the converged high-density energy beam is reflected toward the burr by a one reflecting mirror, which is located in one of the first and second holes.Type: ApplicationFiled: June 23, 2005Publication date: March 30, 2006Inventors: Michio Kameyama, Sumitomo Inomata, Terukazu Fukaya, Eiji Kumagai, Hiromichi Morita
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Publication number: 20050230370Abstract: A method for machining an object includes the steps of: forming a hole in the object by a laser beam having a first focus point; and reforming the hole by the laser beam having a second focus point, which is different from the first focus point. The first and the second focus points are disposed on a same light axis. In at least one of the step of forming the hole and the step of reforming the hole, the object is machined by a diffusion and a condensation of the laser beam in the object.Type: ApplicationFiled: March 29, 2005Publication date: October 20, 2005Applicant: DENSO CORPORATIONInventors: Michio Kameyama, Sumitomo Inomata, Eiji Kumagai, Tetsuaki Kamiya, Takashi Ogata, Tsuyoshi Hayakawa
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Publication number: 20040259330Abstract: A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together. After that, the semiconductor wafer is cut into semiconductor chips by dicing along the grooves of the protective sheet. Because the protective sheet is not cut by dicing, no scraps of the protective sheet is produced, thereby preventing contamination to the chips.Type: ApplicationFiled: July 22, 2004Publication date: December 23, 2004Inventors: Tetsuo Fujii, Hiroshi Muto, Shinji Yoshihara, Sumitomo Inomata
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Patent number: 6495796Abstract: A discharging nozzle is provided in an inside space of a metal cylinder for supplying an assist gas from an inside of the metal cylinder. The gas discharging nozzle shuts a high density energy beam intruding into the inside space of the metal cylinder through a hole, so that the energy beam is prevented from being emitted to an opposite side inner surface of the metal cylinder. Dross formed during the cut-machining is drifted and swept to the outside by an assist gas flowing out from the inside space of the metal cylinder through the hole, and is blown out by the assist gas flowing on an outside surface of the metal cylinder around the hole, thereby preventing the dross from sticking to peripheral area of the hole.Type: GrantFiled: July 25, 2001Date of Patent: December 17, 2002Assignee: Denso CorporationInventors: Terukazu Fukaya, Takashi Nakayama, Sumitomo Inomata, Michio Kameyama, Seiji Tachibana
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Patent number: 6429506Abstract: A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together. After that, the semiconductor wafer is cut into semiconductor chips by dicing along the grooves of the protective sheet. Because the protective sheet is not cut by dicing, no scraps of the protective sheet is produced, thereby preventing contamination to the chips.Type: GrantFiled: March 15, 2000Date of Patent: August 6, 2002Assignee: Denso CorporationInventors: Tetsuo Fujii, Tsuyoshi Fukada, Hiroshi Muto, Kenichi Ao, Shinji Yoshihara, Sumitomo Inomata
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Publication number: 20020093076Abstract: A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together. After that, the semiconductor wafer is cut into semiconductor chips by dicing along the grooves of the protective sheet. Because the protective sheet is not cut by dicing, no scraps of the protective sheet is produced, thereby preventing contamination to the chips.Type: ApplicationFiled: March 7, 2002Publication date: July 18, 2002Inventors: Tetsuo Fujii, Tsuyoshi Fukada, Hiroshi Muto, Kenichi Ao, Shinji Yoshihara, Sumitomo Inomata
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Publication number: 20020023905Abstract: A discharging nozzle is provided in an inside space of a metal cylinder for supplying an assist gas from an inside of the metal cylinder. The gas discharging nozzle shuts a high density energy beam intruding into the inside space of the metal cylinder through a hole, so that the energy beam is prevented from being emitted to an opposite side inner surface of the metal cylinder. Dross formed during the cut-machining is drifted and swept to the outside by an assist gas flowing out from the inside space of the metal cylinder through the hole, and is blown out by the assist gas flowing on an outside surface of the metal cylinder around the hole, thereby preventing the dross from sticking to peripheral area of the hole.Type: ApplicationFiled: July 25, 2001Publication date: February 28, 2002Inventors: Terukazu Fukaya, Takashi Nakayama, Sumitomo Inomata, Michio Kameyama, Seiji Tachibana
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Patent number: 6255741Abstract: A heat resisting resin sheet is bonded to a semiconductor chip as a protective cap for protecting a beam structure provided on the semiconductor chip, through a heat resisting adhesive. The heat resisting resin sheet is composed of a polyimide base member and the heat resisting adhesive is composed of silicone adhesive. The heat resisting resin sheet is not deformed during a manufacturing process of the semiconductor chip. In addition, grinding water does not invade into the semiconductor chip during dicing-cut.Type: GrantFiled: March 16, 1999Date of Patent: July 3, 2001Assignee: Denso CorporationInventors: Shinji Yoshihara, Sumitomo Inomata, Kinya Atsumi, Minekazu Sakai, Yasuki Shimoyama, Tetsuo Fujii
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Patent number: 5824177Abstract: A semiconductor wafer, which can be divided into chips at a high yield and a low cost and easily handled during transfer thereof as well, is disclosed. In a semiconductor wafer of such structure that structures with a low mechanical strength, such as suspended microstructures, are exposed at a surface thereof, detachable adhesive sheet making up protective caps for the respective suspended microstructures are formed over the semiconductor wafer. By means of this, even if the semiconductor wafer is diced into the individual chips, respective microstructures on chips are protected from the external force, such as the pressure of cutting water, during the dicing process.Type: GrantFiled: July 12, 1996Date of Patent: October 20, 1998Assignee: Nippondenso Co., Ltd.Inventors: Shinji Yoshihara, Sumitomo Inomata, Fumio Ohara, Takashi Kurahashi