Patents by Inventor Sumitoshi Asakuma

Sumitoshi Asakuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polymer for forming insulating film, composition for forming insulating film, insulating film, and electronic device having same
    Patent number: 8530596
    Abstract: A polymer and composition useful in forming an insulating film provided with a low permittivity, a high heat resistance, and a high mechanical strength and an insulating film obtained from these and an electronic device having the same are provided. The polymer for forming an insulating film according to the present invention is characterized by being obtained by polymerizing a reactive compound represented by Formula (1). The insulating film according to the present invention is formed using a composition for forming an insulating film including that polymer, has molecular spaces having an average space size of 0.7 nm to 5 nm, and has a permittivity of 2.3 or less. The electronic device according to the present invention has the insulating film.
    Type: Grant
    Filed: January 27, 2010
    Date of Patent: September 10, 2013
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventors: Yohko Sano, Kazuyoshi Fujita, Sumitoshi Asakuma
  • POLYMER FOR FORMING INSULATING FILM, COMPOSITION FOR FORMING INSULATING FILM, INSULATING FILM, AND ELECTRONIC DEVICE HAVING SAME
    Publication number: 20100130672
    Abstract: A polymer and composition useful in forming an insulating film provided with a low permittivity, a high heat resistance, and a high mechanical strength and an insulating film obtained from these and an electronic device having the same are provided. The polymer for forming an insulating film according to the present invention is characterized by being obtained by polymerizing a reactive compound represented by Formula (1). The insulating film according to the present invention is formed using a composition for forming an insulating film including that polymer, has molecular spaces having an average space size of 0.7 nm to 5 nm, and has a permittivity of 2.3 or less. The electronic device according to the present invention has the insulating film.
    Type: Application
    Filed: January 27, 2010
    Publication date: May 27, 2010
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Yohko SANO, Kazuyoshi Fujita, Sumitoshi Asakuma
  • Laminated body and semiconductor device
    Patent number: 7608928
    Abstract: A laminate includes a copper wiring layer (20) provided over a semiconductor layer and having a specific pattern, a protective layer (30) formed of a polybenzoxazole resin layer provided on the copper wiring layer (20), and an insulating layer (40) provided on the protective layer.
    Type: Grant
    Filed: May 20, 2005
    Date of Patent: October 27, 2009
    Assignees: JSR Corporation, Sumitomo Bakelite Co., Ltd.
    Inventors: Kaori Shirato, Atsushi Shiota, Masahiro Tada, Sumitoshi Asakuma
  • Laminated Body and Semiconductor Drive
    Publication number: 20080044664
    Abstract: A laminate includes a copper wiring layer (20) provided over a semiconductor layer and having a specific pattern, a protective layer (30) formed of a polybenzoxazole resin layer provided on the copper wiring layer (20), and an insulating layer (40) provided on the protective layer.
    Type: Application
    Filed: May 20, 2005
    Publication date: February 21, 2008
    Applicants: JSR CORPORATION, SUMITOMO BAKELITE CO., LTD.
    Inventors: Kaori Shirato, Atsushi Shiota, Masahiro Tada, Sumitoshi Asakuma