Abstract: An electronic component includes an element body and outer electrodes on the element body. The element body includes top and bottom opposed surfaces, and side surfaces connecting the top and bottom surfaces. An outer electrode includes a lower layer electrode on the top surface and the bottom surface, and an upper layer electrode overlying the lower layer electrode and extending from an upper side of the lower electrode onto the side surface. When viewed from a direction orthogonal to the top and bottom surfaces, an edge of the lower layer electrode is disposed at a position farther from the side surface at which the upper layer electrode is provided than a position of an edge of the upper layer electrode, and a radius of curvature of the edge of the lower electrode is larger than a radius of curvature of the edge of the upper layer electrode.

Abstract: An electronic component includes a ceramic element body including glass, and outer electrodes provided on the ceramic element body. Each of the outer electrodes includes a base electrode layer on the ceramic element body and a buffer portion to buffer an impact. The base electrode layer includes a first region that is disposed on the ceramic element body and includes the buffer portion of equal to or more than about 15 vol % and equal to or less than about 50 vol %, and a second region that covers the first region and includes the buffer portion of equal to or more than about 1 vol % and equal to or less than about 10 vol %.

Abstract: An ESD protection device includes an insulating substrate, first and second discharge electrodes in contact with the insulating substrate, the first and second discharge electrodes separated from each other and opposing each other, first and second outer electrodes on an outside surface of the insulating substrate, the first outer electrode being electrically connected to the first discharge electrode and the second outer electrode being electrically connected to the second discharge electrode, and a discharge auxiliary electrode spanning the first discharge electrode and the second discharge electrode in a region where the discharge electrodes oppose each other. The discharge auxiliary electrode includes semiconductor particles and metal particles. An average particle diameter of the metal particles is about 0.3 ?m to about 1.5 ?m.

Abstract: An electronic component includes an element body and outer electrodes on the element body. The element body includes top and bottom opposed surfaces, and side surfaces connecting the top and bottom surfaces. An outer electrode includes a lower layer electrode on the top surface and the bottom surface, and an upper layer electrode overlying the lower layer electrode and extending from an upper side of the lower electrode onto the side surface. When viewed from a direction orthogonal to the top and bottom surfaces, an edge of the lower layer electrode is disposed at a position farther from the side surface at which the upper layer electrode is provided than a position of an edge of the upper layer electrode, and a radius of curvature of the edge of the lower electrode is larger than a radius of curvature of the edge of the upper layer electrode.

Abstract: An electronic component includes a ceramic element body including glass, and outer electrodes provided on the ceramic element body. Each of the outer electrodes includes a base electrode layer on the ceramic element body and a buffer portion to buffer an impact. The base electrode layer includes a first region that is disposed on the ceramic element body and includes the buffer portion of equal to or more than about 15 vol % and equal to or less than about 50 vol %, and a second region that covers the first region and includes the buffer portion of equal to or more than about 1 vol % and equal to or less than about 10 vol %.

Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.

Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.

Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.

Abstract: An ESD protection device includes an insulating substrate, first and second discharge electrodes in contact with the insulating substrate, the first and second discharge electrodes separated from each other and opposing each other, first and second outer electrodes on an outside surface of the insulating substrate, the first outer electrode being electrically connected to the first discharge electrode and the second outer electrode being electrically connected to the second discharge electrode, and a discharge auxiliary electrode spanning the first discharge electrode and the second discharge electrode in a region where the discharge electrodes oppose each other. The discharge auxiliary electrode includes semiconductor particles and metal particles. An average particle diameter of the metal particles is about 0.3 ?m to about 1.5 ?m.

Abstract: An ESD protection device includes an insulative substrate, first and second discharge electrodes contacting the insulative substrate, the first and second discharge electrodes being spaced apart from and opposed to each other, first and second outer electrodes provided on an outside surface of the insulative substrate and electrically connected to the first and second discharge electrodes, respectively; and a discharge auxiliary electrode extending from the first discharge electrode to the second discharge electrode in a region where the first and second discharge electrodes oppose each other. The discharge auxiliary electrode includes semiconductor particles and metal particles having an average particle diameter of about 0.3 ?m to about 1.5 ?m, and a density of the metal particles at a random cross-section of the discharge auxiliary electrode is greater than or equal to about 20 particles/50 ?m2.

Abstract: A laminated coil component has a laminated body which is formed by laminating a plurality of ferrite layers, a helical coil which is provided in the laminated body, and a plurality of external electrodes which are provided on the surface of the laminated body and are electrically connected to the helical coil and are mainly composed of Cu. The ferrite layers have an exposed region exposed from the surface of the laminated body without being covered with the external electrodes. A surface resistivity of the exposed region of the ferrite layers is more than 104? and less than 107?.

Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.