Patents by Inventor Sun-bum Kim

Sun-bum Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming bump that may reduce possibility of losing contact pad material
    Publication number: 20060073704
    Abstract: A method of forming a bump may involve providing a seed layer on a contact pad of a wafer. A shielding layer and a photosensitive mask layer may be formed on the seed layer. The photosensitive mask layer may be exposed and developed to form a mask pattern. An exposed portion of the shielding layer may be removed. The bump may be formed by plating the exposed seed layer.
    Type: Application
    Filed: August 25, 2005
    Publication date: April 6, 2006
    Inventors: Se-young Jeong, In-young Lee, Sung-min Sim, Young-hee Song, Dong-hyeon Jang, Myeong-soon Park, Sun-young Park, Sun-bum Kim, Hyun-soo Chung