Abstract: The present invention relates to a metaallylsilane-based linker compound, a method for preparing same, and the like. The present invention makes it possible to prepare a nanoprobe in which two or more functional molecules are incorporated in a silica nanoparticle that is modified with the linker compound by means of a one-pot process through a continuous bioorthogonal reaction. The nanoprobe of the present invention can be incorporated in a targeting ligand capable of delivering a drug to a specific location, a fluorescent dye for molecular imaging, a radioactive isotope, a magnetic substance, a drug for treatment, and the like, and thus can be used for in vivo molecular imaging, theranostics, and the like.

Abstract: Provided is a memory device, including a plurality of memory banks. Each of the memory banks includes a memory array and a driver circuit. The driver circuit is coupled to the memory array, arranged to operably write data to the memory array according to write signals. The driver circuit includes a plurality of row driver circuits each coupled to a row of the memory cells. A global driver power circuit coupled to the row driver circuits in the plurality of memory banks to provide a global driver power. Each of the memory banks further includes a local driver power circuit coupled to respective row driver circuits in each of the memory banks to provide a local driver power. The local driver power circuit includes a first P-type MTCMOS coupled to a supply voltage and a control signal, controlled by the control signal to provide a local multi-threshold power signal to the respective row driver circuits.

Abstract: A semiconductor integrated circuit is provided, including: a first switch circuit; a logic circuit, coupled to the first switch circuit, a first floating diffusion point being defined between the first switch circuit and the logic circuit; a second switch circuit, coupled to the logic circuit, a second floating diffusion point being defined between the second switch circuit and the logic circuit; and a voltage holding circuit, coupled to the first floating diffusion point and the second floating diffusion point, and used to adjust the voltages of the floating diffusion points. The voltage holding circuit increases or decreases the voltage values of the first floating diffusion point and the second floating diffusion point. Thereby, the influence of long recovery time on the semiconductor integrated circuit is improved, and the stability is ensured.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer, and first and second internal electrodes configured to be layered in a third direction with the dielectric layer interposed therebetween and having first and second connection portions, respectively, and including first, second, third, fourth, fifth and sixth surfaces; a first external electrode disposed on the fifth surface of the body; and a second external electrode disposed on the fifth surface of the body. The first internal electrode is exposed to the third surface and the fifth surface of the body through the first connection portion, and the second internal electrode is exposed to the fourth surface and the fifth surface of the body through the second connection portion.

Abstract: A multilayer ceramic capacitor includes a body including a first dielectric layer on which a first internal electrode, a first coupling portion, and a second internal electrode are disposed, a second dielectric layer on which a third internal electrode, a second coupling portion, and a fourth internal electrode are disposed, and a third dielectric layer on which a fifth internal electrode or a sixth internal electrode is disposed, and first and second external electrodes connected to the first to sixth internal electrodes, and disposed on both surfaces of the body in the first direction. The first to third dielectric layers are sequentially stacked.

Abstract: A multilayer electronic component includes a body comprising dielectric layers, and first and second internal electrode layers alternately stacked in a stacking direction with respective dielectric layers interposed therebetween. The first internal electrode layer includes first and second internal electrodes arranged with a first spacer interposed therebetween, and the second internal electrode layer includes third and fourth internal electrodes arranged with a second spacer interposed therebetween.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween; and an external electrode, wherein the ceramic body comprises an active portion including a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween to form capacitance and a cover portion formed in upper and lower portions of the active portion, wherein a plurality of internal electrodes in the upper region and the lower region of the active portion is disposed inwardly of an outer side surface of the ceramic body to be spaced apart by a predetermined distance from the body portion, and the plurality of internal electrodes in the central region of the active portion and the internal electrodes having the same polarities are connected to each other via vias.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer, and first and second internal electrodes configured to be layered in a third direction with the dielectric layer interposed therebetween and having first and second connection portions, respectively, and including first, second, third, fourth, fifth and sixth surfaces; a first external electrode disposed on the fifth surface of the body; and a second external electrode disposed on the fifth surface of the body. The first internal electrode is exposed to the third surface and the fifth surface of the body through the first connection portion, and the second internal electrode is exposed to the fourth surface and the fifth surface of the body through the second connection portion.

Abstract: A multilayer ceramic capacitor includes a body including a first dielectric layer on which a first internal electrode, a first coupling portion, and a second internal electrode are disposed, a second dielectric layer on which a third internal electrode, a second coupling portion, and a fourth internal electrode are disposed, and a third dielectric layer on which a fifth internal electrode or a sixth internal electrode is disposed, and first and second external electrodes connected to the first to sixth internal electrodes, and disposed on both surfaces of the body in the first direction. The first to third dielectric layers are sequentially stacked.

Abstract: A multilayer ceramic capacitor includes a body including a first dielectric layer on which a first internal electrode, a first coupling portion, and a second internal electrode are disposed, a second dielectric layer on which a third internal electrode, a second coupling portion, and a fourth internal electrode are disposed, and a third dielectric layer on which a fifth internal electrode or a sixth internal electrode is disposed, and first and second external electrodes connected to the first to sixth internal electrodes, and disposed on both surfaces of the body in the first direction. The first to third dielectric layers are sequentially stacked.

Abstract: A multilayer electronic component includes a body comprising dielectric layers, and first and second internal electrode layers alternately stacked in a stacking direction with respective dielectric layers interposed therebetween. The first internal electrode layer includes first and second internal electrodes arranged with a first spacer interposed therebetween, and the second internal electrode layer includes third and fourth internal electrodes arranged with a second spacer interposed therebetween.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer, and first and second internal electrodes configured to be layered in a third direction with the dielectric layer interposed therebetween and having first and second connection portions, respectively, and including first, second, third, fourth, fifth and sixth surfaces; a first external electrode disposed on the fifth surface of the body; and a second external electrode disposed on the fifth surface of the body. The first internal electrode is exposed to the third surface and the fifth surface of the body through the first connection portion, and the second internal electrode is exposed to the fourth surface and the fifth surface of the body through the second connection portion.

Abstract: A multi-layered ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween; and first and second external electrodes disposed outside of the ceramic body and electrically connected to the first and second internal electrodes, respectively. The first internal electrode is exposed from a first surface of the ceramic body and the second internal electrode is exposed from a second surface opposing the first surface. The first internal electrode has a notch portion disposed inwardly of a portion facing the first surface and, and the second internal electrode has a notch portion disposed inwardly of a portion facing the second surface. Each of the notch portions and a margin portion of the ceramic body in a second direction and in a third direction are provided with a step absorption layer, respectively.

Abstract: A multilayer electronic component includes a body comprising dielectric layers, and first and second internal electrode layers alternately stacked in a stacking direction with respective dielectric layers interposed therebetween. The first internal electrode layer includes first and second internal electrodes arranged with a first spacer interposed therebetween, and the second internal electrode layer includes third and fourth internal electrodes arranged with a second spacer interposed therebetween.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a plurality of dielectric layers stacked therein in a stacking direction; first and second external electrodes disposed externally on the ceramic body; first and second internal electrodes alternately stacked with the plurality of dielectric layers, forming an internal active layer of the ceramic body, and respectively connected to the first and second external electrodes; a dummy layer, including a conductive material and having a mesh shape, disposed in at least one of an upper cover layer or a lower cover layer respectively disposed above or below the internal active layer of the ceramic body in the stacking direction.

Abstract: A multilayer electronic component includes a body comprising dielectric layers, and first and second internal electrode layers alternately stacked in a stacking direction with respective dielectric layers interposed therebetween. The first internal electrode layer includes first and second internal electrodes arranged with a first spacer interposed therebetween, and the second internal electrode layer includes third and fourth internal electrodes arranged with a second spacer interposed therebetween.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer, and first and second internal electrodes configured to be layered in a third direction with the dielectric layer interposed therebetween and having first and second connection portions, respectively, and including first, second, third, fourth, fifth and sixth surfaces; a first external electrode disposed on the fifth surface of the body; and a second external electrode disposed on the fifth surface of the body. The first internal electrode is exposed to the third surface and the fifth surface of the body through the first connection portion, and the second internal electrode is exposed to the fourth surface and the fifth surface of the body through the second connection portion.

Abstract: A multilayer ceramic capacitor includes a body including a first dielectric layer on which a first internal electrode, a first coupling portion, and a second internal electrode are disposed, a second dielectric layer on which a third internal electrode, a second coupling portion, and a fourth internal electrode are disposed, and a third dielectric layer on which a fifth internal electrode or a sixth internal electrode is disposed, and first and second external electrodes connected to the first to sixth internal electrodes, and disposed on both surfaces of the body in the first direction. The first to third dielectric layers are sequentially stacked.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes alternately exposed to first and second outer surfaces with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second outer surfaces of the ceramic body so as to be connected to the first and second internal electrodes, respectively. The first internal electrode has a plurality of first ends connected to the first external electrode and a first recessed region positioned between the plurality of first ends, the first recessed region at least partially filled with a dielectric material. The second internal electrode has a plurality of second ends connected to the second external electrode and a second recessed region positioned between the plurality of second ends, the second recessed region at least partially filled with the dielectric material.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes alternately exposed to first and second outer surfaces with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second outer surfaces of the ceramic body so as to be connected to the first and second internal electrodes, respectively. The first internal electrode has a plurality of first ends connected to the first external electrode and a first recessed region positioned between the plurality of first ends, the first recessed region at least partially filled with a dielectric material. The second internal electrode has a plurality of second ends connected to the second external electrode and a second recessed region positioned between the plurality of second ends, the second recessed region at least partially filled with the dielectric material.