Patents by Inventor Sun-Dong Park

Sun-Dong Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240132639
    Abstract: An olefin-based polymer, a film prepared from the olefin-based polymer, and preparation methods for manufacturing the olefin-based polymer and the film are disclosed. The olefin-based polymer has excellent processability, and a film prepared from the olefin-based polymer, particularly, a linear low density polyethylene film has excellent mechanical strength, in particular, drop impact strength.
    Type: Application
    Filed: December 2, 2021
    Publication date: April 25, 2024
    Applicant: HANWHA SOLUTIONS CORPORATION
    Inventors: Jisong JO, Jeong Hynn PARK, Sun Dong KIM, Munhee LEE, Ui Gap JOUNG
  • Publication number: 20240083384
    Abstract: A vehicle seat reinforcement device includes a leg portion mounted on a floor panel, a seat cushion frame slidably mounted on the leg portion, and a load reinforcing structure connected between the leg portion and the seat cushion frame, wherein when a seat belt anchorage load is transferred to the seat cushion frame, the seat cushion frame is locked to the leg portion by the load reinforcing structure.
    Type: Application
    Filed: February 3, 2023
    Publication date: March 14, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, Daechang Seat Co.,LTD-Dongtan, Hyundai Transys Inc.
    Inventors: Sang Soo LEE, Chan Ho JUNG, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Deok Soo LIM, Sang Do PARK, In Sun BAEK, Sin Chan YANG, Chan Ki CHO, Myung Soo LEE, Jae Yong JANG, Jun Sik HWANG, Ho Sung KANG, Hae Dong KWAK, Hyun Tak KO
  • Patent number: 5993595
    Abstract: An ozone asher includes: a chamber having a closed space isolated from an atmosphere, and an opening through which the semiconductor substrate to be etched is inserted and withdrawn from the chamber; an upper cover forming an upper portion of the chamber, having ozone injection holes for supplying ozone into the chamber; a plurality of holders for holding the semiconductor substrate inserted in the chamber through the opening; a pedestal provided to be raised and lowered in the chamber and supporting the semiconductor substrate during the whole procedure; vacuum means provided at the pedestal for drawing and holding the semiconductor substrate to the pedestal; heating means for the semiconductor substrate provided at the pedestal; means for raising and lowering the pedestal and the heating means; means for keeping a gap between the pedestal and the upper cover during the elevating of the semiconductor substrate; and a slit door for opening and closing the opening of the chamber selectively.
    Type: Grant
    Filed: October 10, 1996
    Date of Patent: November 30, 1999
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventors: Koon-Ho Bae, Sang-Yun Lee, Hyung-Chang Kang, Cheong-Dai Lee, Roh-Young Sung, Sun-Dong Park, Jong-Hyun Park