Patents by Inventor Sun-Gyu Kim

Sun-Gyu Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154147
    Abstract: An apparatus for manufacturing a pouch-type rechargeable battery includes a preforming portion forming a folding groove in a portion of a protrusion of the pouch-type rechargeable battery, a folding portion disposed on a rear end of the preforming portion and folding the protrusion along the folding groove, a rolling portion disposed on a rear end of the folding portion and pressing the folded protrusion, and a pressing portion disposed on a rear end of the rolling portion and fixing the folded protrusion.
    Type: Application
    Filed: November 2, 2023
    Publication date: May 9, 2024
    Inventors: Seung Won Choi, Dong Ju Kim, Sun Min Park, Sang Mo Kim, Jae Gyu Byun, Won Je Oh, Taek Eon Jeong, Ju Won Hwang
  • Patent number: 11975037
    Abstract: The present specification relates to a composition for preventing, alleviating or treating burnout syndrome, containing a natural extract as an active ingredient. According to one aspect of the present invention, the composition contains a ginseng fruit extract, and thus is useful for preventing, treating and alleviating burnout syndrome. In addition, according to one aspect of the present invention, the composition further contains ginseng fruit and one or more selected from the group consisting of red ginseng, Angelica gigas, Cornus officinalis, Cervi parvum corni, and Nigella sativa, so as to maximize the synergistic effect among two or more ingredients, thereby exhibiting excellent effects on the prevention, treatment and alleviation of burnout syndrome. Therefore, there is an advantage of making individuals and society mentally and physically healthy since burnout syndrome can be prevented, treated and alleviated, by using the composition of the present invention.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: May 7, 2024
    Assignee: AMOREPACIFIC CORPORATION
    Inventors: Su-Hwan Kim, Chan-Woong Park, Sun Mi Kim, Juewon Kim, Byung Gyu Kim, Wan Gi Kim, Sang Jun Lee
  • Publication number: 20240137821
    Abstract: Disclosed is a technique for switching from a master node to a secondary node in a communication system. A method of a first communication node may comprise: adding the first communication node as a primary secondary cell (PSCell) to a second communication node through dual connectivity (DC); generating a first user plane path for smart dynamic switching (SDS) and a first instance for supporting the first user plane path according to a request from the second communication node; transmitting information on the first user plane path and the first instance to a terminal; receiving user data based on the first user plane path from the terminal as the first instance; and transmitting the user data to a core network using the first user plane path.
    Type: Application
    Filed: October 22, 2023
    Publication date: April 25, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Soon Gi PARK, Young-Jo KO, IL GYU KIM, Jung Im KIM, Jun Sik KIM, Sung Cheol CHANG, Sun Mi JUN, Yong Seouk CHOI
  • Publication number: 20240124399
    Abstract: The present invention relates to a novel indole derivative and a use thereof. The novel indole derivative according to the present invention traps methylglyoxal (MGO), which is a main precursor of advanced glycation end products, and thus can be effectively used for preventing, improving, or treating diseases related to advanced glycation end products.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 18, 2024
    Inventors: Seung Yong SEO, San Ha LEE, Jung Eun LEE, Joon Seong HUR, Sang Il KWON, Sun Yeou KIM, Seong Min HONG, Min Cheol KANG, Myoung Gyu PARK, Eun Joo LEE
  • Publication number: 20240124404
    Abstract: The present invention relates to a composition for preventing, improving, or treating diseases related to advanced glycation end products, comprising an indole derivative or a pharmaceutically acceptable salt thereof. Specifically, the composition of the present invention possesses the effect of trapping methylglyoxal (MGO), which is a main precursor of advanced glycation end products, and thus can be effectively used for preventing, improving, or treating diseases related to advanced glycation end products.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 18, 2024
    Inventors: Seung Yong SEO, San Ha LEE, Jung Eun LEE, Joon Seong HUR, Sang Il KWON, Sun Yeou KIM, Seong Min HONG, Min Cheol KANG, Myoung Gyu PARK, Eun Joo LEE
  • Patent number: 11926226
    Abstract: A vehicle body includes a floor member, a support member coupled to an upper surface of the floor member, and a frame member coupled to an upper end of the support member to define a space between the floor member and the frame member, wherein the space is configured to house an item. The item may include a high-voltage battery.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: March 12, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Seok Ju Gim, Tae Gyu Park, Ho Yeon Kim, Sun Hyung Cho, Chul Hee Heo, Ji Ae Yong
  • Patent number: 11148185
    Abstract: A method of molding a back cover of a display and a die for molding the back cover are provided. More particularly, a method of finishing a side of a display by using a back cover is provided. A die for molding a back cover of a display includes: an upper die in which a lower inner side thereof has a fan shape with a certain curvature, and an inner side of the fan shape has a flat shape; a first lower die which is disposed below the upper die and in which an upper inner side thereof has a shape corresponding to the fan shape formed in the upper die, and an inner side of the fan shape is dent downward by a certain length; and a second lower die in which an upper portion thereof has a flat shape, and an end upper portion thereof protrudes toward the first lower die by a certain length.
    Type: Grant
    Filed: June 18, 2017
    Date of Patent: October 19, 2021
    Assignee: OHSUNG DISPLAY CO., LTD.
    Inventors: Sun Gyu Kim, Sa Sung Kim
  • Patent number: 10811628
    Abstract: Provided is a press forming method for a composite material. A press forming method for a composite material including an upper metal member, a resin member, and a lower metal member, and including: producing the lower metal member having first and second coating films respectively bonded to upper and lower surfaces thereof; producing the composite material including the upper metal member, a first hot melt member, the resin member, a second hot melt member, and the lower metal member; cutting an area spaced inward a predetermined distance from a lengthwise edge of the composite material by using a T-cutter, such that only the lower metal member remains; removing the upper metal member, the first hot melt member, the resin member, and the second hot melt member that are located outside the cut area; and folding the lower metal member by an angle of 180 degrees by using a hemming die.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: October 20, 2020
    Assignee: OHSUNG DISPLAY CO., LTD.
    Inventors: Hae Chan Park, Sun Gyu Kim
  • Publication number: 20200136084
    Abstract: Provided is a press forming method for a composite material. A press forming method for a composite material including an upper metal member, a resin member, and a lower metal member, and including: producing the lower metal member having first and second coating films respectively bonded to upper and lower surfaces thereof; producing the composite material including the upper metal member, a first hot melt member, the resin member, a second hot melt member, and the lower metal member; cutting an area spaced inward a predetermined distance from a lengthwise edge of the composite material by using a T-cutter, such that only the lower metal member remains; removing the upper metal member, the first hot melt member, the resin member, and the second hot melt member that are located outside the cut area; and folding the lower metal member by an angle of 180 degrees by using a hemming die.
    Type: Application
    Filed: March 8, 2019
    Publication date: April 30, 2020
    Inventors: Hae Chan PARK, Sun Gyu KIM
  • Publication number: 20180214922
    Abstract: A method of molding a back cover of a display and a die for molding the back cover are provided. More particularly, a method of finishing a side of a display by using a back cover is provided. A die for molding a back cover of a display includes: an upper die in which a lower inner side thereof has a fan shape with a certain curvature, and an inner side of the fan shape has a flat shape; a first lower die which is disposed below the upper die and in which an upper inner side thereof has a shape corresponding to the fan shape formed in the upper die, and an inner side of the fan shape is dent downward by a certain length; and a second lower die in which an upper portion thereof has a flat shape, and an end upper portion thereof protrudes toward the first lower die by a certain length.
    Type: Application
    Filed: June 18, 2017
    Publication date: August 2, 2018
    Inventors: Sun Gyu KIM, Sa Sung KIM
  • Patent number: 8935583
    Abstract: A method to perform component testing by supplying test patterns to a serial input pin coupled to an IEEE 1149.6 boundary-scan cell that is associated with an IEEE 1149.6 test receiver. The test receiver is configured to operate in a scan test mode. The output from the test receiver circuit is coupled to a logic block to be scan tested. The output from the logic block is coupled to a serial output pin on the integrated circuit during scan test mode. High performance integrated circuits can use SerDes pins in a scan test mode to be scan tested without impacting mission critical signals.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: January 13, 2015
    Assignee: Cisco Technology, Inc.
    Inventors: Hongshin Jun, William Eklow, Sun-Gyu Kim
  • Publication number: 20130318410
    Abstract: A method to perform component testing by supplying test patterns to a serial input pin coupled to an IEEE 1149.6 boundary-scan cell that is associated with an IEEE 1149.6 test receiver. The test receiver is configured to operate in a scan test mode. The output from the test receiver circuit is coupled to a logic block to be scan tested. The output from the logic block is coupled to a serial output pin on the integrated circuit during scan test mode. High performance integrated circuits can use SerDes pins in a scan test mode to be scan tested without impacting mission critical signals.
    Type: Application
    Filed: May 22, 2012
    Publication date: November 28, 2013
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Hongshin Jun, William Eklow, Sun-Gyu Kim