Patents by Inventor Sun-Gyu Kim

Sun-Gyu Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250135565
    Abstract: A tap processing method for an aluminum composite material (ACM) panel includes an inner burring operation of burring the inner skin of the ACM panel so that an inner burr formed in the inner skin extends toward the outer skin while compressing the core layer, an outer burring operation of burring the outer skin of the ACM panel so that the outer burr formed in the outer skin extends toward the inner skin while compressing the core layer and the inner burr and the outer burr are also continuously connected to each other, and a tapping operation of forming a continuous screw thread in the inner burr and the outer burr continuously connected to each other. Burring work in the inner burring operation and the outer burring operation is performed by a scrapless burring punch (SBP).
    Type: Application
    Filed: November 1, 2023
    Publication date: May 1, 2025
    Applicant: OHSUNG D&E CO., LTD.
    Inventors: Young Dae CHOI, Sun Gyu KIM
  • Patent number: 11148185
    Abstract: A method of molding a back cover of a display and a die for molding the back cover are provided. More particularly, a method of finishing a side of a display by using a back cover is provided. A die for molding a back cover of a display includes: an upper die in which a lower inner side thereof has a fan shape with a certain curvature, and an inner side of the fan shape has a flat shape; a first lower die which is disposed below the upper die and in which an upper inner side thereof has a shape corresponding to the fan shape formed in the upper die, and an inner side of the fan shape is dent downward by a certain length; and a second lower die in which an upper portion thereof has a flat shape, and an end upper portion thereof protrudes toward the first lower die by a certain length.
    Type: Grant
    Filed: June 18, 2017
    Date of Patent: October 19, 2021
    Assignee: OHSUNG DISPLAY CO., LTD.
    Inventors: Sun Gyu Kim, Sa Sung Kim
  • Patent number: 10811628
    Abstract: Provided is a press forming method for a composite material. A press forming method for a composite material including an upper metal member, a resin member, and a lower metal member, and including: producing the lower metal member having first and second coating films respectively bonded to upper and lower surfaces thereof; producing the composite material including the upper metal member, a first hot melt member, the resin member, a second hot melt member, and the lower metal member; cutting an area spaced inward a predetermined distance from a lengthwise edge of the composite material by using a T-cutter, such that only the lower metal member remains; removing the upper metal member, the first hot melt member, the resin member, and the second hot melt member that are located outside the cut area; and folding the lower metal member by an angle of 180 degrees by using a hemming die.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: October 20, 2020
    Assignee: OHSUNG DISPLAY CO., LTD.
    Inventors: Hae Chan Park, Sun Gyu Kim
  • Publication number: 20200136084
    Abstract: Provided is a press forming method for a composite material. A press forming method for a composite material including an upper metal member, a resin member, and a lower metal member, and including: producing the lower metal member having first and second coating films respectively bonded to upper and lower surfaces thereof; producing the composite material including the upper metal member, a first hot melt member, the resin member, a second hot melt member, and the lower metal member; cutting an area spaced inward a predetermined distance from a lengthwise edge of the composite material by using a T-cutter, such that only the lower metal member remains; removing the upper metal member, the first hot melt member, the resin member, and the second hot melt member that are located outside the cut area; and folding the lower metal member by an angle of 180 degrees by using a hemming die.
    Type: Application
    Filed: March 8, 2019
    Publication date: April 30, 2020
    Inventors: Hae Chan PARK, Sun Gyu KIM
  • Publication number: 20180214922
    Abstract: A method of molding a back cover of a display and a die for molding the back cover are provided. More particularly, a method of finishing a side of a display by using a back cover is provided. A die for molding a back cover of a display includes: an upper die in which a lower inner side thereof has a fan shape with a certain curvature, and an inner side of the fan shape has a flat shape; a first lower die which is disposed below the upper die and in which an upper inner side thereof has a shape corresponding to the fan shape formed in the upper die, and an inner side of the fan shape is dent downward by a certain length; and a second lower die in which an upper portion thereof has a flat shape, and an end upper portion thereof protrudes toward the first lower die by a certain length.
    Type: Application
    Filed: June 18, 2017
    Publication date: August 2, 2018
    Inventors: Sun Gyu KIM, Sa Sung KIM
  • Patent number: 8935583
    Abstract: A method to perform component testing by supplying test patterns to a serial input pin coupled to an IEEE 1149.6 boundary-scan cell that is associated with an IEEE 1149.6 test receiver. The test receiver is configured to operate in a scan test mode. The output from the test receiver circuit is coupled to a logic block to be scan tested. The output from the logic block is coupled to a serial output pin on the integrated circuit during scan test mode. High performance integrated circuits can use SerDes pins in a scan test mode to be scan tested without impacting mission critical signals.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: January 13, 2015
    Assignee: Cisco Technology, Inc.
    Inventors: Hongshin Jun, William Eklow, Sun-Gyu Kim
  • Publication number: 20130318410
    Abstract: A method to perform component testing by supplying test patterns to a serial input pin coupled to an IEEE 1149.6 boundary-scan cell that is associated with an IEEE 1149.6 test receiver. The test receiver is configured to operate in a scan test mode. The output from the test receiver circuit is coupled to a logic block to be scan tested. The output from the logic block is coupled to a serial output pin on the integrated circuit during scan test mode. High performance integrated circuits can use SerDes pins in a scan test mode to be scan tested without impacting mission critical signals.
    Type: Application
    Filed: May 22, 2012
    Publication date: November 28, 2013
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Hongshin Jun, William Eklow, Sun-Gyu Kim