Patents by Inventor Sun Hee Lehmann

Sun Hee Lehmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Disposable insole pads and use thereof
    Patent number: 11375771
    Abstract: Disposable insole pads and use thereof are disclosed. The disposable insole pads are multilayer structures comprising a topsheet and a pressure sensitive adhesive, and optionally a backsheet, silicone coating and liner layers. The pressure sensitive adhesive layer allows the disposable insole pads to be positioned, repositioned and removed, making them well suited for daily use and disposal.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: July 5, 2022
    Assignee: HENKEL AG & CO. KGaA
    Inventors: Sun Hee Lehmann, Yuhong Hu, Cynthia Cain, Michael Harwell, Joanne Georgiana
  • Disposable Insole Pads and Use Thereof
    Publication number: 20190343228
    Abstract: Disposable insole pads and use thereof are disclosed. The disposable insole pads are multilayer structures comprising a topsheet and a pressure sensitive adhesive, and optionally a backsheet, silicone coating and liner layers. The pressure sensitive adhesive layer allows the disposable insole pads to be positioned, repositioned and removed, making them well suited for daily use and disposal.
    Type: Application
    Filed: July 24, 2019
    Publication date: November 14, 2019
    Inventors: Sun Hee LEHMANN, Yuhong HU, Cynthia CAIN, Michael HARWELL, Joanne GEORGIANA
  • Conductive materials with electrical stability and good impact resistance for use in electronics devices
    Patent number: 7108806
    Abstract: A composition that comprises a) an admixing of at least one epoxy resin and aliphatic amine wherein the ratio of epoxy function group/amine is greater than 1; b) a conductive filler; c) one or more corrosion inhibitors, oxygen scavengers or both; d) imidazole as a curing agent/catalyst; and e) optionally other additives such as organic solvents, flow additives, adhesion promoters and rheology modifiers. The reaction of epoxy and aliphatic amine with excess epoxy functionality results in a flexible resin with remaining active epoxy groups. The compositions exhibit improved electrical stability and impact resistance over other conductive adhesive compositions that do not comprise the admixture.
    Type: Grant
    Filed: February 28, 2003
    Date of Patent: September 19, 2006
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Yue Xiao, Sun Hee Lehmann, Chih-Min Cheng, Gunther Dreezen
  • Conductive materials with electrical stability and good impact resistance for use in electronics devices
    Publication number: 20040169162
    Abstract: A composition that comprises a) an admixing of at least one epoxy resin and aliphatic amine wherein the ratio of epoxy function group/amine is greater than 1; b) a conductive filler; c) one or more corrosion inhibitors, oxygen scavengers or both; d) imidazole as a curing agent/catalyst; and e) optionally other additives such as organic solvents, flow additives, adhesion promoters and rheology modifiers. The reaction of epoxy and aliphatic amine with excess epoxy functionality results in a flexible resin with remaining active epoxy groups. The compositions exhibit improved electrical stability and impact resistance over other conductive adhesive compositions that do not comprise the admixture.
    Type: Application
    Filed: February 28, 2003
    Publication date: September 2, 2004
    Inventors: Yue Xiao, Sun Hee Lehmann, Chih-Min Cheng, Gunther Dreezen