Abstract: An embodiment solid electrolyte includes a first compound and a second compound. The first compound is represented by a first chemical formula Li7-aPS6-a(X11-bX2b)a, wherein X1 and X2 are the same or different and each represents F, Cl, Br, or I, and wherein 0<a?2 and 0<b<1, and the second compound is represented by a second chemical formula Li7-cP1-2dMdS6-c-3d(X11-eX2e)c, wherein X1 and X2 are the same or different and each represents F, Cl, Br, or I, wherein M represents Ge, Si, Sn, or any combination thereof, and wherein 0<c?2, 0<d<0.5, and 0<e<1.

Abstract: Provided are a substrate transporting apparatus capable of preventing an increase in temperature of a transporting robot by installing a cooling plate around the transporting robot, and a substrate treating system including the same. The substrate transporting apparatus includes a transporting unit for transporting a substrate; and a cooling plate for controlling a temperature of the transporting unit, wherein the cooling plate is spaced apart from a side surface of the transporting unit and installed as a side wall, or is installed in close contact with the side surface of the transporting unit.

Abstract: Provided are a substrate transporting apparatus capable of preventing an increase in temperature of a transporting robot by installing a cooling plate around the transporting robot, and a substrate treating system including the same. The substrate transporting apparatus includes a transporting unit for transporting a substrate; and a cooling plate for controlling a temperature of the transporting unit, wherein the cooling plate is spaced apart from a side surface of the transporting unit and installed as a side wall, or is installed in close contact with the side surface of the transporting unit.

Abstract: Provided are a substrate transporting apparatus capable of preventing an increase in temperature of a transporting robot by installing a cooling plate around the transporting robot, and a substrate treating system including the same. The substrate transporting apparatus includes a transporting unit for transporting a substrate; and a cooling plate for controlling a temperature of the transporting unit, wherein the cooling plate is spaced apart from a side surface of the transporting unit and installed as a side wall, or is installed in close contact with the side surface of the transporting unit.

Abstract: A semiconductor package comprising a die paddle defining multiple corners and opposed first and second surfaces. At least one set of leads extends at least partially about the die paddle in spaced relation thereto. Each of the leads has opposed first and second surfaces. Attached to and extending from one of the corners of the die paddle is at least one tie bar which itself has opposed first and second surfaces and at least one aperture disposed therein and extending between the first and second surfaces thereof. Attached to the first surface of the die paddle is a semiconductor die which is electrically connected to at least one of the leads. A package body at least partially covers the die paddle, the leads, the tie bar and the semiconductor die such that the second surfaces of the leads are exposed in and substantially flush with a common exterior surface of the package body, and a portion of the package body extends through the aperture of the tie bar.

Abstract: Embodiments of a semiconductor package and manufacturing methods therefor are disclose. An exemplary package comprises an optical semiconductor chip having input and output pads on an upper surface thereof. A transparent plate is bonded to the chip via a dam located within the input and output pads. The chip is mounted within an aperture through a planar circuit board. Wires electrically connect the input and output pads to circuit patterns of the circuit board. An encapsulant fills the aperture, and supports the chip therein. Interconnects are formed on the lower surface of the circuit board. An alternative embodiment omits the dam and the wires and employs a flip chip style connection between the chip and circuit patterns on the transparent plate. The transparent is supported by and attached to the upper surface of the planar circuit board.

Abstract: Provided with a method of manufacturing a ball grid array semiconductor package using a flexible circuit board strip, which is directed to prevent minute conductive traces in the outer part of a circuit pattern formed in the flexible circuit board and thus minimize the short-circuits by forming notches on the flexible circuit board in the vicinity of the lower side ends of a resin encapsulant section by use of a punch, and pressing down the resin encapsulant section with a singulation tool to remove the carrier frame and separate the ball grid array semiconductor packages in the piece.

Abstract: A wiring structure of a semiconductor device buries an aperture, for example, a contact hole or via hole. The wiring structure includes a semiconductor substrate, an insulating layer formed on the semiconductor substrate and having an aperture formed therein, a diffusion barrier film formed on the inner sidewalls of the aperture and which has a smooth surface without having grain boundaries made of a refractory metal or refractory metal compound, and a metal layer formed on the diffusion barrier film. The metal layer formed on the smooth sidewalls of the diffusion barrier film is made of a uniformly and continuously formed aluminum film having an excellent step coverage. Accordingly, the method for forming the wiring structure effectively buries a contact hole having a high aspect ratio and enhances the reliability of a manufactured device.

Abstract: A method for reproducing a PCB strip for semiconductor packages, wherein a poor quality PCB unit included in the PCB strip is replaced with a normal quality one, thereby achieving a reduction in the amount of package materials used and an improvement in the process efficiency. The invention also provides a method for fabricating semiconductor packages using the PCB strip reproduction method. A desired portion of a poor quality PCB unit included in a PCB strip is cut out in such a manner that a cutting opening having a peripheral edge extending along the singulation line of the poor quality PCB unit or along a region defined between the singulation line and anti-bending slots of the poor quality PCB unit. In the cutting opening, a separate good quality PCB unit member having the same shape and size as the cutting opening is then fitted. Thus, it is possible to simply and efficiently replace PCB units determined to be of poor quality with separate good quality PCB unit members, respectively.

Abstract: A printed circuit board (PCB) having an epoxy barrier disposed around its throughout slot in a semiconductor chip mounting region, and a BGA semiconductor package using such a PCB, thereby exhibiting a high moisture discharge characteristic. The epoxy barrier includes a copper layer and a solder resist layer both disposed around the throughout slot and is defined by a groove which is disposed around the throughout slot while spacing apart from the periphery of the throughout slot by a desired distance. Alternatively, the epoxy barrier includes a solder resist layer formed to a desired width around the throughout slot on the uppermost layer laminated on the PCB. By virtue of the epoxy barrier, the throughout slot is not closed by epoxy resin coated over the PCB. As a result, it is possible to externally discharge moisture which expands in the PCB upon carrying out a series of processes for the fabrication of the package at a high temperature or mounting the package on a mother board.