Patents by Inventor Sun Ik Heo

Sun Ik Heo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11861281
    Abstract: A computer-readable storage medium that stores computer program code which, when executed by one or more processors, causes the one or more processors to execute tools for designing an integrated circuit (IC). The tools include a placing and routing tool that generates layout data and wire data corresponding to a net included in the IC by placing and routing standard cells defining the IC, the wire data including physical information of a wire implementing the net, and a timing analysis tool that calculates a wire delay with respect to the wire corresponding to the net, based on the physical information, updates the wire delay based on process variation of the wire, and calculates a timing slack by using the updated wire delay.
    Type: Grant
    Filed: October 17, 2022
    Date of Patent: January 2, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-pil Lee, Bong-il Park, Moon-su Kim, Sun-ik Heo
  • Publication number: 20230325571
    Abstract: A cell library is provided. The cell library is stored in a computer-readable storage medium. The cell library is configured to store: first delay information of a standard cell according to a threshold voltage of a transistor included in the standard cell; and second delay information of the standard cell according to mobility of the transistor included in the standard cell.
    Type: Application
    Filed: January 4, 2023
    Publication date: October 12, 2023
    Inventors: Juyeon Kim, Jaehoon Kim, Sun Ik Heo, Jun Seomun, Hyun-Seung Seo, Chul Rim, Chang Ho Han
  • Publication number: 20230037826
    Abstract: A computer-readable storage medium that stores computer program code which, when executed by one or more processors, causes the one or more processors to execute tools for designing an integrated circuit (IC). The tools include a placing and routing tool that generates layout data and wire data corresponding to a net included in the IC by placing and routing standard cells defining the IC, the wire data including physical information of a wire implementing the net, and a timing analysis tool that calculates a wire delay with respect to the wire corresponding to the net, based on the physical information, updates the wire delay based on process variation of the wire, and calculates a timing slack by using the updated wire delay.
    Type: Application
    Filed: October 17, 2022
    Publication date: February 9, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-pil Lee, Bong-il Park, Moon-su Kim, Sun-ik Heo
  • Patent number: 11475195
    Abstract: A method includes performing, using a processor, a synthesis operation to generate a netlist from input data about an integrated circuit, placing and routing, using the one processor, standard cells defining the integrated circuit using the netlist, to generate layout data and wire data, extracting, using the processor, parasitic components from the layout data, and performing, using the processor, timing analysis of the integrated circuit according to timing constraints, based on the layout data and the wire data.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: October 18, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-pil Lee, Bong-il Park, Moon-su Kim, Sun-ik Heo
  • Publication number: 20210173991
    Abstract: A method includes performing, using a processor, a synthesis operation to generate a netlist from input data about an integrated circuit, placing and routing, using the one processor, standard cells defining the integrated circuit using the netlist, to generate layout data and wire data, extracting, using the processor, parasitic components from the layout data, and performing, using the processor, timing analysis of the integrated circuit according to timing constraints, based on the layout data and the wire data.
    Type: Application
    Filed: January 25, 2021
    Publication date: June 10, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-pil Lee, Bong-il Park, Moon-su Kim, Sun-ik Heo
  • Patent number: 10902168
    Abstract: A computer-implemented method and a computing system for designing an integrated circuit are provided. The method includes generating wire data corresponding to a net included in an integrated circuit, the wire data including metal layer information of a wire corresponding to the net and physical information of the wire, performing timing analysis using the physical information of the wire included in the wire data to generate timing analysis data, and changing a layout of the integrated circuit according to the timing analysis data.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: January 26, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-pil Lee, Bong-il Park, Moon-su Kim, Sun-ik Heo
  • Patent number: 10599130
    Abstract: A method of manufacturing an integrated circuit (IC) including instances of standard cells includes arranging a first instance and arranging a second instance adjacent to the first instance. The second instance has a front-end layer pattern corresponding to a context group of the first instance. The context group includes information about front-end layer patterns of instances, the front-end layer patterns causing a same local layout effect (LLE) on the first instance and arranged adjacent to the first instance.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: March 24, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wootae Kim, Hyung-Ock Kim, Jaehoon Kim, Naya Ha, Ki-Ok Kim, Eunbyeol Kim, Jung Yun Choi, Sun Ik Heo
  • Publication number: 20180314771
    Abstract: A computer-implemented method and a computing system for designing an integrated circuit are provided. The method includes generating wire data corresponding to a net included in an integrated circuit, the wire data including metal layer information of a wire corresponding to the net and physical information of the wire, performing timing analysis using the physical information of the wire included in the wire data to generate timing analysis data, and changing a layout of the integrated circuit according to the timing analysis data.
    Type: Application
    Filed: January 4, 2018
    Publication date: November 1, 2018
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-pil Lee, Bong-il Park, Moon-su Kim, Sun-ik Heo
  • Publication number: 20180210421
    Abstract: A method of manufacturing an integrated circuit (IC) including instances of standard cells includes arranging a first instance and arranging a second instance adjacent to the first instance. The second instance has a front-end layer pattern corresponding to a context group of the first instance. The context group includes information about front-end layer patterns of instances, the front-end layer patterns causing a same local layout effect (LLE) on the first instance and arranged adjacent to the first instance.
    Type: Application
    Filed: January 11, 2018
    Publication date: July 26, 2018
    Inventors: WOOTAE KIM, Hyung-Ock Kim, Jaehoon Kim, Naya Ha, Ki-Ok Kim, Eunbyeol Kim, Jung Yun Choi, Sun Ik Heo