Abstract: A spinner which distributes a photoresist on a wafer in a semiconductor device fabrication apparatus includes a rotation-plate vacuum chuck which holds a wafer, a driving motor which rotates the chuck and a temperature controller assembly. The temperature controller assembly maintains a temperature distribution along the chuck within a predetermined temperature-distribution range. The temperature controller assembly includes a non-contact thermometer, a non-contact variable heater, and a heat regulator. By controlling the temperature in the chuck, a photoresist layer can be coated on a wafer with more uniform thickness than if the temperature were not controlled.