Abstract: Disclosed is a semiconductor device which includes a substrate, a vertical pattern including a semiconductor region and extending in a direction perpendicular to one surface of the substrate, and a word line disposed in contact with a side surface of the vertical pattern and extending in a direction parallel to the one surface of the substrate. The word line may include a first sub-word line disposed adjacent to the substrate, a second sub-word line located above the first sub-word line, and a third sub-word line located above the second sub-word line.

Abstract: There are proposed a stack type semiconductor device and a method of fabricating and testing the same. A stack type semiconductor device according to an embodiment of the present invention includes a plurality of contact pads externally exposed, a via array electrically connected to the contact pads, a semiconductor substrate configured to have vias, forming the via array, electrically conductive with each other or insulated from each other, and a bias pad configured to supply a bias to the semiconductor substrate, wherein the semiconductor substrate may be subject to back-grinding.

Abstract: There are proposed a stack type semiconductor device and a method of fabricating and testing the same. A stack type semiconductor device according to an embodiment of the present invention includes a plurality of contact pads externally exposed, a via array electrically connected to the contact pads, a semiconductor substrate configured to have vias, forming the via array, electrically conductive with each other or insulated from each other, and a bias pad configured to supply a bias to the semiconductor substrate, wherein the semiconductor substrate may be subject to back-grinding.

Abstract: A stack type semiconductor device may include a first type well formed at a first height from a bottom of a semiconductor substrate; second type doping regions formed within the first type well at bottoms of regions where vias are expected to be formed; and a first type doping region formed within the first type well at a bottom of a region where bias contacts are expected to be formed. The stack type semiconductor device comprises the vias connected to the second type doping regions; the bias contacts connected to the first type doping region; contact pads electrically connected to the vias; and bias pads electrically connected to the bias contacts.

Abstract: There are proposed a stack type semiconductor device and a method of fabricating and testing the same. A stack type semiconductor device according to an embodiment of the present invention includes a plurality of contact pads externally exposed, a via array electrically connected to the contact pads, a semiconductor substrate configured to have vias, forming the via array, electrically conductive with each other or insulated from each other, and a bias pad configured to supply a bias to the semiconductor substrate, wherein the semiconductor substrate may be subject to back-grinding.

Abstract: A refresh characteristic test circuit is provided, in a recessed semiconductor device, that is capable of verifying whether a refresh failure is caused by the neighbor/passing gate effect or not and a method for testing the refresh characteristic. The refresh characteristic test circuit includes a select signal generating unit for receiving first address signals and a test mode signal and generate select signals to select cell blocks, a main word line signal generating unit for receiving second address signals and the test mode signal and generate main word lines signals to select main word lines of the selected cell block, and a sub word line signal generating unit for receiving third address signals and the test mode signal and enable sub word lines of the selected main word line.

Abstract: A refresh characteristic test circuit is provided, in a recessed semiconductor device, that is capable of verifying whether a refresh failure is caused by the neighbor/passing gate effect or not and a method for testing the refresh characteristic. The refresh characteristic test circuit includes a select signal generating unit for receiving first address signals and a test mode signal and generate select signals to select cell blocks, a main word line signal generating unit for receiving second address signals and the test mode signal and generate main word lines signals to select main word lines of the selected cell block, and a sub word line signal generating unit for receiving third address signals and the test mode signal and enable sub word lines of the selected main word line.