Abstract: The method for forming a fine pattern of a semiconductor device includes depositing a photoresist film over a semiconductor substrate having an underlying layer, performing a first exposure process using a first exposure mask to form a first photoresist pattern, the first exposure mask defining a first and a second exposure patterns, the first exposure pattern finer than the second exposure pattern, depositing a photoresist film over an entire surface of the resultant including the first photoresist pattern, performing a second exposure process using a second exposure mask to form a second photoresist pattern, the second exposure mask defining a third and a fourth exposure patterns, the third exposure pattern finer than the fourth exposure pattern and disposed between the first exposure patterns, the fourth exposure pattern overlapped with a portion of the second exposure pattern, and patterning the underlying layer using the first and the second photoresist patterns.