Abstract: A photonic radiator device forming a photonic phased array antenna includes a light waveguide including a waveguide clad and a waveguide core using a semiconductor material, and a grating periodically formed an upper or lower part of the light waveguide. The photonic radiator device receives an input light wave in a direction of the grating and the light waveguide and radiates an output light wave to a space by using scattering from the grating.

Abstract: A photonic radiator device forming a photonic phased array antenna includes a light waveguide including a waveguide clad and a waveguide core using a semiconductor material, and a grating periodically formed an upper or lower part of the light waveguide. The photonic radiator device receives an input light wave in a direction of the grating and the light waveguide and radiates an output light wave to a space by using scattering from the grating.

Abstract: Disclosed is a device which constitutes a photonic phased array antenna. The device includes at least one light source, an optical power distributor configured to distribute a light wave generating from the light source, a phase controller configured a phase of the light wave, and a light wave radiator configured to radiate the light wave into a space based on the controlled phase. Optical waveguides are connected between the light source and the optical power distributor, between the optical power distributor and the phase controller and between the phase controller and the light wave radiator, respectively.

Abstract: Disclosed is a device which constitutes a photonic phased array antenna. The device includes at least one light source, an optical power distributor configured to distribute a light wave generating from the light source, a phase controller configured to a phase of the light wave, and a light wave radiator configured to radiate the light wave into a space based on the controlled phase. Optical waveguides are connected between the light source and the optical power distributer, between the optical power distributor and the phase controller and between the phase controller and the light wave radiator, respectively.

Abstract: A chip packaging method using a hydrophobic surface includes forming superhydrophobic surfaces forming hydrophilic surfaces on predetermined positions of the superhydrophobic surfaces formed on the one of a first chip or the first board and the one of a second chip or a second board, respectively, generating liquid metal balls on the hydrophilic surfaces formed on the one of the first chip or the first board and the one of the second chip or the second board, respectively, and packaging the one of the first chip or the first board and the one of the second chip or the second board by combing the liquid metal ball of the one of the first chip or the first board and the liquid metal ball of the one of the second chip or the second board with each other.

Abstract: A waveguide of a 3D interconnection structure and an optical data bus system of a 3D interconnection structure using the same are provided. The waveguide includes a main waveguide which is formed in a predetermined direction and at least one branch waveguide which connects to the main waveguide to form a predetermined angle, wherein the at least one branch waveguide branches an optical signal, which is propagated in the main waveguide, at a predetermined rate.

Abstract: A structure of an optical grating coupler for tuning the center wavelength of signals which are propagated to a waveguide by changing the effective refractive index of the optical grating coupler is provided. The optical grating coupler includes a region for changing the effective refractive index of the optical grating coupler, which is included in the inside or outside of the optical grating coupler. The region receives a signal for changing the effective refractive index of the optical grating coupler.

Abstract: A chip packaging method using a hydrophobic surface includes forming superhydrophobic surfaces forming hydrophilic surfaces on predetermined positions of the superhydrophobic surfaces formed on the one of a first chip or the first board and the one of a second chip or a second board, respectively, generating liquid metal balls on the hydrophilic surfaces formed on the one of the first chip or the first board and the one of the second chip or the second board, respectively, and packaging the one of the first chip or the first board and the one of the second chip or the second board by combing the liquid metal ball of the one of the first chip or the first board and the liquid metal ball of the one of the second chip or the second board with each other.

Abstract: A waveguide of a 3D interconnection structure and an optical data bus system of a 3D interconnection structure using the same are provided. The waveguide includes a main waveguide which is formed in a predetermined direction and at least one branch waveguide which connects to the main waveguide to form a predetermined angle, wherein the at least one branch waveguide branches an optical signal, which is propagated in the main waveguide, at a predetermined rate.

Abstract: The invention relates to a built-in antenna module for a wireless communication terminal. The module includes at least one radiator. The module also includes a base having an inner space, disposed on a board of a terminal body, and having the radiator on an outer surface thereof to enable electric connection between an end of the radiator and the board of the terminal body. The module further includes an operator disposed in the inner space of the base for indicating an incoming call when power is supplied. The invention efficiently utilizes a limited space in the terminal body with enhanced capabilities of the antenna.

Abstract: A built-in antenna assembly of a wireless communication terminal is provided. A base is mounted on a substrate. A radiator is fixed onto an upper end of the base, and transmits/receives a signal. A terminal is extended along an outer surface of the base from the radiator to contact a contact pad protruded from the substrate. The terminal supplies a power to the radiator when in contact with the contact pad and is grounded. A terminal hooker is disposed on an underside surface of the base corresponding to a free end of the terminal so that the free end is fixed to the base. The invention allows easier and more flexible design for the terminal which is in electrical contact with the substrate of the built-in antenna. Moreover, the invention is universally applicable to various terminal models, and enhances productivity due to simpler configuration and easier assembling structure.

Abstract: A built-in antenna assembly of a wireless communication terminal is provided. A base is mounted on a substrate. A radiator is fixed onto an upper end of the base, and transmits/receives a signal. A terminal is extended along an outer surface of the base from the radiator to contact a contact pad protruded from the substrate. The terminal supplies a power to the radiator when in contact with the contact pad and is grounded. A terminal hooker is disposed on an underside surface of the base corresponding to a free end of the terminal so that the free end is fixed to the base. The invention allows easier and more flexible design for the terminal which is in electrical contact with the substrate of the built-in antenna. Moreover, the invention is universally applicable to various terminal models, and enhances productivity due to simpler configuration and easier assembling structure.