Abstract: A display device includes a display unit including a lower substrate and first, second, and third light emitting elements disposed on the lower substrate, a color filter unit including an upper substrate having a lower surface facing the first, second, and third light emitting elements, a filler disposed between the display unit and the color filter unit and including a wavelength conversion particle. The color filter unit further includes a color filter layer including first, second, and third color filters disposed on the lower surface of the upper substrate, a bank layer disposed below the color filter layer and including first, second, and third openings, a first column spacer filling the first opening, and a second column spacer filling the second opening.

Abstract: A display device includes: a blue color filter layer in a blue transmission region of an upper substrate, and including first scattering particles; a green color filter layer in a green transmission region of the upper substrate, and including second scattering particles; a red color filter layer in a red transmission region of the upper substrate; a partition wall on the upper substrate and defining a blue transmission opening, a green transmission opening, and a red transmission opening, which overlap the blue transmission region, the green transmission region, and the red transmission region, respectively; a color conversion layer including red color conversion particles and third scattering particles, and accommodated in the red transmission opening; a light emitting element layer on a lower substrate facing the upper substrate; and a filling material between the upper substrate and the lower substrate.

Abstract: The present specification relates to a conductive structure body, a method for manufacturing the same, and an electrode and an electronic device including the conductive structure body.

Abstract: A semiconductor substrate is mounted on a semiconductor alignment apparatus. A chip alignment step is performed to center a central chip on the semiconductor substrate with respect to the semiconductor alignment apparatus, and to store the coordinates thereof. A semiconductor substrate alignment is performed to virtually align the semiconductor substrate with the semiconductor alignment apparatus. At this time, coordinates of a chip adjacent to the central chip and of a number of chips in a peripheral region of the semiconductor substrate are stored in the alignment apparatus. In addition, at least two templates are located in the central chip, and images and coordinates of the templates are stored in the semiconductor alignment apparatus during the semiconductor substrate alignment.

Abstract: A semiconductor substrate is mounted on a semiconductor alignment apparatus. A chip alignment step is performed to center a central chip on the semiconductor substrate with respect to the semiconductor alignment apparatus, and to store the coordinates thereof. A semiconductor substrate alignment is performed to virtually align the semiconductor substrate with the semiconductor alignment apparatus. At this time, coordinates of a chip adjacent to the central chip and of a number of chips in a peripheral region of the semiconductor substrate are stored in the alignment apparatus. In addition, at least two templates are located in the central chip, and images and coordinates of the templates are stored in the semiconductor alignment apparatus during the semiconductor substrate alignment.