Patents by Inventor Sun-Min BAEK

Sun-Min BAEK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128332
    Abstract: A semiconductor device comprising: a lower insulating layer; a field insulating layer on the lower insulating layer; an upper insulating layer on the field insulating layer; a first through via in the upper insulating layer; a second through via in the field insulating layer; and a third through via in the lower insulating layer, wherein the second through via is connected to the first and third through vias, and wherein a width of a top surface of the second through via is greater than a width of a bottom surface of the first through via, a width of a bottom surface of the second through via is greater than a width of a top surface of the third through via, and a width of a middle portion of the second through via is greater than the widths of the top surface and the bottom surface of the second through via.
    Type: Application
    Filed: July 11, 2023
    Publication date: April 18, 2024
    Inventors: Sang Shin JANG, Jong Min BAEK, Sun Ki MIN, Na rae OH
  • Publication number: 20240112864
    Abstract: A method of manufacturing a multilayer electronic component includes cutting a stack, in which internal electrode patterns and ceramic green sheets are alternately stacked in a stacking direction, to obtain unit chips and attaching a portion of a ceramic green sheet for a side margin portion to the unit chips in a direction, different from the stacking direction. The attaching includes attaching the portion of the ceramic green sheet to the unit chips by compression between a first elastic body on which the ceramic green sheet is disposed and the unit chips. The first elastic body includes a first elastic layer having and a second elastic layer having an elastic modulus different from the first elastic layer, and disposed between the unit chips and the first elastic layer. An elastic modulus of the first elastic body is greater than 50 MPa and less than or equal to 1000 MPa.
    Type: Application
    Filed: July 10, 2023
    Publication date: April 4, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong PARK, Jung Tae PARK, Jong Ho LEE, Eun Jung LEE, Yong Min HONG, Jung Jin PARK, Rak Hyeon BAEK, Sun Mi KIM, Yong Ung LEE
  • Publication number: 20110123599
    Abstract: The present invention relates to an aroma therapy patch including a herbal layer containing herbal extract which is formed on one surface of a substrate having a specific shape, and an adhesive layer formed on the other surface of the substrate, wherein at least one surface of the substrate is colored. The aroma therapy patch of the present invention exerts aromatic effects by the actions of herbal extracts as well as chromatherapeutic effects induced by a specific color used therein, which can be used easily and cost-effectively by an ordinary person.
    Type: Application
    Filed: January 31, 2011
    Publication date: May 26, 2011
    Applicant: NIRAPHARM CO., LTD.
    Inventors: Hyun-Wook JOO, Sun-Min BAEK