Patents by Inventor Sun-Pil Yun

Sun-Pil Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 7534709
    Abstract: Embodiments of the present invention include semiconductor devices that can be made with relatively low resistance, and methods of forming the semiconductor devices. A resistance reducing layer is formed between a polysilicon layer and a metal layer. As a result, an interface resistance between the polysilicon layer and the metal layer is greatly reduced and a distribution of the interface resistance is very uniform. As a result, a conductive structure including the resistance reducing layer has a greatly reduced sheet resistance to improve electrical characteristics of a semiconductor device having the conductive structure.
    Type: Grant
    Filed: September 23, 2005
    Date of Patent: May 19, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Hwa Park, Gil-Heyun Choi, Chang-Won Lee, Byung-Hak Lee, Hee-Sook Park, Woong-Hee Sohn, Jong-Ryeol Yoo, Sun-Pil Yun, Jang-Hee Lee, Dong-Chan Lim
  • Semiconductor device and method of manufacturing the same
    Publication number: 20060014355
    Abstract: Embodiments of the present invention include semiconductor devices that can be made with relatively low resistance, and methods of forming the semiconductor devices. A resistance reducing layer is formed between a polysilicon layer and a metal layer. As a result, an interface resistance between the polysilicon layer and the metal layer is greatly reduced and a distribution of the interface resistance is very uniform. As a result, a conductive structure including the resistance reducing layer has a greatly reduced sheet resistance to improve electrical characteristics of a semiconductor device having the conductive structure.
    Type: Application
    Filed: September 23, 2005
    Publication date: January 19, 2006
    Inventors: Jae-Hwa Park, Gil-Heyun Choi, Chang-Won Lee, Byung-Hak Lee, Hee-Sook Park, Woong-Hee Sohn, Jong-Ryeol Yoo, Sun-Pil Yun, Jang-Hee Lee, Dong-Chan Lim