Abstract: Disclosed herein is a printed circuit board including: an insulating layer including a stopper layer for trench formation disposed in an inner portion thereof and trenches formed to expose the stopper layer for trench formation; and circuit patterns formed in the trenches.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The method of manufacturing a printed circuit board includes: preparing a base substrate having first circuit layers formed on one surface or both surfaces thereof; forming a plating resist having openings for a first via layer on the base substrate; forming first via layers in the openings for a first via layer; forming insulating layers having outer metal layers on the base substrate having the first via layers formed thereon; forming openings for a second via layer over the first via layer on the insulating layers and the outer metal layers; and completing multi-layer vias by forming second via layers in the openings.

Abstract: The present invention relates to a method and system for haptic interaction in augmented reality that can effectively remove noise from real images captured by an image capturing device and minimize discontinuity of force generated in the haptic interaction for the stable and smooth haptic interaction in the augmented reality. The augmented reality system comprising: a marker detecting unit that detects a markers in images; a marker position extracting unit that extracts the positions of the detected markers; a noise removing unit that removes noise from positional information of the markers; a visual rendering unit that augments virtual objects; a motion estimating unit that estimates the motion of the markers over a time; a collision detecting unit that detects collision between the virtual objects and an end point of the haptic device; and a haptic rendering unit that calculates reaction force to be provided through the haptic device.

Abstract: A method for manufacturing an embedded substrate is disclosed. The method for manufacturing an embedded substrate, which includes a core substrate formed with a pattern on both surfaces thereof and formed with a cavity penetrating from an upper part thereof to a lower part thereof, a chip embedded in the cavity, and a first insulator and a second insulator provided respectively on either surface of the core substrate so as to protect the pattern, includes: preparing the core substrate; laminating the first insulator on a lower surface of the core substrate so as to cover a lower side of the cavity; forming an adhesive layer on the first insulator that is exposed through the cavity; embedding the chip in the cavity by attaching the chip on the adhesive layer; and laminating the second insulator on an upper surface of the core substrate.

Abstract: Disclosed is a trench substrate, which includes a first insulating layer having trenches formed therein, a second insulating layer disposed on a lower surface of the first insulating layer and having laser processability inferior to that of the first insulating layer, and a negative pattern formed in the trenches, and in which the second insulating layer having laser processability inferior to that of the first insulating layer functions as a stopper, so that the trenches having the same shape are formed in the first insulating layer, thus enabling the formation of a fine and uniform circuit pattern. A method of fabricating the trench substrate is also provided.

Abstract: The present invention relates to a method and system for haptic interaction in augmented reality. More specifically, the present invention relates to a method and system for haptic interaction in augmented reality that can effectively remove noise from real images captured by an image capturing device and minimize discontinuity of force generated in the haptic interaction so as to stably and smoothly perform the haptic interaction in the augmented reality.