Patents by Inventor Sun Wen

Sun Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7450387
    Abstract: The present invention provides a heat dissipater for use on a circuit board. The invention includes a circuit board having components on at least one side, a rigid plate having thermal conductive properties, and a spring clip that couples said rigid plate to said circuit board and provides a retaining force against the rigid plate. Both the rigid plate and spring clip provide thermal paths to ambient for the circuit board, and in one embodiment, a heat sink or cold plate may be coupled to the rigid plate. Thermal interface material may be filled in between the rigid plate, circuit board and spring clip to provide an efficient thermal path to ambient. The rigid plate, spring clip, and thermal interface material may be electrically insulated.
    Type: Grant
    Filed: March 2, 2006
    Date of Patent: November 11, 2008
    Assignee: TDK Innoveta Technologies, Inc.
    Inventors: Sun-Wen Cyrus Cheng, Carl Milton Wildrick
  • Publication number: 20080123312
    Abstract: The present invention provides a DC-DC power converter that comprises two or more Printed Wiring Boards (PWB) mounted parallel to one another and without encapsulation. Electronic components can be mounted on both sides of each board. The open design and parallel orientation of the PWBs allow airflow over components mounted on the PWBs. The PWBs are preferable made of FR-4 with copper foils, with one thicker board being comprised of more copper layers and the other boards comprised of less copper layers. In the preferred embodiment, the power processing elements are housed in the thicker PWB, while the thinner boards house the control circuitry.
    Type: Application
    Filed: November 29, 2006
    Publication date: May 29, 2008
    Inventors: Sun-Wen Cyrus Cheng, Carl Milton Wildrick, Jeffrey John Boylan
  • Publication number: 20070206361
    Abstract: The present invention provides a heat dissipater for use on a circuit board. The invention includes a circuit board having components on at least one side, a rigid plate having thermal conductive properties, and a spring clip that couples said rigid plate to said circuit board and provides a retaining force against the rigid plate. Both the rigid plate and spring clip provide thermal paths to ambient for the circuit board, and in one embodiment, a heat sink or cold plate may be coupled to the rigid plate. Thermal interface material may be filled in between the rigid plate, circuit board and spring clip to provide an efficient thermal path to ambient. The rigid plate, spring clip, and thermal interface material may be electrically insulated.
    Type: Application
    Filed: March 2, 2006
    Publication date: September 6, 2007
    Inventors: Sun-Wen Cheng, Carl Wildrick
  • Patent number: 5170585
    Abstract: The automatic door assembly includes a rail, a door carriage movably provided on the rail, a driving unit for moving the door carriage, a rechargeable battery unit for supplying electric power to operate the driving unit and a circuit for electrically connecting the rechargeable battery unit and the driving unit. It also has a charging unit for timely charging of the rechargeable battery unit and a device for stopping the door carriage automatically at the open and closed positions.
    Type: Grant
    Filed: December 4, 1991
    Date of Patent: December 15, 1992
    Inventor: Ching-Sun Wen