Patents by Inventor Sun Woo Park
Sun Woo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240123370Abstract: An ion filter for circulating coolant in a fuel cell stack of a fuel cell vehicle includes a housing including an inlet configured so that a fluid is introduced and an outlet configured so that the fluid is discharged, a filter element accommodated in the housing to filter the fluid, a valve assembly provided on the inlet and configured to operate the flow of the fluid introduced into the housing through the inlet to be allowed or blocked, and a gate member provided in the housing and configured to adjust an operation of the valve assembly.Type: ApplicationFiled: March 2, 2023Publication date: April 18, 2024Inventors: Kyeong Jun BAEK, Sun Ae Park, Hun Woo Park, Hyung Geun Cho, Young Sang Cho, Sang Pil Byun
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Patent number: 11958546Abstract: The present disclosure relates to a steering control device and a steering assist system including same. Particularly, a steering control device according to the present disclosure comprises an input-side steering control device which includes: a first controller connected to an output-side steering control device via at least one first communication bus; and a second controller connected to the output-side steering control device via at least one second communication bus and connected to the first controller via at least one third communication bus.Type: GrantFiled: June 11, 2020Date of Patent: April 16, 2024Assignee: HL MANDO CORPORATIONInventors: Min Woo Jeong, Sun Hong Park, Hyun Chul Tae
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Publication number: 20240120459Abstract: A method of preparing a positive electrode active material having a high ratio of charge and discharge capacity at a charge end voltage of 4.1 V to 4.175 V to charge and discharge capacity at a charge end voltage of 4.2 V to 4.275 V and having an excellent initial charge and discharge capacity is provided.Type: ApplicationFiled: November 24, 2022Publication date: April 11, 2024Applicant: LG Chem, Ltd.Inventors: Min Kyu You, Sun Sik Shin, Joo Hong Jin, June Woo Lee, Ji A Shin, Min Joo Park
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Patent number: 11953958Abstract: A display includes: a display panel; and a panel bottom sheet disposed below the display panel, the panel bottom sheet including: a first heat dissipation layer; a second heat dissipation layer over the first heat dissipation layer, including a first opening formed completely through the second heat dissipation layer in a thickness direction; a heat dissipation coupling interlayer between the first heat dissipation layer and the second heat dissipation layer, and a heat dissipation substrate on the second heat dissipation layer.Type: GrantFiled: December 12, 2022Date of Patent: April 9, 2024Assignee: Samsung Display Co., Ltd.Inventors: Kang Woo Lee, Boo Kan Ki, June Hyoung Park, Sun Hee Oh, Dong Hyeon Lee, Jeong In Lee, Hyuk Hwan Kim, Seong Sik Choi
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Patent number: 11948459Abstract: Disclosed are a parking control apparatus for a vehicle and a method thereof. The parking control apparatus includes a processor that searches for at least one parking space in a parking control of a vehicle, calculates an estimated route and a required parking time for each of the at least one parking space, and performs parking control into a target parking space which is one parking space selected from the at least one parking space by a user, and a display that displays the estimated route and the required parking time for each of the at least one parking space.Type: GrantFiled: March 3, 2022Date of Patent: April 2, 2024Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Sun Woo Jeong, Yong Joon Lee, Jin Ho Park
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Patent number: 11938247Abstract: Provided are a method for fabricating a human nasal turbinate-derived mesenchymal stem cell-based 3D bioprinted construct, and a use thereof, wherein the human nasal turbinate-derived mesenchymal stem cell-based, 3D bioprinted construct is advantageous over conventional mesenchymal stem cell-based, 3D bioprinted constructs in that the former can survive and proliferate stably in vitro and/or in vivo and shows high osteogenic differentiation ability as well, therefore is expected to make a great contribution to the practical use of cellular therapeutic agents.Type: GrantFiled: May 2, 2018Date of Patent: March 26, 2024Assignee: CATHOLIC UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATIONInventors: Sung Won Kim, Jung Yeon Lim, Sun Hwa Park, Byeong Gon Yoon, Dong-Woo Cho, Jinah Jang, Seok Won Kim
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Publication number: 20240092374Abstract: A system of controlling a vehicle may include a sensor and a controller, in which the sensor may be configured to sense vehicle operation state information, and the controller may be configured to determine whether a vehicle is running on a dangerous road based on the sensed vehicle operation state information, determine whether there is a possibility that a vehicle driving state will cause a failure of a driving system based on the sensed vehicle operation state information in response to determining that the vehicle is running on the dangerous road, and decide that torque control of the vehicle.Type: ApplicationFiled: December 8, 2022Publication date: March 21, 2024Inventors: Bao Wen You, Sun Woo Park, Young Joon Chang, Xiaobin Ma, Xuejiao Sun, Yuzhao Wei, Woon Ki Cho, Xiao Tong Yan
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Publication number: 20240093188Abstract: The present disclosure relates to an RNAi-inducing nucleic acid molecule and use thereof. An aspect of the disclosure relates to an RNAi-inducing nucleic acid molecule for inhibiting expression of myeloid differentiation primary response gene 88 (MyD88). Another aspect of the present disclosure relates to a pharmaceutical composition for treating or preventing age-related macular degeneration, compri the RNAi-inducing nucleic acid molecule.Type: ApplicationFiled: August 13, 2020Publication date: March 21, 2024Inventors: Sun Woo HONG, June Hyun PARK
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Patent number: 11398581Abstract: Disclosed is a semiconductor device including a semiconductor structure including a first semiconductor layer, a second semiconductor layer, and an active layer disposed between the first semiconductor layer and the second semiconductor layer, a first electrode electrically connected to the first semiconductor layer, and a second electrode electrically connected to the second semiconductor layer. The semiconductor structure includes a first upper surface on which the first semiconductor layer is exposed, a second upper surface on which the second semiconductor layer is disposed, an inclined surface connecting the first upper surface and the second upper surface, and a recess formed between the first upper surface and the inclined surface. The recess has a depth less than or equal to 30% of a vertical distance between the first upper surface and the second upper surface.Type: GrantFiled: November 2, 2018Date of Patent: July 26, 2022Assignee: LG INNOTEK CO., LTD.Inventors: Sang Youl Lee, Chung Song Kim, Ji Hyung Moon, Sun Woo Park, Hyeon Min Cho
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Patent number: 11239394Abstract: Disclosed herein is a semiconductor device including a light emitting structure including a first conductive type semiconductor layer, a plurality of active layers disposed to be spaced apart on the first conductive type semiconductor layer, and a plurality of second conductive type semiconductor layers disposed on the plurality of active layers, respectively, a first electrode electrically connected to the first conductive type semiconductor layer, and a plurality of second electrodes electrically connected to the plurality of second conductive type semiconductor layers, respectively, wherein the plurality of active layers include a first active layer, a second active layer, and a third active layer, the light emitting structure includes a first light emitter including the first active layer, a second light emitter including the second active layer, and a third light emitter including the third active layer, the first active layer emits light in a blue wavelength band, the second active layer emits light inType: GrantFiled: March 17, 2017Date of Patent: February 1, 2022Assignee: LG INNOTEK CO., LTD.Inventors: Sun Woo Park, Myung Ho Han, Hyeon Min Cho, June O Song, Chung Song Kim, Ji Hyung Moon, Sang Youl Lee
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Patent number: 11158668Abstract: Disclosed in an embodiment is a display device comprising a panel substrate and a plurality of semiconductor devices disposed on the panel substrate, wherein the panel substrate includes first and second regions disposed in a first direction, the plurality of semiconductor devices include a plurality of first semiconductor devices disposed in the first region and a plurality of second semiconductor devices disposed in the second region, the wavelength deviation between the first semiconductor device disposed at the edge of the first region and the second semiconductor device disposed at the edge of the second region is within 2 nm, and the wavelength pattern of the plurality of first semiconductor devices in the first direction is the same as the wavelength pattern of the plurality of second semiconductor devices in the first direction.Type: GrantFiled: September 19, 2018Date of Patent: October 26, 2021Assignee: LG INNOTEK CO., LTD.Inventors: Sang Youl Lee, Chung Song Kim, Yong Tae Moon, Ji Hyung Moon, Sun Woo Park, Hyeon Min Cho
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Patent number: 10950756Abstract: The embodiments of the present invention relate to a light emitting device, a method for manufacturing a light emitting device, a light emitting device package, and a lighting device. A light emitting device according to an embodiment has: a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer; a passivation layer disposed on the light emitting structure; and an insulating reflective layer disposed on the passivation layer. The passivation layer may include a first region disposed on an upper surface of the light emitting structure, and a second region disposed on side surfaces of the first conductivity type semiconductor layer, the second conductivity type semiconductor layer, and the active layer.Type: GrantFiled: December 6, 2017Date of Patent: March 16, 2021Assignee: LG INNOTEK CO., LTD.Inventors: Sung Min Hwang, Sun Woo Park, Chang Hyeong Lee
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Publication number: 20210036187Abstract: Disclosed is a semiconductor device including a semiconductor structure including a first semiconductor layer, a second semiconductor layer, and an active layer disposed between the first semiconductor layer and the second semiconductor layer, a first electrode electrically connected to the first semiconductor layer, and a second electrode electrically connected to the second semiconductor layer. The semiconductor structure includes a first upper surface on which the first semiconductor layer is exposed, a second upper surface on which the second semiconductor layer is disposed, an inclined surface connecting the first upper surface and the second upper surface, and a recess formed between the first upper surface and the inclined surface. The recess has a depth less than or equal to 30% of a vertical distance between the first upper surface and the second upper surface.Type: ApplicationFiled: November 2, 2018Publication date: February 4, 2021Applicant: LG INNOTEK CO., LTD.Inventors: Sang Youl LEE, Chung Song KIM, Ji Hyung MOON, Sun Woo PARK, Hyeon Min CHO
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Patent number: 10790330Abstract: One embodiment discloses a semiconductor device comprising: a plurality of light-emitting units; a plurality of wavelength conversion layers each disposed on the plurality of light-emitting units; partitions disposed between the plurality of light-emitting units and between the plurality of wavelength conversion layers; a plurality of color filters each disposed on the plurality of wavelength conversion layers; and black matrix disposed between the plurality of color filters.Type: GrantFiled: November 24, 2017Date of Patent: September 29, 2020Assignee: LG INNOTEK CO., LTD.Inventors: Sang Youl Lee, Chung Song Kim, Ji Hyung Moon, Sun Woo Park, Hyeon Min Cho
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Publication number: 20200286949Abstract: Disclosed in an embodiment is a display device comprising a panel substrate and a plurality of semiconductor devices disposed on the panel substrate, wherein the panel substrate includes first and second regions disposed in a first direction, the plurality of semiconductor devices include a plurality of first semiconductor devices disposed in the first region and a plurality of second semiconductor devices disposed in the second region, the wavelength deviation between the first semiconductor device disposed at the edge of the first region and the second semiconductor device disposed at the edge of the second region is within 2 nm, and the wavelength pattern of the plurality of first semiconductor devices in the first direction is the same as the wavelength pattern of the plurality of second semiconductor devices in the first direction.Type: ApplicationFiled: September 19, 2018Publication date: September 10, 2020Applicant: LG INNOTEK CO., LTD.Inventors: Sang Youl LEE, Chung Song KIM, Yong Tae MOON, Ji Hyung MOON, Sun Woo PARK, Hyeon Min CHO
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Patent number: 10755981Abstract: An embodiment provides a display device manufacturing method comprising the steps of: preparing a substrate having a plurality of semiconductor chips arranged thereon (S1); bonding at least one first semiconductor chip of the plurality of semiconductor chips to a transfer member (S2); irradiating laser light to the first semiconductor chip to separate the first semiconductor chip from the substrate (S3); disposing the first semiconductor chip on a panel substrate of a display device by means of the transfer member (S4); and irradiating light to the transfer member to separate the first semiconductor chip from the transfer member (S5), wherein the transfer member comprises: a transfer layer and a bonding layer disposed on one surface of the transfer layer; the bonding layer comprises at least one bonding protrusion; and the first semiconductor chip is bonded to the bonding protrusion in step S2.Type: GrantFiled: January 5, 2018Date of Patent: August 25, 2020Assignee: LG INNOTEK CO., LTD.Inventors: Sang Youl Lee, Chung Song Kim, Ji Hyung Moon, Sun Woo Park, Hyeon Min Cho
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Patent number: 10714659Abstract: Disclosed according to one embodiment is a light-emitting element comprising: a light-emitting structure comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a second conductive layer electrically connected to the second semiconductor layer; a first conductive layer which is disposed in a plurality of via holes passing through the light-emitting structure and second conductive layer and comprises a plurality of through electrodes electrically connected to the first semiconductor layer; an insulation layer for electrically insulating the plurality of through electrodes from the active layer, second semiconductor layer, and second conductive layer; and an electrode pad disposed in an exposed area of the second conductive layer, wherein the farther away the second conductive layer disposed between the plurality of through electrodes is from the electrode pad, the greater the width of the second conductive layer becomes.Type: GrantFiled: May 25, 2016Date of Patent: July 14, 2020Assignee: LG INNOTEK CO., LTD.Inventors: Sun Woo Park, Dong Hyun Sung, Dae Hee Lee, Byoung Woo Lee, Kwang Ki Choi, Jae Cheon Han
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Patent number: 10658413Abstract: A semiconductor device includes a lower insulating layer on a lower substrate, a lower pad structure inside the lower insulating layer, an upper insulating layer on the lower insulating layer, an upper pad structure inside the upper insulating layer, and an upper substrate on the upper insulating layer. A via plug passes through at least a portion of each of the upper substrate, the upper insulating layer, and the lower insulating layer, and in contact with the upper pad structure and the lower pad structure. The upper pad structure includes upper pad conductive layers and an upper connection layer between the upper pad conductive layers. The upper connection layer includes a conductive pattern having a shape different from a shape of at least one of the upper pad conductive layers. The via plug is in direct contact with the upper pad conductive layers and the upper connection layer.Type: GrantFiled: July 6, 2018Date of Patent: May 19, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Sun Woo Park, Sun Hyun Kim, Ho Woo Park, Eung Kyu Lee, Chang Keun Lee, Hisanori Ihara
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Publication number: 20200127173Abstract: Disclosed herein is a semiconductor device including a light emitting structure including a first conductive type semiconductor layer, a plurality of active layers disposed to be spaced apart on the first conductive type semiconductor layer, and a plurality of second conductive type semiconductor layers disposed on the plurality of active layers, respectively, a first electrode electrically connected to the first conductive type semiconductor layer, and a plurality of second electrodes electrically connected to the plurality of second conductive type semiconductor layers, respectively, wherein the plurality of active layers include a first active layer, a second active layer, and a third active layer, the light emitting structure includes a first light emitter including the first active layer, a second light emitter including the second active layer, and a third light emitter including the third active layer, the first active layer emits light in a blue wavelength band, the second active layer emits light inType: ApplicationFiled: March 17, 2017Publication date: April 23, 2020Applicant: LG INNOTEK CO., LTD.Inventors: Sun Woo PARK, Myung Ho HAN, Hyeon Min CHO, June O SONG, Chung Song KIM, Ji Hyung MOON, Sang Youl LEE
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Patent number: 10611937Abstract: Provided are a composition for adhesion, a stacked structure including the same, and an electronic device including the same. The composition for adhesion may include an acrylic resin and a silane compound. The acrylic resin may have a weight average molecular weight of about 100,000 g/mol to about 200,000 g/mol, and may include a polymerization unit derived from a monomer represented by Formula A1 and a polymerization unit derived from a monomer represented by Formula A2. The silane compound may have a weight average molecular weight of about 300 g/mol to about 2,000 g/mol, and a polymerization unit derived from a monomer represented by Formula B.Type: GrantFiled: March 23, 2018Date of Patent: April 7, 2020Assignees: Samsung Electronics Co., Ltd., GAEMA TECHInventors: Minchul Lee, Namil Koo, Kyungrim Kim, Sun-Woo Park, Yongin Park, Min-Woo Lee, Wonhee Choe, Hun Rae Kim, Dong-Sel Kim, Zeeyoung Lee