Abstract: An image sensor includes an array of image sensor cells, on a substrate, and a peripheral circuit region extending adjacent the array of image sensor cells. The array of image sensor cells includes a plurality of lens elements and a plurality of color filters extending adjacent the plurality of lens elements. A plurality of photodiodes is provided in the substrate. The plurality of photodiodes are aligned to corresponding ones of the plurality of lens elements. An interconnection structure is also provided, which extends between the plurality of photodiodes and the plurality of color filters. The interconnection structure has an array of cavities therein that are aligned to corresponding ones of the plurality of photodiodes and are filled with a light guide material. The peripheral circuit region includes a metal interconnect pattern and an electrically conductive pad on the metal interconnect pattern. An electrically insulating layer extends on the electrically conductive pad.

Abstract: An image sensor includes an array of image sensor cells, on a substrate, and a peripheral circuit region extending adjacent the array of image sensor cells. The array of image sensor cells includes a plurality of lens elements and a plurality of color filters extending adjacent the plurality of lens elements. A plurality of photodiodes is provided in the substrate. The plurality of photodiodes are aligned to corresponding ones of the plurality of lens elements. An interconnection structure is also provided, which extends between the plurality of photodiodes and the plurality of color filters. The interconnection structure has an array of cavities therein that are aligned to corresponding ones of the plurality of photodiodes and are filled with a light guide material. The peripheral circuit region includes a metal interconnect pattern and an electrically conductive pad on the metal interconnect pattern. An electrically insulating layer extends on the electrically conductive pad.

Abstract: An image sensor is formed by providing a semiconductor substrate having first, second and third pixel regions and first and second color filters disposed on their respective pixel regions. A photoresist layer is coated over the first and second color filters and the third color pixel region. The photoresist is removed from the first and second color filters, leaving a third color filter of substantially the same height as the first and second color filters. Micro lenses may then be formed on the color filters.

Abstract: An image sensor device and methods thereof. In an example method, a protective layer may be formed over at least one microlens. An adhesive layer may be formed over the protective layer. The adhesive layer may be removed so as to expose the protective layer. The protective layer may be removed so as to expose the at least one microlens, the exposed at least one microlens not including residue from the adhesive layer. The at least one microlens may have an improved functionality due at least in part to the lack of residue from the adhesive layer. In an example, the at least one microlens may be included in an image sensor module.

Abstract: An image sensor is formed by providing a semiconductor substrate having first, second and third pixel regions and first and second color filters disposed on their respective pixel regions. A photoresist layer is coated over the first and second color filters and the third color pixel region. The photoresist is removed from the first and second color filters, leaving a third color filter of substantially the same height as the first and second color filters. Micro lenses may then be formed on the color filters.

Abstract: An image sensor device and methods thereof. In an example method, a protective layer may be formed over at least one microlens. An adhesive layer may be formed over the protective layer. The adhesive layer may be removed so as to expose the protective layer. The protective layer may be removed so as to expose the at least one microlens, the exposed at least one microlens not including residue from the adhesive layer. The at least one microlens may have an improved functionality due at least in part to the lack of residue from the adhesive layer. In an example, the at least one microlens may be included in an image sensor module.

Abstract: Example embodiments of the present invention relate to a method of manufacturing an optical device having a transparent cover and a method of manufacturing an optical device module using the optical device. According to an example method of manufacturing the optical device, a semiconductor substrate having a plurality of dies including an effective pixel and a plurality of bonding pads arranged around the effective pixel is prepared. A protective layer may be formed on the semiconductor substrate to selectively cover the effective pixel. An adhesive pattern may be formed to enclose an edge of the effective pixel, and a transparent cover may be attached to correspond to the effective pixel using the adhesive pattern.