Abstract: The instant disclosure relates to a method of retaining a solder material onto a solder terminal comprising: a solder terminal and a solder material. The solder terminal includes a first surface, a second surface and a side, and is formed with a retaining hole. The solder material includes a winding portion, and a connection portion which extends on the opposite side from the winding portion of the solder material. The winding portion is arranged to cover the solder terminal along the first surface, the side and then the second surface. In addition, the connection portion is engaged with the solder terminal through the retaining hole and is bent like a hook.

Abstract: The present disclosure relates to a method of sleeve retaining a solder material onto a terminal unit comprises of steps. In order to achieve the steps, a structure is also disclosed which comprises: a terminal unit and a solder material wherein the terminal unit possess a fixing portion while the solder material forms a sleeve which corresponds to the terminal unit, therefore enabling the sleeve retaining of the solder material. By means of sleevingly retain as described above, the assembly of the terminal unit and the solder material can be further stabilized.

Abstract: The instant disclosure relates to a method of retaining a solder material onto a solder terminal comprising: a solder terminal and a solder material. The solder terminal includes a first surface, a second surface and a side, and is formed with a retaining hole. The solder material includes a winding portion, and a connection portion which extends on the opposite side from the winding portion of the solder material. The winding portion is arranged to cover the solder terminal along the first surface, the side and then the second surface. In addition, the connection portion is engaged with the solder terminal through the retaining hole and is bent like a hook.