Patents by Inventor Sun Yong Ahn

Sun Yong Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150152561
    Abstract: Provided is a hard film for a cutting tool formed on a surface of a base material, the hard film being comprised of a nano multi-layered structure formed by sequentially stacking a thin layer A, a thin layer B, a thin layer C and a thin layer D or being comprised of a structure formed by repeatedly stacking the nano multi-layered structure at least twice, wherein the thin layer A is comprised of TixAl1-xN (0.5?x?1.7); the thin layer B is comprised of Al1-y-zTiyMezN (0.4?y?0.7, 0<z?0.1 where Me is at least one of Si, Cr, and Nb); the thin layer C is comprised of AlaTi1-aN (0.5?a?0.7); and the thin layer D is comprised of AlbCr1-bN (0.5?b?0.7).
    Type: Application
    Filed: March 18, 2013
    Publication date: June 4, 2015
    Applicant: KORLOY INC.
    Inventors: Jae-Hoon Kang, Je-Hun Park, Seung-Su Ahn, Sung-Hyun Kim, Jung-Wook Kim, Sung-Gu Lee, Sun-Yong Ahn, Dong-Bok Park
  • Publication number: 20150125677
    Abstract: Provided is a hard film for a cutting tool formed on a surface of a base material, the hard film being comprised of a nano multi-layered structure comprising a thin layer A, a thin layer B, a thin layer C and a thin layer D or a structure in which the nano multi-layered structure is repeatedly stacked at least twice, wherein the thin layer A is comprised of Ti1-xAlxN (0.5?x?0.7); the thin layer B is comprised of Al1-y-zTiyCrzN (0.3?y?0.6 and 0<z?0.3); the thin layer B is comprised of MeN (where Me is Nb or V); and the thin layer D is comprised of Al1-a-bTiaSibN (0.3?a?0.7 and 0<b<0.1).
    Type: Application
    Filed: March 18, 2013
    Publication date: May 7, 2015
    Inventors: Je-Hun Park, Jae-Hoon Kang, Seung-Su Ahn, Sung-Hyun Kim, Sung-Gu Lee, Jung-Wook Kim, Sun-Yong Ahn, Dong-Bok Park
  • Publication number: 20150125678
    Abstract: Provided is a hard film formed on a surface of a base material, the hard film being comprised of a nano multi-layered structure formed by stacking a thin layer A, a thin layer B a thin layer C in order of thin layers A-B-A-C from the base material or being comprised of a structure formed by repeatedly stacking the nano multi-layered structure at least twice, wherein the thin layer A is comprised of Ti1-xAlxN (0.3?x?0.7); the thin layer B is comprised of Al1-yCryN (0.3?y?0.7); and the thin layer C is comprised of MeN (where Me is any one of Nb, V, and Cr).
    Type: Application
    Filed: March 18, 2013
    Publication date: May 7, 2015
    Inventors: Je-Hun Park, Jae-Hoon Kang, Seung-Su Ahn, Sung-Hyun Kim, Jung-Wook Kim, Sung-Gu Lee, Sun-Yong Ahn, Dong-Bok Park
  • Patent number: 8507109
    Abstract: The present invention discloses a multi-layer hard film for an indexable insert. The multi-layer hard film for the indexable insert provided by the present invention is formed by sequentially depositing a base layer, an intermediate layer and a top layer with different composition ratios and film structures individually on the indexable insert, thus minimizing a delamination and tool wear which may occur in high speed machining.
    Type: Grant
    Filed: March 18, 2009
    Date of Patent: August 13, 2013
    Assignee: Korloy, Inc.
    Inventors: Hyung Kwun Kim, Jae Hoon Kang, Jung Wook Kim, Seung Su Ahn, Sun Yong Ahn
  • Publication number: 20110033723
    Abstract: The present invention discloses a multi-layer hard film for an indexable insert. The multi-layer hard film for the indexable insert provided by the present invention is formed by sequentially depositing a base layer, an intermediate layer and a top layer with different composition ratios and film structures individually on the indexable insert, thus minimizing a delamination and tool wear which may occur in high speed machining.
    Type: Application
    Filed: March 18, 2009
    Publication date: February 10, 2011
    Applicant: KORLOY INC.
    Inventors: Hyung Kwun Kim, Jae Hoon Kang, Jung Wook Kim, Seung Su Ahn, Sun Yong Ahn