Patents by Inventor SUN-YU CHOU

SUN-YU CHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10361499
    Abstract: An adapter assembly includes a plurality of adapters arranged in one row. Each adapter has two electrical connection interfaces respectively arranged on two opposite sides thereof. Each adapter includes an insulating body and a plurality of conductive terminals. The insulating body includes an internal connecting portion and an external connecting portion respectively arranged on two opposite sides thereof. The conductive terminals are arranged in the internal connecting portion and the external connecting portion to respectively form the two electrical connection interfaces. One of the two electrical connection interfaces located at the internal connecting portion is electrically connected to the other electrical connection interface located at the external connecting portion.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: July 23, 2019
    Assignee: CHIEF LAND ELECTRONIC CO., LTD.
    Inventors: Chung-Nan Pao, Chia-Feng Huang, Sun-Yu Chou
  • Publication number: 20190053376
    Abstract: An adapter includes an insulating body, a circuit board, and a plurality of conductive modules. The circuit board is arranged in the insulating body and has two opposite surfaces. The conductive modules are arranged in the insulating body and are respectively disposed on two opposite ends of at least one of the two surfaces of the circuit board. Each of the conductive modules includes a plastic member and a plurality of conductive terminals arranged in one row. Each of the conductive terminals has an embedded segment embedded in the plastic member, a fixing segment extending from an end of the embedded segment and soldered on the circuit board by using a SMT manner, and a contacting segment extending from an opposite end of the embedded segment in a direction away from the circuit board.
    Type: Application
    Filed: November 12, 2017
    Publication date: February 14, 2019
    Inventors: CHUNG-NAN PAO, CHIA-FENG HUANG, SUN-YU CHOU
  • Publication number: 20190052007
    Abstract: An adapter assembly includes a plurality of adapters arranged in one row. Each adapter has two electrical connection interfaces respectively arranged on two opposite sides thereof. Each adapter includes an insulating body and a plurality of conductive terminals. The insulating body includes an internal connecting portion and an external connecting portion respectively arranged on two opposite sides thereof. The conductive terminals are arranged in the internal connecting portion and the external connecting portion to respectively form the two electrical connection interfaces. One of the two electrical connection interfaces located at the internal connecting portion is electrically connected to the other electrical connection interface located at the external connecting portion.
    Type: Application
    Filed: November 14, 2017
    Publication date: February 14, 2019
    Inventors: CHUNG-NAN PAO, CHIA-FENG HUANG, SUN-YU CHOU
  • Patent number: 10187988
    Abstract: An adapter includes an insulating body, a circuit board, and a plurality of conductive modules. The circuit board is arranged in the insulating body and has two opposite surfaces. The conductive modules are arranged in the insulating body and are respectively disposed on two opposite ends of at least one of the two surfaces of the circuit board. Each of the conductive modules includes a plastic member and a plurality of conductive terminals arranged in one row. Each of the conductive terminals has an embedded segment embedded in the plastic member, a fixing segment extending from an end of the embedded segment and soldered on the circuit board by using a SMT manner, and a contacting segment extending from an opposite end of the embedded segment in a direction away from the circuit board.
    Type: Grant
    Filed: November 12, 2017
    Date of Patent: January 22, 2019
    Assignee: CHIEF LAND ELECTRONIC CO., LTD.
    Inventors: Chung-Nan Pao, Chia-Feng Huang, Sun-Yu Chou
  • Publication number: 20170288359
    Abstract: A method includes the steps: providing a pre-structure comprising a first pre-embedded member and a second pre-embedded member, wherein the first pre-embedded member has a first positioning segment, a connecting segment connected to the first positioning segment, a first piece, and a bridge; the second pre-embedded member has a second positioning segment, a hanging segment connected to the second positioning segment, and a second piece, wherein the bridge is connected to the connecting segment and the second piece; fixing the bridge onto the hanging segment; segmenting the connecting portion of the bridge and the connecting segment to form a first embedded member, which is defined by the first positioning segment, the connecting segment and the first piece, and a second embedded member, which is defined by the second positioning segment, the hanging segment, the second piece and the bridge; separating the second embedded member from the first embedded member.
    Type: Application
    Filed: July 7, 2016
    Publication date: October 5, 2017
    Inventors: YU-FENG KE, SUN-YU CHOU, CHIA-FENG HUANG
  • Patent number: 9634434
    Abstract: A differential signal assembly includes two pairs of differential signal wafers arranged in one row. Each differential signal wafer includes a plurality of mating portions arranged in one column and a plurality of mounting portions arranged in one column. In one of the two pairs of differential signal wafers, each differential signal wafer has a grounding pin and an offset grounding pin respectively arranged at two opposite ends of the column of mounting portions thereof, each offset grounding pin has an offset with respect to the corresponding column of mounting portions, the two distal ends of the mounting portions of each differential signal wafer are two signal mounting portions, cooperating with the two signal mounting portions of the other differential signal wafer. Thus, the grounding pin and the offset grounding pin of each differential signal wafer are configured to shield the adjacent signal mounting portions.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: April 25, 2017
    Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.
    Inventors: Chung-Nan Pao, Yu-Feng Ke, Sun-Yu Chou, Wei Wang
  • Patent number: 9214768
    Abstract: A transmission module of a communication connector includes a plurality of first signal terminals, a plurality of second signal terminals, and a plurality of ground terminals. The terminals are coupling along a coupling direction. Along the coupling direction, the grounding terminals respectively correspond to the first and second terminals, a main portion of each signal terminal is orthogonally projecting to an area of a main portion of the corresponding ground terminal, in which the area is located inside the contour of the main portion. Moreover, the width of the main portion is less than or equal to two times of the width of the main portion of the corresponding signal terminal. Thus, the instant disclosure provides the transmission module with novel type.
    Type: Grant
    Filed: December 17, 2013
    Date of Patent: December 15, 2015
    Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.
    Inventors: Chung-Nan Pao, Wei Wang, Sun-Yu Chou
  • Patent number: 9160123
    Abstract: A communication connector includes an outer casing and a plurality of transmission wafers inserted into the outer casing. The transmission wafers are provided for receiving a mating connector along an inserting direction. Each communication wafer includes at least two terminals in coplanar arrangement, and each terminal has a straight segment. The straight segments of the terminals are respectively arranged in a first acute angle and a second acute angle with respective to the inserting direction, in which the first acute angle is smaller than the second acute angle. Two virtual lines, which are respectively defined by extending from the straight segments along the longitudinal directions thereof, are intersecting to form an angle. The angle is the difference of the first and second acute angles. Thus, the communication connector provided by the instant disclosure is produced easily.
    Type: Grant
    Filed: July 21, 2014
    Date of Patent: October 13, 2015
    Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.
    Inventors: Chung-Nan Pao, Wei Wang, Sun-Yu Chou
  • Publication number: 20150171557
    Abstract: A transmission module of a communication connector includes a plurality of first signal terminals, a plurality of second signal terminals, and a plurality of ground terminals. The terminals are coupling along a coupling direction. Along the coupling direction, the grounding terminals respectively correspond to the first and second terminals, a main portion of each signal terminal is orthogonally projecting to an area of a main portion of the corresponding ground terminal, in which the area is located inside the contour of the main portion. Moreover, the width of the main portion is less than or equal to two times of the width of the main portion of the corresponding signal terminal. Thus, the instant disclosure provides the transmission module with novel type.
    Type: Application
    Filed: December 17, 2013
    Publication date: June 18, 2015
    Applicant: Topconn Electronic (Kunshan) Co., Ltd
    Inventors: CHUNG-NAN PAO, WEI WANG, SUN-YU CHOU
  • Patent number: D837738
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: January 8, 2019
    Assignee: CHIEF LAND ELECTRONIC CO., LTD.
    Inventors: Chung-Nan Pao, Chia-Feng Huang, Sun-Yu Chou
  • Patent number: D839833
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: February 5, 2019
    Assignee: CHIEF LAND ELECTRONIC CO., LTD.
    Inventors: Chung-Nan Pao, Chia-Feng Huang, Sun-Yu Chou