Abstract: The present invention provides a substrate for a semiconductor device and a semiconductor device using the same. The substrate for a semiconductor device comprises a ceramic supporting base plate formed by a polycrystalline aluminum nitride (AlN) sintered body; at least one silicon oxide layer formed on the base plate by a sol-gel method wherein the at least one silicon oxide layer has an average roughness less than the base plate to block polycrystalline orientation of the base plate and has a total thickness in a range of 10˜5000 nm, the silicon oxide layer is only formed from the sol-gel method and is not single crystalline; a first buffer layer comprising aluminum nitride (AlN) on the at least one silicon oxide layer with a thickness of 0.1˜10 ?m; and a gallium nitride layer formed on the first buffer layer and having a single-crystal crystalline structure.

Abstract: The present invention provides a substrate for a semiconductor device and a semiconductor device using the same. The substrate for a semiconductor device comprises a ceramic supporting base plate formed by a polycrystalline aluminum nitride (AlN) sintered body; at least one silicon oxide layer formed on the base plate by a sol-gel method wherein the at least one silicon oxide layer has an average roughness less than the base plate to block polycrystalline orientation of the base plate and has a total thickness in a range of 10˜5000 nm, the silicon oxide layer is only formed from the sol-gel method and are not single crystalline; a first buffer layer comprising aluminum nitride (AlN) on the at least one silicon oxide layer with a thickness of 0.1˜10 ?m; and a gallium nitride layer formed on the first buffer layer and having a single-crystal crystalline structure.

Abstract: A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.

Abstract: A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.

Abstract: A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.

Abstract: A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.

Abstract: A method for preparing an OLED by an imprinting process is disclosed, which comprises the following steps: (A) providing a substrate, and a first electrode is formed thereon; (B) coating a mold with a first organic material ink; (C) pressing the mold coated with the first organic material ink on the substrate to transfer the first organic material ink onto the first electrode of the substrate, to obtain a first light-emitting array; (D) baking the substrate having the first light-emitting array formed thereon; and (E) forming a second electrode on the first light-emitting array.

Abstract: Methods for preparing a patterned metal/metal oxide layer by using a solution type precursor or sol-gel precursor are provided and, especially, a method for preparing a patterned carrier transport of a solar cell and a method for preparing biomedical material are provided, which comprise the following steps: (A) providing a substrate, and a mold with designed patterns formed thereon; (B) coating the substrate with a solution of a precursor to form a precursor layer, wherein the precursor is a metal precursor or a metal oxide precursor; (C) pressing the mold together with the precursor layer to transfer the patterns of the mold onto the precursor layer; (D) curing or pre-curing the precursor layer; (E) removing the mold; and (F) conducting an optional post-treatment, if it being demanded, to further modify the properties of precursor layer.

Abstract: A method for fabricating an organic light-emitting diode employing a mixed host is disclosed, which comprises the following steps: (A) providing a substrate with a first electrode formed thereon; (B) coating a mold with a light-emitting layer material, wherein the light-emitting layer material comprises: a mixed host, and dye molecule(s) (or dye-function-group-composing materials) etc.; (C) pressing the mold coated with the light-emitting layer material onto the substrate to transfer the light-emitting layer material to the first electrode of the substrate, to form a light-emitting layer; and (D) forming a second electrode over the light-emitting layer. The mixed host consists of host-function molecule(s) and auxiliary additives. In addition, the present invention also provides a light-emitting diode, which is prepared by the aforementioned method.

Abstract: An organic solar cell with patterned electrodes comprises a first electrode layer, a second electrode layer and an organic active layer. The first electrode layer and the second electrode layer are arranged opposite to each other. The first electrode layer has a first carrier injection surface having a plurality of first protrusions. The organic active layer is arranged between the first electrode layer and the second electrode layer and has a first surface joined with the first carrier injection surface. The first surface is bonded to the first carrier injection surface to form a first carrier supply interface having a plurality of crests and troughs corresponding to the first protrusions. Thereby is increased the area of the first carrier supply interface, improved the carrier transport efficiency, and promoted the photoelectric conversion efficiency of the solar cell.

Abstract: The present invention discloses a method for manufacturing a high-quality organic light-emitting diode (OLED), and the method comprises the steps of: providing a substrate; providing at least one template engraved with a pattern; putting at least one organic light-emitting material onto the pattern of the template by an inking process; transferring the organic light-emitting material from the pattern of the template to the substrate by a contact printing process; forming at least one organic light-emitting layer on the substrate, wherein the organic light-emitting layer comprises a plurality of pixels which are arranged in a side by side manner with a complementary emission spectrum, so that the OLED possesses the property of high color rendering, color temperature tunable, or the combination thereof.

Abstract: A method for fabricating an organic light-emitting diode employing a mixed host is disclosed, which comprises the following steps: (A) providing a substrate with a first electrode formed thereon; (B) coating a mold with a light-emitting layer material, wherein the light-emitting layer material comprises: a mixed host, and dye molecule(s) (or dye-function-group-composing materials) etc.; (C) pressing the mold coated with the light-emitting layer material onto the substrate to transfer the light-emitting layer material to the first electrode of the substrate, to form a light-emitting layer; and (D) forming a second electrode over the light-emitting layer. The mixed host consists of host-function molecule(s) and auxiliary additives. In addition, the present invention also provides a light-emitting diode, which is prepared by the aforementioned method.

Abstract: A method for preparing an OLED by an imprinting process is disclosed, which comprises the following steps: (A) providing a substrate, and a first electrode is formed thereon; (B) coating a mold with a first organic material ink; (C) pressing the mold coated with the first organic material ink on the substrate to transfer the first organic material ink onto the first electrode of the substrate, to obtain a first light-emitting array; (D) baking the substrate having the first light-emitting array formed thereon; and (E) forming a second electrode on the first light-emitting array.

Abstract: Methods for preparing a patterned metal/metal oxide layer by using a solution type precursor or sol-gel precursor are provided and, especially, a method for preparing a patterned carrier transport of a solar cell and a method for preparing biomedical material are provided, which comprise the following steps: (A) providing a substrate, and a mold with designed patterns formed thereon; (B) coating the substrate with a solution of a precursor to form a precursor layer, wherein the precursor is a metal precursor or a metal oxide precursor; (C) pressing the mold together with the precursor layer to transfer the patterns of the mold onto the precursor layer; (D) curing or pre-curing the precursor layer; (E) removing the mold; and (F) conducting an optional post-treatment, if it being demanded, to further modify the properties of precursor layer.

Abstract: A method is disclosed for making a thin-film structure of a light-emitting device via nanoimprint. The method includes the steps of providing a light-emitting element, providing a film on the light-emitting element via spin coating precursor on the light-emitting element, forming a pattern on the film by nanoimprint; and curing the film. Thus, the precursor is transformed to the thin-film structure.

Abstract: A method for forming organic layers of electronic devices by contact printing is disclosed, which comprises: (A) providing a substrate, which has an electrode formed thereon; (B) coating an organic material ink onto a mold; (C) applying the ink-coated mold onto the substrate, to transfer the organic material ink onto the electrode of the substrate and then to form an organic layer; and (D) forming another electrode on the organic layer. In addition, after the step (C) is completed, the steps (B) to (C) can be repeated once or several times to form series of organic layers, if needed.

Abstract: A method for forming a patterned modified metal layer is disclosed, which comprises the following steps: (A) providing a metal base which is in the form of either a bulk metal or a metal coated substrate, and a mold with patterns; (B) applying the mold onto the metal base to transfer the patterns of the mold to the metal surface; (C) removing the mold; and (D) modifying the whole metal base or the, surface and a certain depth beneath the surface of metal base to form a modified metal layer with designated patterns.

Abstract: A manufacturing method and products of metallic friction materials includes processes of 1. preparing powder materials, 2. mixing copper as a base, proper proportion of iron powder or steel wool, aluminum powder, zinc or tin or lead powder, graphite powder and alumina or silicon dioxide powder, 3. pressing mixed materials into green bodies under 375.about.625 MPa at room temperature, 4. pre-heat treating the green bodies in an air furnace with temperature raised to 100.about.300.degree. C. for 1.about.3 hours, 5. sintering the green bodies into test samples under 350.about.750 MPa for 24.about.60 hours to gain sintered friction materials having an oxidized layer of less than 1 mm thick, 6. processing and grinding the sintered test samples with grinders to remove the oxidized layer, 7. washing the outer surface of the sintered test samples ground into finished products. The method of the invention may reduce largely difficulty in manufacturing processes, the investment and productive cost.