Patents by Inventor Sun-Zen Lin

Sun-Zen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package with exposed heat sink and the heat sink thereof
    Patent number: 7190067
    Abstract: A semiconductor package with an exposed heat sink and the heat sink thereof are proposed. A carrier having a first surface and a second surface is provided. At least one chip is mounted on the first surface of the carrier and electrically connected to the carrier. A heat sink includes a flat portion having an exposed surface, and a support portion extended peripherally from the flat portion and attached to the first surface of the carrier, wherein the flat portion, the support portion and the carrier form a space where the chip is received, and the flat portion is peripherally formed with a stepped structure having at least one flash preventing groove located at a position adjacent to the exposed surface so as to prevent resin flashes on the exposed surface of the heat sink during a molding process for forming an encapsulant that encapsulates the chip.
    Type: Grant
    Filed: January 4, 2005
    Date of Patent: March 13, 2007
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Yen-Chun Chen, Sun-Zen Lin, Chich-Yuan Chang
  • Semiconductor package with exposed heat sink and the heat sink thereof
    Publication number: 20050285258
    Abstract: A semiconductor package with an exposed heat sink and the heat sink thereof are proposed. A carrier having a first surface and a second surface is provided. At least one chip is mounted on the first surface of the carrier and electrically connected to the carrier. A heat sink includes a flat portion having an exposed surface, and a support portion extended peripherally from the flat portion and attached to the first surface of the carrier, wherein the flat portion, the support portion and the carrier form a space where the chip is received, and the flat portion is peripherally formed with a stepped structure having at least one flash preventing groove located at a position adjacent to the exposed surface so as to prevent resin flashes on the exposed surface of the heat sink during a molding process for forming an encapsulant that encapsulates the chip.
    Type: Application
    Filed: January 4, 2005
    Publication date: December 29, 2005
    Applicant: Siliconware Precision Industries Co., Ltd.
    Inventors: Yen-Chun Chen, Sun-Zen Lin, Chich-Yuan Chang