Patents by Inventor Sunaina Srivastava

Sunaina Srivastava has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with active shielding of leads
    Patent number: 9271390
    Abstract: A semiconductor device has a multi-wire lead and a die having a multi-site bond pad. A shielding wire and a guarded wire both extend from the multi-wire lead to the multi-site bond pad. The shielding wire (or wires) provide active shielding to the guarded wire by simultaneously transmitting the same signal as the guarded wire between the multi-wire lead the multi-site bond pad.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: February 23, 2016
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Sunaina Srivastava, Raza Imam, Gagan Kansal, Sumit Varshney
  • SEMICONDUCTOR DEVICE WITH ACTIVE SHIELDING OF LEADS
    Publication number: 20160021734
    Abstract: A semiconductor device has a multi-wire lead and a die having a multi-site bond pad. A shielding wire and a guarded wire both extend from the multi-wire lead to the multi-site bond pad. The shielding wire (or wires) provide active shielding to the guarded wire by simultaneously transmitting the same signal as the guarded wire between the multi-wire lead the multi-site bond pad.
    Type: Application
    Filed: July 15, 2014
    Publication date: January 21, 2016
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Sunaina Srivastava, Raza Imam, Gagan Kansal, Sumit Varshney
  • POWER PLANE FOR MULTI-LAYERED SUBSTRATE
    Publication number: 20140339687
    Abstract: A semiconductor device includes a ground plane and a power plane that lie in spaced, parallel planes. The power plane includes a number of openings formed around its outer edge. A ground ring surrounds the power plane and has fingers that extend towards and are received within corresponding ones of the openings of the power plane. The ground ring is electrically connected to the ground plane with vias.
    Type: Application
    Filed: May 15, 2013
    Publication date: November 20, 2014
    Inventors: Shailesh Kumar, Sunaina Srivastava, Swapnil Tiwari, Chetan Verma