Abstract: An automatic analysis device includes a processing unit 3 which performs the treatment on a specimen before analysis of the specimen, supply equipment which supplies a reagent to a reaction vessel 11 disposed in the processing unit 3, a liquid temperature adjusting unit 1 which adjusts a temperature of the reagent supplied to the reaction vessel 11 by the supply equipment, a control unit 201, and a first temperature detection unit 4 which detects at least one temperature of a temperature of the air within the processing unit 3 and a temperature of the reagent supplied to the reaction vessel 11, in which the liquid temperature adjusting unit 1 and the control unit 201 execute temperature adjustment of the reagent based on a first temperature detected by the first temperature detection unit 4.

Abstract: Provided is an automated analyzer comprising a temperature regulator that can be made more compact in size while maintaining high-precision temperature regulation. In a temperature-regulating unit (20) of the automated analyzer, a first chemical reservoir (1) is constituted by a large-diameter spiral-shaped pipe, and a second chemical reservoir (2) is constituted by a large-diameter chemical reservoir container. The first chemical reservoir (1), which is positioned upstream of the second chemical reservoir (2), has an internal capacity that is set so as to be greater than the volume of a single discharge of each of syringe pumps (29, 30, 31), and the second chemical reservoir (2) also has an internal capacity (volume) that is set so as to be greater than the volume of a single discharge of each of the respective syringe pumps (29, 30, 31).

Abstract: To provide a reagent cooler reduced in size as compared with that in the related art by reducing a thickness of a heat insulation material of the reagent cooler, and an automated analyzer including the reagent cooler. In the reagent cooler of the automated analyzer, a vacuum heat insulation material is disposed in a periphery (on a side surface, or/and upper and lower portions) of a cooling jacket of the reagent cooler. Then, an end portion of the vacuum heat insulation material is disposed at a position shifted from upper and lower end portions and a side surface end portion of the cooling jacket and a distance between the end portion of the vacuum heat insulation material and the cooling jacket is taken as much as possible.

Abstract: Provided is an automatic analysis device capable of adjusting the temperature of a plurality of portions requiring temperature control with less power consumption as a whole.

Abstract: An automatic analysis device includes a processing unit 3 which performs the treatment on a specimen before analysis of the specimen, supply equipment which supplies a reagent to a reaction vessel 11 disposed in the processing unit 3, a liquid temperature adjusting unit 1 which adjusts a temperature of the reagent supplied to the reaction vessel 11 by the supply equipment, a control unit 201, and a first temperature detection unit 4 which detects at least one temperature of a temperature of the air within the processing unit 3 and a temperature of the reagent supplied to the reaction vessel 11, in which the liquid temperature adjusting unit 1 and the control unit 201 execute temperature adjustment of the reagent based on a first temperature detected by the first temperature detection unit 4.

Abstract: Provided is an automated analyzer comprising a temperature regulator that can be made more compact in size while maintaining high-precision temperature regulation. In a temperature-regulating unit (20) of the automated analyzer, a first chemical reservoir (1) is constituted by a large-diameter spiral-shaped pipe, and a second chemical reservoir (2) is constituted by a large-diameter chemical reservoir container. The first chemical reservoir (1), which is positioned upstream of the second chemical reservoir (2), has an internal capacity that is set so as to be greater than the volume of a single discharge of each of syringe pumps (29, 30, 31), and the second chemical reservoir (2) also has an internal capacity (volume) that is set so as to be greater than the volume of a single discharge of each of the respective syringe pumps (29, 30, 31).

Abstract: The present invention equalizes the temperatures of semiconductor elements and efficiently cools the semiconductor elements in a lightweight device configuration, by optimally combining the configurations of heat radiation fins in accordance with the configuration of the semiconductor elements. A traction converter includes plural semiconductor elements included in a traction converting circuit and a cooler to radiate heat from the plural semiconductor elements to outside air, the cooler including a heat receiving block, plural heat pipes and plural heat radiation fins, the plural semiconductor elements being arrayed on one surface of the heat receiving block, heat receiving parts of the plural heat pipes being buried in the opposite surface of the heat receiving block, heat radiation parts of the plural heat pipes being erectly provided so as to protrude from the heat receiving block, the plural heat radiation fins being joined to the heat radiation parts.

Abstract: A cooling system for an onboard electrical power converter in which a heat dissipation surface extends parallel to a flow of cooling air draft includes: a coolant tank containing coolant that includes a bottom surface being in thermal contact with the heat dissipation surface; a first conduit provided connecting to an upper surface of the coolant tank, the coolant flowing into the first conduit; a heat exchanger that comprises second conduits arranged with opposing the upper surface, and conducts the coolant to upstream; and a return unit that returns the coolant to the coolant tank; wherein the heat exchanger comprises heat dissipation fins through which the cooling air draft passes from a first to a second side, the heat dissipation fins being provided on surfaces of the second conduits, the first side not facing the coolant tank and the second side facing the coolant tank.

Abstract: A power converter including: a plurality of semiconductor devices forming a power conversion circuit; a base section to which the plurality of semiconductor devices are attached; and radiating fins dissipating heat generated from the semiconductor devices into outside air, in the power converter in which the direction of the flow of a refrigerant flowing into the radiating fins changes depending on the operation status of the power conversion circuit, the shape of each radiating fin changes in such a way that the cross-sectional area of a channel of the refrigerant on the outflow side becomes smaller than the cross-sectional area of the channel of the refrigerant on the inflow side in the radiating fins depending on the direction of the flow of the refrigerant.

Abstract: A power converter including: a plurality of semiconductor devices forming a power conversion circuit; a base section to which the plurality of semiconductor devices are attached; and radiating fins dissipating heat generated from the semiconductor devices into outside air, in the power converter in which the direction of the flow of a refrigerant flowing into the radiating fins changes depending on the operation status of the power conversion circuit, the shape of each radiating fin changes in such a way that the cross-sectional area of a channel of the refrigerant on the outflow side becomes smaller than the cross-sectional area of the channel of the refrigerant on the inflow side in the radiating fins depending on the direction of the flow of the refrigerant.

Abstract: A driver circuit that lowers the dependence of the loss in the wide gap semiconductor device upon the temperature is provided. A gate driver circuit for voltage driven power semiconductor switching device includes a power semiconductor switching device, a driver circuit for supplying a drive signal to a gate terminal of the switching device with reference to an emitter control terminal or a source control terminal of the switching device, and a unit for detecting a temperature of the switching device. The temperature of the power semiconductor switching device is detected, and a gate drive voltage or a gate drive resistance value is changed based on the detected temperature.

Abstract: A cooling system for an onboard electrical power converter in which a heat dissipation surface extends parallel to a flow of cooling air draft includes: a coolant tank containing coolant that includes a bottom surface being in thermal contact with the heat dissipation surface; a first conduit provided connecting to an upper surface of the coolant tank, the coolant flowing into the first conduit; a heat exchanger that comprises second conduits arranged with opposing the upper surface, and conducts the coolant to upstream; and a return unit that returns the coolant to the coolant tank; wherein the heat exchanger comprises heat dissipation fins through which the cooling air draft passes from a first to a second side, the heat dissipation fins being provided on surfaces of the second conduits, the first side not facing the coolant tank and the second side facing the coolant tank.

Abstract: An electric power converter for a vehicle, including a semiconductor element from which a motor drive current is output, a drive circuit that drives the semiconductor element, a control circuit that controls the drive circuit, a capacitor that smooths a DC current to be input to the semiconductor element, a container housing the semiconductor element, the drive circuit, the control circuit and the capacitor, a refrigerant retained in a state of vapor-liquid two-phase equilibrium within the container, and a heat exchanger unit that condenses the refrigerant in a vapor phase to be a liquid phase and exchanges heat with outside, wherein the semiconductor element, the drive circuit, the control circuit and the capacitor are disposed in a positional arrangement that will leave the semiconductor element, the drive circuit, the control circuit and the capacitor immersed in the refrigerant as the electric power converter is installed in the vehicle, and the heat exchanger unit is disposed at a side of a wall of the c

Abstract: An electric power converter for a vehicle, including a semiconductor element from which a motor drive current is output, a drive circuit that drives the semiconductor element, a control circuit that controls the drive circuit, a capacitor that smooths a DC current to be input to the semiconductor element, a container housing the semiconductor element, the drive circuit, the control circuit and the capacitor, a refrigerant retained in a state of vapor-liquid two-phase equilibrium within the container, and a heat exchanger unit that condenses the refrigerant in a vapor phase to be a liquid phase and exchanges heat with outside, wherein the semiconductor element, the drive circuit, the control circuit and the capacitor are disposed in a positional arrangement that will leave the semiconductor element, the drive circuit, the control circuit and the capacitor immersed in the refrigerant as the electric power converter is installed in the vehicle, and the heat exchanger unit is disposed at a side of a wall of the c

Abstract: The object of the present invention provides an evaluation system for evaluating accurately emission amount of environmental influence substance of fuel in a fuel supply facility for supplying stored fuel to a consumer. An evaluation system evaluates the emission amount of environmental influence substance of fuel in which the environmental properties (greenhouse gas emissions) accumulated in the process of drilling a first energy, transporting and storing, producing fuel, and supplying the fuel are taken into account. The evaluation system enables to present the environmental properties of the sold fuel to the fuel consumer and allows the fuel consumer to select, thereby promoting the reduction of emission amount of the greenhouse gas of the fuel supplier and the fuel consumer.

Abstract: In a conventional hybrid scheme used to mount a rechargeable battery in a motor vehicle, store into the battery the electric power that has been obtained via a regenerative brake, and utilize the power during acceleration of the vehicle, when a temperature rise of the battery due to charging or discharging causes a temperature of the battery to stay outside a defined range, it has been absolutely necessary to stop the battery charge or discharge, and fuel efficiency has decreased. This invention predicts a charge level and temperature of a rechargeable battery from the cruising input/output power requirements calculated from route information and historical records of cruising, prevents a stoppage of the battery by calculating chronological engine output and brake control data for the temperature to stay within a defined range, and hence improves fuel efficiency.

Abstract: A power semiconductor module having an increased reliability against thermal fatigue includes a power semiconductor element, a lower-side electrode connected to the lower side of the element, a first insulating substrate connected to the upper side of the lower-side electrode and having metallic foils bonded on both surfaces thereof, an upper-side electrode connected to the upper side of the power semiconductor element, a second insulating substrate connected to the upper side of the upper-side electrode and having metallic foils bonded on both surfaces thereof, a first heat spreader connected to the lower side of the first insulating substrate, and a second heat spreader connected to the upper side of the second insulating substrate. The power semiconductor element and the first and second insulating substrates are sealed with a resin.

Abstract: A power semiconductor module includes: a power semiconductor device; a first heat dissipation plate; a second heat dissipation plate; a first channel; a second channel; a first channel wall; a second channel wall; a first refrigerant outlet provided on the first channel wall in a position corresponding to the power semiconductor device; a second refrigerant outlet provided on the second channel wall in a position corresponding to the power semiconductor device; first pin fins provided on at least one of the first heat dissipation plate and the second heat dissipation plate so as to be arranged radially around at least one of the first refrigerant outlet and the second refrigerant outlet; and second pin fins arranged in a staggered manner or in a tessellated manner around the first pin fins that are arranged radially.

Abstract: A power semiconductor module with its thermal resistance and overall size reduced. Insulating substrates with electrode metal layers disposed thereon are joined to both the surfaces of a power semiconductor chip by using, for example, soldering. Metal layers are disposed also on the reverse surfaces of the insulating substrates and the metal layers are joined to the heat spreaders by using brazing. Heat radiating fins are provided on the heat radiating surface of at least one of the heat spreaders. The heat radiating side of each of the heat spreaders is covered by a casing to form a refrigerant chamber through which refrigerant flows to remove heat transmitted from the semiconductor chip to the heat spreader.

Abstract: A power semiconductor module includes first and second insulating substrates, a power semiconductor device joined directly or through another element to opposite sides of the first and second insulating substrates and first and second heat spreaders joined with joining material having fluidity upon joining so as to put the first and second insulating substrates between the first and second heat spreaders. When the power semiconductor module is fabricated, the first and second insulating substrates are joined to the first and second heat spreaders, respectively, in the state that weight bearing on joining material is reduced by means of resilient member.