Patents by Inventor Sunao Yasui

Sunao Yasui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making multi-layer printed wiring boards
    Patent number: 4668332
    Abstract: A multi-layer printed wiring board in which an internal board has a wiring pattern on both sides. Two conductive plates for establishing respective voltage planes are formed with a pattern of grooves to match the wiring pattern of the internal board. The internal board is then sandwiched to the two sides of the conductive plates, with the grooves registering with the wiring pattern, and with intermediate insulating layers. Further, insulated wiring patterns are formed on the exterior sides of the conductive plates together with through-holes through the assembly.
    Type: Grant
    Filed: April 26, 1985
    Date of Patent: May 26, 1987
    Assignee: NEC Corporation
    Inventors: Hidebumi Ohnuki, Toshiaki Asano, Takashi Atarashi, Sunao Yasui