Patents by Inventor Sundar A L Natarajan Yoganandan

Sundar A L Natarajan Yoganandan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for regulating light administered at a patient treatment site
    Publication number: 20060095100
    Abstract: In one embodiment, apparatus is provided with at least one solid-state light emitter, at least one fiber optic light guide, at least one photosensor, and a control system. Each of the at least one fiber optic light guide has a first end that is independently positionable with respect to the solid-state light emitter(s) to receive the light emitted by the solid-state light emitter(s). Each photosensor is positioned to receive light emitted from a second end of one of the light guides. The control system is operably associated with the solid-state light emitter(s) and the photosensor(s) to regulate the light output of the light emitter(s) in accordance with measurements received from the photosensor(s).
    Type: Application
    Filed: October 29, 2004
    Publication date: May 4, 2006
    Inventors: Kian Shin Lee, Thye Linn Mok, Kheng Leng Tan, Fakhrul Arifin Mohd Afif, Siew It Pang, Yew Cheong Kuan, Norfidathul Aizar Abdul Karim, Su Lin Oon, Wen Ya Ou, Sundar A/L Natarajan Yoganandan
  • Light source
    Patent number: 6949771
    Abstract: A light source suitable for surface mounting onto a printed circuit board. The light source includes a planar substrate with a centrally positioned aperture. A light emitting diode is mounted on a metallic layer covering the bottom of the aperture, and is encapsulated by a transparent encapsulant material. The metallic layer provides a thermal path for heat generated by the light emitting diode.
    Type: Grant
    Filed: April 23, 2002
    Date of Patent: September 27, 2005
    Assignee: Agilent Technologies, Inc.
    Inventors: Sundar A/L Natarajan Yoganandan, Seong Choon Lim
  • Light source
    Patent number: 6806583
    Abstract: A light source suitable for surface mounting onto a printed circuit board. The light source includes a planar substrate with a centrally positioned recess. A light emitting diode is mounted in the recess and the substrate is encapsulated by a transparent encapsulant material forming an ellipsoidal dome over the light emitting diode.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: October 19, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Huck Khim Koay, Seong Choon Lim, Cheng Why Tan, Gurbir Singh A/L Balwant Singh, Chee Keong Chong, Sundar a/l Natarajan Yoganandan
  • Light source
    Publication number: 20020163006
    Abstract: A light source suitable for surface mounting onto a printed circuit board. The light source includes a planar substrate with a centrally positioned aperture. A light emitting diode is mounted on a metallic layer covering the bottom of the aperture, and is encapsulated by a transparent encapsulant material. The metallic layer provides a thermal path for heat generated by the light emitting diode.
    Type: Application
    Filed: April 23, 2002
    Publication date: November 7, 2002
    Inventors: Sundar A/L Natarajan Yoganandan, Seong Choon Lim
  • Method of interconnecting an electronic device
    Patent number: 6242280
    Abstract: A method of interconnecting bond pads on a semiconductor die to leads of a package is disclosed. The method includes placing a connector over each bond pad and its corresponding lead. The connector is one of a plurality of ganged connectors. The method also includes electrically connecting the connector to the bond pad and the lead and singularizing the connector from the plurality of ganged connectors. Such a method of interconnection has the advantage of simultaneously interconnecting multiple bond pads to leads. In a preferred embodiment, light-emitting diodes (LEDs) are manufactured using the method. A PCB is etched to produced lead pairs of the LEDs. A semiconductor die is attached to a first lead of each lead pair. Ganged interconnects are aligned with and tagged onto the dies and the second leads of the lead pairs, thereby electrically connecting them. After tagging, the interconnects are singularized. An encapsulant is applied on each die and interconnect.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: June 5, 2001
    Assignee: Agilent Technologies, Inc.
    Inventors: Huck Khim Koay, Cheng Why Tan, Chee Keong Chong, Gurbir Singh, Sundar A L Natarajan Yoganandan, Seong Choon Lim