Patents by Inventor Sundar Raman Ghana Sambandam

Sundar Raman Ghana Sambandam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical device
    Patent number: 10566467
    Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: February 18, 2020
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang Ng, Simon Gubser, James Eilertsen, Sundar Raman Ghana Sambandam
  • THIN OPTOELECTRONIC MODULES WITH APERTURES AND THEIR MANUFACTURE
    Publication number: 20190097066
    Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.
    Type: Application
    Filed: November 15, 2016
    Publication date: March 28, 2019
    Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang NG, Simon Gubser, James Eilertsen, Sundar Raman Ghana Sambandam