Abstract: A multichip module includes a series of light sources arranged in a planar array, separated by a distance d1 in the x-direction and d2 in the y-direction apart, or they could be spaced different distances apart which are mounted onto an aluminum oxide metal substrate. A uniform light transmissive layer being disposed over said series of light sources having a thickness t, measure from the top of the light sources. A phosphor resin being formed above this light transmissive layer. An encapsulant having a domed portion which functions as a lens, overlaying the phosphor resin to encapsulate the array of light sources. The light transmissive layer, phosphor resin layer and the encapsulant may be formed using an injection molding process.

Abstract: In one embodiment, an opto-electronic package includes a substrate, a cavity, mounting pads and transverse walls interspersed along the cavity, pads separated by transverse walls, and transverse walls being lower than cavity-defining walls; and LED dice mounted to the pads. In another embodiment, a system is disclosed for backlighting an LCD screen. The system includes an opto-electronic package having a substrate; LED dice mounted to the substrate; an encapsulant disposed over LED dice; and a light guide having an input portion to receive light provided by LED dice, the input portion in attachment to encapsulant, and an output portion configured to transmit light to LCD screen. In yet another embodiment, a method of manufacturing an opto-electronic package includes: fabricating a substrate; attaching LED dice to the substrate; electrically connecting each LED dice to an outer portion of the substrate; and disposing encapsulant over the LED dice.

Abstract: A thermally controllable substrate is disclosed. The substrate supports a heat generating source. One of more microchannels are embedded within the substrate and preferably circulate a cooling fluid to dissipate heat being generated by the source. The flow of the cooling fluid serves to remove heat entering the substrate proximate the source providing for the use of enhanced electrical devices which generate more heat in their normal operation.

Abstract: A light source having light emitting modules coupled to a flexible circuit carrier. The flexible circuit carrier includes a sheet of flexible material having electrically conducting traces connecting a circuit mounting area and a connector region. The light emitting modules are electrically connected to the circuit mounting area. In one embodiment, the light emitting modules are arranged in a linear array. The light source preferably includes a light pipe having a planar layer of transparent material, the light emitting modules being bonded to an edge of the planar layer. The light pipe is preferably attached to a printed circuit board and the connection region of the flexible circuit carrier is attached to the printed circuit board. The flexible circuit carrier can move heat from the light emitting modules to the printed circuit board as well as providing electrical connections.

Abstract: A compliant interface is added above the top housing of a light source, such as an LED during LED manufacture. The compliant interface allows for a low light loss transfer between the surface of the light guide material. The compliant structure is, in one embodiment, a light transparent compliant silicone molded (by curing the liquid silicone) onto the top surface of the light source. In one embodiment, the compliant interface can be integrated as part of the encapsulated material surrounding the LED chip.

Abstract: In one embodiment, an opto-electronic package includes a substrate, a cavity, mounting pads and transverse walls interspersed along the cavity, pads separated by transverse walls, and transverse walls being lower than cavity-defining walls; and LED dice mounted to the pads. In another embodiment, a system is disclosed for backlighting an LCD screen. The system includes an opto-electronic package having a substrate; LED dice mounted to the substrate; an encapsulant disposed over LED dice; and a light guide having an input portion to receive light provided by LED dice, the input portion in attachment to encapsulant, and an output portion configured to transmit light to LCD screen. In yet another embodiment, a method of manufacturing an opto-electronic package includes: fabricating a substrate; attaching LED dice to the substrate; electrically connecting each LED dice to an outer portion of the substrate; and disposing encapsulant over the LED dice.

Abstract: A light source having light emitting modules coupled to a flexible circuit carrier. The flexible circuit carrier includes a sheet of flexible material having electrically conducting traces connecting a circuit mounting area and a connector region. The light emitting modules are electrically connected to the circuit mounting area. In one embodiment, the light emitting modules are arranged in a linear array. The light source preferably includes a light pipe having a planar layer of transparent material, the light emitting modules being bonded to an edge of the planar layer. The light pipe is preferably attached to a printed circuit board and the connection region of the flexible circuit carrier is attached to the printed circuit board. The flexible circuit carrier can move heat from the light emitting modules to the printed circuit board as well as providing electrical connections.

Abstract: A device includes a header, a cap having an unsealed aperture attached to the header, and a laser device disposed on the header configured so as to emit through the unsealed aperture. A passivation layer at least partially encapsulates the VCSEL chip.

Abstract: A light source is disclosed. The light source has a light-emitting chip that includes an LED that generates light in an active region thereof. The LED emits a light signal in a forward direction, and infrared radiation generated in the active region is emitted in a side direction in the form of a first infrared signal. The first light signal is determined by a first drive signal coupled to the LED. The light source also includes an infrared detector positioned to collect a portion of the infrared signal. The infrared detector generates a heat signal indicative of the amount of infrared radiation detected. A controller generates the drive signal so as to maintain the heat signal at a first target value. In light sources having LEDs that emit in different spectral ranges, the infrared detectors can all detect heat in the same spectral range.

Abstract: A light source and a method for operating the same are disclosed. The light source includes a light emitter and a controller. The light emitter generates light in response to a control signal coupled thereto. The light emitter is characterized by an age related to the amount of light that has been cumulatively generated by the light emitter, the generated light for a given control signal changing with the age. The controller measures the age of the light emitter and generates the control signal based on the desired light intensity and the measured age of the light emitter. In one embodiment, the controller stores an age value for the light emitter, and the controller determines the control signal in response to an input signal specifying a desired light intensity from the light emitter, the controller updating the age value each time the control signal is determined.

Abstract: Illumination apparatus includes a support structure, at least one light emitting element, and a heat sink thermally coupled to the light emitting element. The light emitting element and heat sink are moveable in relation to the support structure. An actuator system moves the at least one light emitting element and the heat sink with respect to the support structure.

Abstract: A light emitting device assembly comprises a light emitting diode (LED) chip, a substrate with two terminals, at least one encapsulation layer, and a thermally conductive adhesive to connect the LED chip and the substrate. The first terminal of the substrate is comprised of a portion with a width at least as wide as the LED chip and a vertical cross-sectional area of at least 30% of the total vertical cross-sectional area of the encapsulated assembly, and a straight element. The enlarged first terminal portion provides more area for heat dissipation and conduction, and along with the thermally conductive adhesive and the encapsulation package, provide enhanced thermal conductivity.