Patents by Inventor Sundaram Kumar

Sundaram Kumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070184289
    Abstract: A thermally and electrically conductive material is provided as a mixture of a dimethylpolysiloxane, metal (or one metal coated with another metal) flakes and/or granules, a peroxide-based and/or a dimethyl hexane based catalyst, PTFE powder and a platinum based fire retardant. The thermally and electrically conductive material may be pre-formed into a film or pad and each side of the film protected with removable release layers. The thermally and electrically conductive material may alternatively be produced in a screen-printable paste. As such, a layer of the thermally and electrically conductive paste may be screen-printed on the metal surface in a complete sheet form or as a patterned film by using a stencil patterned screen mesh. Processes for manufacturing high- and low-frequency circuits that include the interface material are also provided.
    Type: Application
    Filed: February 8, 2006
    Publication date: August 9, 2007
    Applicant: American Standard Circuits
    Inventors: Sundaram Kumar, Gary Sites, Bhavik Patel
  • Publication number: 20070113399
    Abstract: A thermally conductive material is provided as a mixture of a silicone, a ceramic powder, and a curing catalyst. The material may be pre-formed into a pad and each side of the film protected with removable release layers. Each side of the film may also include a coating of an adhesive material that aids in coupling the interface film with a surface. The material may alternatively be produced in a screen-printable paste. As such, a layer of the paste may be screen-printed on a surface as complete sheet form or as a patterned film by using a stencil patterned screen mesh. The interface material is sandwiched between a printed circuit board and a heat sink to form the circuit board assembly. In a multi-step press process, the assembly is cured and a laminate formed. The assembly process may also include a priming function that prepares metal surfaces of the circuit board and heat sink for receiving the interface material.
    Type: Application
    Filed: November 7, 2006
    Publication date: May 24, 2007
    Applicant: American Standard Circuits, Inc.
    Inventors: Sundaram Kumar, Gary Sites, Bhavik Patel
  • Publication number: 20060266475
    Abstract: A thermally conductive material is provided as a mixture of a silicone, a ceramic powder, and a curing catalyst. The material may be pre-formed into a pad and each side of the film protected with removable release layers. Each side of the film may also include a coating of an adhesive material that aids in coupling the interface film with a surface. The material may alternatively be produced in a screen-printable paste. As such, a layer of the paste may be screen-printed on a surface as complete sheet form or as a patterned film by using a stencil patterned screen mesh. The interface material is sandwiched between a printed circuit board and a heat sink to form the circuit board assembly. In a multi-step press process, the assembly is cured and a laminate formed. The assembly process may also include a priming function that prepares metal surfaces of the circuit board and heat sink for receiving the interface material.
    Type: Application
    Filed: May 24, 2005
    Publication date: November 30, 2006
    Applicant: American Standard Circuits, Inc.
    Inventors: Sundaram Kumar, Gary Sites