Patents by Inventor Sundarraj Chandran

Sundarraj Chandran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoelectric semiconductor device and method of making same
    Patent number: 11901260
    Abstract: A thermoelectric semiconductor device includes a heat dissipating semiconductor module and a stack of flash memory dies mounted on a substrate. The heat dissipating module comprises a first semiconductor die such as a controller, and a second semiconductor die such as a thermoelectric semiconductor die to cool the first semiconductor die during operation. The thermoelectric semiconductor die may be mounted to the controller die at the wafer level.
    Type: Grant
    Filed: September 2, 2022
    Date of Patent: February 13, 2024
    Assignee: Western Digital Technologies, Inc.
    Inventors: Jiandi Du, Yazhou Zhang, Binbin Zheng, Sundarraj Chandran, Wenbin Qu, Chin-Tien Chiu
  • THERMOELECTRIC SEMICONDUCTOR DEVICE AND METHOD OF MAKING SAME
    Publication number: 20220415750
    Abstract: A thermoelectric semiconductor device includes a heat dissipating semiconductor module and a stack of flash memory dies mounted on a substrate. The heat dissipating module comprises a first semiconductor die such as a controller, and a second semiconductor die such as a thermoelectric semiconductor die to cool the first semiconductor die during operation. The thermoelectric semiconductor die may be mounted to the controller die at the wafer level.
    Type: Application
    Filed: September 2, 2022
    Publication date: December 29, 2022
    Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Jiandi Du, Yazhou Zhang, Binbin Zheng, Sundarraj Chandran, Wenbin Qu, Chin-Tien Chiu
  • Thermoelectric semiconductor device and method of making same
    Patent number: 11444001
    Abstract: A thermoelectric semiconductor device includes a heat dissipating semiconductor module and a stack of flash memory dies mounted on a substrate. The heat dissipating module comprises a first semiconductor die such as a controller, and a second semiconductor die such as a thermoelectric semiconductor die to cool the first semiconductor die during operation. The thermoelectric semiconductor die may be mounted to the controller die at the wafer level.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: September 13, 2022
    Assignee: Western Digital Technologies, Inc.
    Inventors: Jiandi Du, Yazhou Zhang, Binbin Zheng, Sundarraj Chandran, Wenbin Qu, Chin-Tien Chiu