Patents by Inventor Sundeep Mandal

Sundeep Mandal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Techniques for integrating thermal via structures in integrated circuits
    Patent number: 9659835
    Abstract: A technique for designing an integrated circuit includes placing standard cells across a first surface of a substrate of an integrated circuit (IC) design. At least two unoccupied regions are located across the first surface that do not include standard cells. Aspect ratios for one or more micro fill vias that can be placed in the at least two unoccupied regions are determined. The one or more micro fill vias are placed in the at least two unoccupied regions. Finally, one or more partial thermal vias are placed from a second surface of the integrated circuit, opposite the first surface, to thermally couple the one or more partial thermal vias to the one or more micro fill vias to create thermal paths from the first surface to the second surface.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: May 23, 2017
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Jeffrey P. Gambino, Richard S. Graf, Sundeep Mandal