Patents by Inventor Suneel Kumar Parmeshwar DIGGI

Suneel Kumar Parmeshwar DIGGI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10582435
    Abstract: A method and system for handling a wireless communication in a Voice over Wireless Fidelity (VoWiFi) system including a plurality of nodes is provided. The method includes detecting, by a VoWiFi controller, a wireless connection between an electronic device and a first node from among the plurality of nodes; determining, by the VoWiFi controller, a performance of each of the plurality of nodes; detecting, by the VoWiFi controller, that a first performance of the first node is less than a second performance of a second node from among the plurality of nodes; and performing, by the VoWiFi controller, a handover of the electronic device from the first node to the second node.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sandesh Kumar Srivastava, Harikrishnan Natarajan, Suneel Kumar Parmeshwar Diggi, Hong-Shik Kim, Madhan Raj Kanagarathinam, Siva Naga Kumar Venkata Atmakuri, Sung-In Kim
  • Publication number: 20190037465
    Abstract: A method and system for handling a wireless communication in a Voice over Wireless Fidelity (VoWiFi) system including a plurality of nodes is provided. The method includes detecting, by a VoWiFi controller, a wireless connection between an electronic device and a first node from among the plurality of nodes; determining, by the VoWiFi controller, a performance of each of the plurality of nodes; detecting, by the VoWiFi controller, that a first performance of the first node is less than a second performance of a second node from among the plurality of nodes; and performing, by the VoWiFi controller, a handover of the electronic device from the first node to the second node.
    Type: Application
    Filed: July 27, 2018
    Publication date: January 31, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sandesh Kumar SRIVASTAVA, Harikrishnan NATARAJAN, Suneel Kumar Parmeshwar DIGGI, Hong-Shik KIM, Madhan Raj KANAGARATHINAM, Siva Naga Kumar Venkata ATMAKURI, Sung-In KIM