Abstract: Disclosed is a thin film circuit substrate and a manufacturing method thereof, which are capable of forming a pattern having a feature size of less than 10 ?m by forming a seed layer and a plating layer on a base substrate and then forming, through electrospinning, a photoresist layer having a thickness in a set range. The disclosed thin film circuit substrate comprises: a base substrate; a thin film seed layer formed on the top surface of the base substrate; a metal layer formed on the top surface of the thin film seed layer; and a photoresist layer formed on the top surface of the metal layer, wherein the thickness of the photoresist layer is in a range of 1 ?m to 5 ?m.

Abstract: A liquefied gas treatment system according to an embodiment of the present invention includes a boil-off gas heat exchanger exchanging heat between boil-off gas, pressurized by a boil-off gas compressor and recovered along a boil-off gas supply line branching off upstream of a liquefied gas-consuming unit, and the boil-off gas supplied from a liquefied gas storage tank, wherein the boil-off gas heat exchanger cools the boil-off gas, recovered along the boil-off gas supply line, with the boil-off gas, supplied from the liquefied gas storage tank, or flash gas, supplied through a vapor recovery line.

Abstract: Disclosed is a method for manufacturing a substrate for a touch screen panel in which a signal line pattern having a fine line width may be formed by forming a thin film deposition in a bezel region of a transparent substrate and forming a photoresist layer on a thin film deposition layer through an electrospinning process. The disclosed method for manufacturing a substrate for a touch screen panel comprises the steps of: preparing a plate-shaped transparent substrate having a sensing region and a bezel region located on the outer periphery of the sensing region; forming a transparent electrode layer in the sensing region of the transparent substrate; forming a thin film deposition layer in the bezel region of the transparent substrate; and forming a photoresist layer on an upper surface of the thin film deposition layer through an electrospinning process.

Abstract: The present disclosure relates to an apparatus for sensing touch pressure. The apparatus for sensing touch pressure, according to one mode of the present disclosure, includes: a first substrate provided with a first electrode unit formed thereon; a second substrate provided with a second electrode unit formed thereon; and a porous membrane member provided between the first substrate and the second substrate and deformed or restored according to touch pressure applied to the first substrate.

Abstract: Disclosed are a printed circuit board manufactured by filling a via hole formed in a flexible board and a via hole formed in a cured base substrate and then laminating the flexible board and the cured base substrate and a method of manufacturing same. The method includes preparing a flexible board including a flexible region and a rigid region, preparing a cured base substrate, and laminating the cured base substrate on the rigid region of the flexible board, in which during the laminating, via holes respectively formed in the flexible board and the cured base substrate are first filled with a conductive material and then the flexible board and the cured base substrate are laminated.

Abstract: A ceramic substrate manufacturing method and a ceramic substrate manufactured thereby, may include a seed layer, a brazing filler layer, and a metal foil that are laminated on a ceramic substrate and that are brazed such that the metal foil is firmly bonded to the ceramic substrate by a brazing joint layer. Such methods and devices may substantially improve the adhesion of the metal foil and the ceramic substrate.

Abstract: Provided is a composition comprising 2,4,6-trihydroxyacetophenone (THA) as an active ingredient, and a method for preventing, alleviating or treating breast cancer using the composition by inhibiting the activity of polo-like kinase 1 (PLK1).

Abstract: A method for configuring a service function path (SFP) for a software defined network (SDN) based service function chain (SFC) may comprise configuring a SFC which is a set of ordered service functions (SFs) by reflecting requirements of a flow flowing into a network; generating a primary SFP that is a path through which the flow is to be actually transmitted in the network according to the SFC; generating a secondary SFP against an error of the primary SFP; and controlling a transmission path through which the flow is transmitted to be at least one of the primary SFP and the secondary SFP.

Abstract: The present disclosure relates to an apparatus for sensing touch pressure. The apparatus for sensing touch pressure, according to one mode of the present disclosure, includes: a first substrate provided with a first electrode unit formed thereon; a second substrate provided with a second electrode unit formed thereon; and a porous membrane member provided between the first substrate and the second substrate and deformed or restored according to touch pressure applied to the first substrate.

Abstract: A removal apparatus for removing residual gases and a substrate treating facility for removing residual gases is disclosed. The residual gas removal apparatus includes a housing, a gas supply for providing a non-reactive gas into the housing, a supporting member provided to support a substrate and positioned in the housing, a heat radiating member spaced apart from the supporting member and positioned in the housing, and a heating unit for providing heat toward the supporting member and positioned between the heat radiating member and the supporting member.

Abstract: Disclosed is a method of supported liquid extraction (SLE), wherein adsorption of at least one analyte to a solid phase is performed in the presence of salt. The method may include contacting a sample with salt, adsorption phase such as diatomaceous earth and optionally a subsequent step of phospholipid depletion. Also disclosed is a cartridge including two compartments, for salt and adsorption phase, and optionally a third compartment including a phospholipid depletion phase.

Abstract: A method for configuring a service function path (SFP) for a software defined network (SDN) based service function chain (SFC) may comprise configuring a SFC which is a set of ordered service functions (SFs) by reflecting requirements of a flow flowing into a network; generating a primary SFP that is a path through which the flow is to be actually transmitted in the network according to the SFC; generating a secondary SFP against an error of the primary SFP; and controlling a transmission path through which the flow is transmitted to be at least one of the primary SFP and the secondary SFP.

Abstract: A ceramic substrate manufacturing method and a ceramic substrate manufactured thereby, may include a seed layer, a brazing filler layer, and a metal foil that are laminated on a ceramic substrate and that are brazed such that the metal foil is firmly bonded to the ceramic substrate by a brazing joint layer. Such methods and devices may substantially improve the adhesion of the metal foil and the ceramic substrate.

Abstract: A liquefied gas treatment system includes: a liquefied gas supply line connected from a liquefied gas storing tank to a source of demand, a pump provided on the liquefied gas supply line, and configured to pressurize liquefied gas discharged from the liquefied gas storing tank, a heat exchanger provided on the liquefied gas supply line between the source of demand and the pump, and configured to heat exchange the liquefied gas supplied from the pump with heat transfer media, a media heater configured to heat the heat transfer media, a media circulation line connected from the media heater to the heat exchanger, and a controller configured to change a flow rate of the heat transfer media flowing into the media heater or calories supplied to the heat transfer media by the media heater on the basis of a flow rate of the liquefied gas supplied to the heat exchanger

Abstract: The present invention relates to a touch sensor for a touch screen panel, a method for manufacturing the touch sensor, and a touch screen panel including the touch sensor. The method includes: forming an electrode layer on a transparent substrate; forming a nanofiber layer on the electrode layer through electrospinning; and forming a porous electrode layer by etching the electrode layer using the nanofiber layer as an etching mask. Through this method, a touch sensor including a touch sensing circuit pattern provided with a plurality of exposure pores to expose the transparent substrate therethough is produced. Due to the pores formed in the touch sensing circuit pattern, visibility is ensured and durability and flexibility are improved. Furthermore, due to irregularity of line patterns of the touch sensing circuit pattern, a moire problem is solved and visibility of a touch screen panel is dramatically improved.

Abstract: A key apparatus of an electronic device is provided. The key apparatus includes a housing having a cylindrical portion, the cylindrical portion including an upper portion and a lower portion, the upper portion and the lower portion being open, a knob including a circular-plate portion, the circular plate portion having a concavo-convex portion, the concavo-convex portion including a concave portion and a convex portion arranged alternately in a circular shape and an extension portion extended from the circular-plate portion in a downward direction and inserted into a hollow of the cylindrical portion, and the knob moves on the circular-plate portion, an anti-deviation unit configured to prevent the knob from being deviated from the cylindrical portion, an elastic configured to elastically press the concavo-convex portion at a lower side of the circular-plate portion, and a switch connected to the extension portion and switches over movement of the extension portion is delivered.

Abstract: A junction box includes a main body in which circuit components are installed, a lower cover configured to cover a lower portion of the main body, one or more sockets installed on a lower surface of the main body, one or more connectors installed in the lower cover and configured to be coupled to the sockets, a single coupling bolt installed in the main body, and a single coupling nut installed in the lower cover and threadedly coupled to the coupling bolt. When rotationally operating the single coupling bolt, the main body is configured to move up or down with respect to the lower cover so that the sockets are coupled to or decoupled from the connectors while making up/down movement with respect to the connectors.

Abstract: A liquefied gas treatment system according to an embodiment of the present invention includes a boil-off gas heat exchanger exchanging heat between boil-off gas, pressurized by a boil-off gas compressor and recovered along a boil-off gas supply line branching off upstream of a liquefied gas-consuming unit, and the boil-off gas supplied from a liquefied gas storage tank, wherein the boil-off gas heat exchanger cools the boil-off gas, recovered along the boil-off gas supply line, with the boil-off gas, supplied from the liquefied gas storage tank, or flash gas, supplied through a vapor recovery line.

Abstract: Disclosed are a flexible printed circuit board and a method of manufacturing the same, wherein a deposition seed layer is formed on a substrate, a circuit cover layer having a circuit pattern groove in the shape of a circuit pattern is formed on the deposition seed layer, the circuit pattern groove is plated with a circuit plating layer, followed by etching, thus forming a circuit pattern, thereby realizing low-resistance characteristics, reducing manufacturing costs through a simple and easy manufacturing process, and increasing productivity.

Abstract: Disclosed are a non-shrink varistor substrate and a method of manufacturing the same, wherein the non-shrink varistor substrate includes: a reinforcement layer formed of a ceramic material; a thin bonding layer formed on the surface of the reinforcement layer; a first varistor layer formed on the thin bonding layer and including a plurality of inner electrode layers therein; and an outer electrode layer formed on the first varistor layer and electrically connected to the inner electrode layers by a conductive material loaded in a via hole formed through the first varistor layer, the thin bonding layer and the reinforcement layer, and also wherein bondability and bonding reliability can be enhanced upon heterobonding of the reinforcement layer and the varistor layer.