Abstract: A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.

Abstract: A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.

Abstract: An inspection apparatus for a semiconductor process and a semiconductor process device, the inspection apparatus including a transferer configured to transfer a process object between a plurality of chambers; at least one line camera installed above the transferer, the at least one line camera being configured to generate an original image by capturing an image of the process object transferred by the transferer; and a controller configured to receive the original image and to perform an inspection of the process object by correcting distortion of the original image due to a change in transfer speed of the transferer.

Abstract: An inspection apparatus for a semiconductor process and a semiconductor process device, the inspection apparatus including a transferer configured to transfer a process object between a plurality of chambers; at least one line camera installed above the transferer, the at least one line camera being configured to generate an original image by capturing an image of the process object transferred by the transferer; and a controller configured to receive the original image and to perform an inspection of the process object by correcting distortion of the original image due to a change in transfer speed of the transferer.

Abstract: A method of inspecting a flat panel display including inputting an image data signal into the flat panel display, obtaining an image displayed on the flat panel display in response to the input image data signal with a camera, extracting a raw brightness information corresponding to each location from the obtained image, calculating a fitting brightness information corresponding to each location through the curve fitting based on the raw brightness information, calculating a brightness difference corresponding to each location between the raw brightness information and the fitting brightness information, and detecting stain locations with the brightness difference beyond a predetermined permitted limit.

Abstract: A method of inspecting a flat panel display including inputting an image data signal into the flat panel display, obtaining an image displayed on the flat panel display in response to the input image data signal with a camera, extracting a raw brightness information corresponding to each location from the obtained image, calculating a fitting brightness information corresponding to each location through the curve fitting based on the raw brightness information, calculating a brightness difference corresponding to each location between the raw brightness information and the fitting brightness information, and detecting stain locations with the brightness difference beyond a predetermined permitted limit.