Patents by Inventor Sung-Feng Shih

Sung-Feng Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153881
    Abstract: A method of forming semiconductor structure includes attaching backsides of top dies to a front side of a bottom wafer, the bottom wafer comprising a plurality of bottom dies; forming first conductive pillars on the front side of the bottom wafer adjacent to the top dies; forming a first dielectric material on the front side of the bottom wafer around the top dies and around the first conductive pillars; and dicing the bottom wafer to form a plurality of structures, each of the plurality of structures comprising at least one of the top dies and at least one of the bottom dies.
    Type: Application
    Filed: January 2, 2024
    Publication date: May 9, 2024
    Inventors: Chen-Hua Yu, Tzuan-Horng Liu, Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh
  • Patent number: 11916012
    Abstract: A manufacturing method of a semiconductor structure is provided. A first semiconductor die includes a first semiconductor substrate, a first interconnect structure formed thereon, a first bonding conductor formed thereon, and a conductive via extending from the first interconnect structure toward a back surface of the first semiconductor substrate. The first semiconductor substrate is thinned to accessibly expose the conductive via to form a through semiconductor via (TSV). A second semiconductor die is bonded to the first semiconductor die. The second semiconductor die includes a second semiconductor substrate including an active surface facing the back surface of the first semiconductor substrate, a second interconnect structure between the second and the first semiconductor substrates, and a second bonding conductor between the second interconnect structure and the first semiconductor substrate and bonded to the TSV.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih
  • Patent number: 6634611
    Abstract: A suspension hanger framework includes a fixation piece, a suspension rod, and a crossbar. The fixation piece is fixed with the ceiling or projection of a structure and is provided with two pivoting lugs, each being provided with a first slide slot and a second slide slot. The suspension rod is fastened pivotally at a top end to the two pivoting lugs by a first pivot and a second pivot. The first pivot and the second pivot are respectively disposed slidably in the first slide slot and the second slide slot, thereby enabling the suspension rod to be swiveled between a suspension state and a folding state. The crossbar is fastened to a bottom end of the suspension rod and is used for hanging objects.
    Type: Grant
    Filed: November 18, 2002
    Date of Patent: October 21, 2003
    Inventor: Sung-Feng Shih
  • Patent number: D531012
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: October 31, 2006
    Inventor: Sung-Feng Shih
  • Patent number: D482557
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: November 25, 2003
    Inventor: Sung-Feng Shih