Patents by Inventor Sung-Goon Kang

Sung-Goon Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120074575
    Abstract: A copper line having self assembled monolayer for use in ULSI semiconductor devices and methods of making the same are presented. The copper line includes an interlayer dielectric, a self-assembled monolayer, catalytic particles on the monolayer, and a copper layer on the monolayer with the catalytic particles. The method includes the steps of forming an interlayer dielectric on a semiconductor substrate having a metal line forming region; forming a self-assembled monolayer on the metal line forming region; adsorbing catalytic particles on the self-assembled monolayer; forming using an electroless process a copper seed layer on the self-assembled monolayer having the catalytic particles adsorbed thereto; and forming a copper layer on the copper seed layer to fill in the metal line forming region.
    Type: Application
    Filed: December 1, 2011
    Publication date: March 29, 2012
    Applicants: IUCF-HYU (Industry-Univeristy Cooperation Foundation Hanyang University), Hynix Semiconductor Inc.
    Inventors: Seung Jin YEOM, Jae Hong KIM, Sung Goon KANG, Won Kyu HAN
  • Patent number: 8088687
    Abstract: A copper line having self assembled monolayer for use in ULSI semiconductor devices and methods of making the same are presented. The copper line includes an interlayer dielectric, a self-assembled monolayer, catalytic particles on the monolayer, and a copper layer on the monolayer with the catalytic particles. The method includes the steps of forming an interlayer dielectric on a semiconductor substrate having a metal line forming region; forming a self-assembled monolayer on the metal line forming region; adsorbing catalytic particles on the self-assembled monolayer; forming using an electroless process a copper seed layer on the self-assembled monolayer having the catalytic particles adsorbed thereto; and forming a copper layer on the copper seed layer to fill in the metal line forming region.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: January 3, 2012
    Assignees: Hynix Semiconductor Inc., IUCF-HYU (Industry-University Cooperation Foundation Hanyang University)
    Inventors: Seung Jin Yeom, Jae Hong Kim, Sung Goon Kang, Won Kyu Han
  • Patent number: 7960071
    Abstract: Disclosed is a separator for a fuel cell made of a metal plate comprising both a cooling water flow field and a gas flow field formed on each surface thereof, wherein the separator consists of the joined metal plates for the cooling water flow fields to face each other, the surfaces of the joined metal plates are coated with TiN, a polymer electrolyte membrane fuel cell comprising the separator and a method for manufacturing the separator.
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: June 14, 2011
    Assignee: Korea Institute of Science and Technology
    Inventors: In-Hwan Oh, Eun Ae Cho, Sung-Goon Kang, Ui Sik Jeon, Heung Yong Ha, Seong Ahn Hong, Tae Hoon Lim, Suk-Woo Nam, Sung Pil Yoon, Jonghee Han
  • Publication number: 20110057316
    Abstract: A copper wiring of a semiconductor device is which is resistant to unwanted diffusion of copper from away from the copper wiring is presented. The copper wiring includes an interlayer dielectric, a self-assembly monolayer, a plurality of catalyst particles, a metal layer, and a copper layer. The interlayer dielectric on the semiconductor substrate has a wiring forming region. The self-assembly monolayer is the wiring forming region. The plurality of catalyst particles are adsorbed onto the surface of the self-assembly monolayer. The metal layer is formed on the self-assembly monolayer which has the adsorbed catalyst particles such that the metal layer serves as both a seed layer and as a diffusion barrier. The copper layer substantially fills in the wiring forming region.
    Type: Application
    Filed: December 10, 2009
    Publication date: March 10, 2011
    Applicants: Hynix Semiconductor Inc., IUCF-HYU (Industry-University Cooperation Foundation Hanyang University)
    Inventors: Jae Hong KIM, Sung Goon KANG, Won Kyu HAN, Soo Ho PARK
  • Publication number: 20100244253
    Abstract: A copper line having self assembled monolayer for use in ULSI semiconductor devices and methods of making the same are presented. The copper line includes an interlayer dielectric, a self-assembled monolayer, catalytic particles on the monolayer, and a copper layer on the monolayer with the catalytic particles. The method includes the steps of forming an interlayer dielectric on a semiconductor substrate having a metal line forming region; forming a self-assembled monolayer on the metal line forming region; adsorbing catalytic particles on the self-assembled monolayer; forming using an electroless process a copper seed layer on the self-assembled monolayer having the catalytic particles adsorbed thereto; and forming a copper layer on the copper seed layer to fill in the metal line forming region.
    Type: Application
    Filed: June 25, 2009
    Publication date: September 30, 2010
    Inventors: Seung Jin YEOM, Jae Hong KIM, Sung Goon KANG, Won Kyu HAN
  • Publication number: 20050214618
    Abstract: Disclosed is a separator for a fuel cell made of a metal plate coated with TiN, a polymer electrolyte membrane fuel cell comprising the separator and a method for manufacturing the separator. According to the invention, the separator can be made to be thin and it is possible to increase the power density, compared to the prior separator made of graphite. At the same time, a proper level of physical strength can be maintained, so that there is no problem of a breakdown by an external shock. In addition, the flow field can be easily formed and the cost is low. Additionally, the polymer electrolyte membrane fuel cell comprising the separator using a metal plate coated with TiN according to the invention has no problem of corrosion of metal separator due to the electrolyte, compared to the prior metal separator, so that the durability is excellent and the lifetime is long.
    Type: Application
    Filed: December 13, 2004
    Publication date: September 29, 2005
    Applicant: Korea Institute of Science and Technology
    Inventors: In-Hwan Oh, Eun Cho, Sung-Goon Kang, Ui Jeon, Heung Ha, Seong Hong, Tae Lim, Suk-Woo Nam, Sung Yoon, Jonghee Han