Patents by Inventor Sung-gyu Kang

Sung-gyu Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240155910
    Abstract: A pixel includes first, second, and third sub-pixels each including an emission area and a non-emission area. Each of the first, second, and third sub-includes a pixel circuit layer; a first electrode on the pixel circuit layer; a pixel defining layer on the first electrode and including an opening to expose an area of the first electrode; an emission layer on the pixel defining layer; a second electrode on the emission layer; a thin film encapsulation layer over the second electrode; a color filter on the thin film encapsulation layer; and an overcoat layer over the color filter. The overcoat layer has a refractive index greater than a refractive index of the color filter. A color filter of the second sub-pixel overlaps a color filter of each of the first and third sub-pixels in the non-emission area.
    Type: Application
    Filed: October 25, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Tae Ho KIM, Hyeo Ji KANG, Oh Jeong KWON, Su Jeong KIM, Mi Hwa LEE, Hong Yeon LEE, Sung Gyu JANG, Seung Yeon JEONG
  • Patent number: 9386708
    Abstract: Disclosed is a method of forming an electric wiring using inkjet printing. The method includes forming a main trench and first and second guide trenches on a substrate. The first and second guide trenches are disposed at opposite sides of the main trench. The method includes ejecting ink into the main trench, the ink including a conductive material. The method also includes heating the substrate to sinter the ink such that the electric wiring is formed an upper portion of the main trench, and contract the ink such that a tunnel is formed in a lower portion of the main trench.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: July 5, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joong-hyuk Kim, Yong-wan Jin, Young-ki Hong, Sung-gyu Kang, Seung-ho Lee, Jin-seok Hong
  • Patent number: 9233540
    Abstract: A printing apparatus includes: a flow channel plate including, a pressure chamber, a nozzle including an outlet through which ink contained in the pressure chamber is ejected, and a trench disposed around the nozzle, and the outlet extending into the trench; a piezoelectric actuator configured to provide a change in pressure to eject the ink contained in the pressure chamber; and an electrostatic actuator configured to provide an electrostatic driving force to the ink contained in the nozzle.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: January 12, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-ki Hong, Sung-gyu Kang, Jae-woo Chung, Seung-ho Lee, Joong-hyuk Kim, Yong-wan Jin
  • Patent number: 9153487
    Abstract: A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate, except on the first wire; forming a surface treatment film on the material layer; and forming a second wire on the first wire. The surface treatment film has physical properties opposite to the first wire. A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate and the first wire; removing a portion of the material layer from the first wire; forming a surface treatment film on the material layer and the first wire; removing a portion of the surface treatment film from the first wire; and forming a second wire on the first wire. A thickness of the material layer on the substrate is greater than a thickness of the first wire on the substrate.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: October 6, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-ho Lee, Young-ki Hong, Sung-gyu Kang, Joong-hyuk Kim, Jae-woo Chung
  • Patent number: 9050793
    Abstract: An inkjet printing device includes a flow path plate comprising a manifold to supply ink, a pressure chamber filled with the ink supplied from the manifold, and a nozzle via which the ink is ejected, a piezoelectric actuator which is disposed on a top surface of the flow path plate and includes a lower electrode, a piezoelectric layer, and an upper electrode that are stacked sequentially, a first electrostatic electrode to generate an electrostatic field, and a second electrostatic electrode which is disposed a predetermined distance apart from a bottom surface of the flow path plate to generate the electrostatic field between the first electrostatic electrode and the second electrostatic electrode.
    Type: Grant
    Filed: April 22, 2008
    Date of Patent: June 9, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Jae-woo Chung, Young-ki Hong, Sung-gyu Kang
  • Patent number: 9018036
    Abstract: A method of forming patterns on a substrate, the method including: placing a mask having an opening defining a portion of one surface of a substrate on which patterns are to be formed on the substrate; forming a first modification layer in the opening by ejecting a surface modification ink onto a surface of the substrate through the opening; ejecting a target ink having droplets of sizes larger than those of a surface modification ink such that the target ink is distributed on the first modification layer in the opening; and removing the mask.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: April 28, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joong-hyuk Kim, Sung-gyu Kang, Seung-ho Lee, Jae-woo Chung, Young-ki Hong
  • Publication number: 20150035911
    Abstract: A printing apparatus includes: a flow channel plate including, a pressure chamber, a nozzle including an outlet through which ink contained in the pressure chamber is ejected, and a trench disposed around the nozzle, and the outlet extending into the trench; a piezoelectric actuator configured to provide a change in pressure to eject the ink contained in the pressure chamber; and an electrostatic actuator configured to provide an electrostatic driving force to the ink contained in the nozzle.
    Type: Application
    Filed: October 21, 2014
    Publication date: February 5, 2015
    Inventors: Young-ki HONG, Sung-gyu KANG, Jae-woo CHUNG, Seung-ho LEE, Joong-hyuk KIM, Yong-wan JIN
  • Patent number: 8939549
    Abstract: Provided is an inkjet printing apparatus. The inkjet printing apparatus includes a nozzle. The nozzle includes at least two nozzle parts. A first of the at least two nozzle parts has a first tapered shape, and a second of the at least two nozzle parts has a second tapered shape and extends from the first nozzle part. The first and second tapered shapes have a same taper direction.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: January 27, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-gyu Kang, Young-ki Hong
  • Patent number: 8898902
    Abstract: A printing apparatus includes: a flow channel plate including, a pressure chamber, a nozzle including an outlet through which ink contained in the pressure chamber is ejected, and a trench disposed around the nozzle, and the outlet extending into the trench; a piezoelectric actuator configured to provide a change in pressure to eject the ink contained in the pressure chamber; and an electrostatic actuator configured to provide an electrostatic driving force to the ink contained in the nozzle.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: December 2, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-ki Hong, Sung-gyu Kang, Jae-woo Chung, Seung-ho Lee, Joong-hyuk Kim, Yong-wan Jin
  • Patent number: 8888244
    Abstract: A printing apparatus includes a first nozzle substrate having a first tapered nozzle unit aligned with a pressure chamber and a second nozzle substrate having a second tapered nozzle unit aligned with the first tapered nozzle unit and attached to the bottom of the first nozzle substrate.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: November 18, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-gyu Kang, Young-ki Hong, Joong-hyuk Kim, Seung-ho Lee, Jae-woo Chung, Yong-wan Jin
  • Patent number: 8888243
    Abstract: Provided is an inkjet printing device. The inkjet printing device includes a passage forming substrate having a plurality of pressure chambers and a nozzle substrate. The nozzle substrate includes a plurality of nozzle blocks extending in a first direction, a plurality of nozzles connected to the pressure chambers and penetrating the nozzle blocks, and a plurality of trenches. Each of the trenches is disposed in a second direction perpendicular to the first direction with respect to the nozzle blocks, recessed from a bottom surface of the nozzle blocks, and extends in the first direction.
    Type: Grant
    Filed: March 19, 2013
    Date of Patent: November 18, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-ki Hong, Sung-gyu Kang, Joong-hyuk Kim, Seung-ho Lee, Jin-Seok Hong
  • Patent number: 8813363
    Abstract: A method of manufacturing a piezoelectric inkjet printhead includes processing a lower silicon-on-insulator substrate having a sequentially stacked structure with a first silicon layer, an intervening oxide layer, and a second silicon layer, processing the lower silicon-on-insulator substrate by etching the second silicon layer to form a manifold, a plurality of pressure chambers arranged along at least one side of the manifold and connected with the manifold, and a plurality of dampers connected with the pressure chambers, and by etching the first silicon layer and the intervening oxide layer to form a plurality of vertical nozzles through the first silicon layer and the intervening oxide layer to corresponding ones of the plurality of dampers, stacking and bonding an upper substrate on the lower substrate, reducing the upper substrate to a predetermined thickness, and forming a piezoelectric actuator on the upper substrate.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: August 26, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae-chang Lee, Jae-woo Chung, Kyo-yool Lee, Chang-seung Lee, Sung-gyu Kang
  • Publication number: 20140160203
    Abstract: Provided is an inkjet printing apparatus. The inkjet printing apparatus includes a nozzle. The nozzle includes at least two nozzle parts. A first of the at least two nozzle parts has a first tapered shape, and a second of the at least two nozzle parts has a second tapered shape and extends from the first nozzle part. The first and second tapered shapes have a same taper direction.
    Type: Application
    Filed: November 20, 2013
    Publication date: June 12, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung-gyu KANG, Young-ki HONG
  • Publication number: 20140141156
    Abstract: Disclosed is a method of forming an electric wiring using inkjet printing. The method includes forming a main trench and first and second guide trenches on a substrate. The first and second guide trenches are disposed at opposite sides of the main trench. The method includes ejecting ink into the main trench, the ink including a conductive material. The method also includes heating the substrate to sinter the ink such that the electric wiring is formed an upper portion of the main trench, and contract the ink such that a tunnel is formed in a lower portion of the main trench.
    Type: Application
    Filed: April 12, 2013
    Publication date: May 22, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joong-hyuk KIM, Yong-wan JIN, Young-ki HONG, Sung-gyu KANG, Seung-ho LEE, Jin-seok HONG
  • Publication number: 20140138345
    Abstract: A method of forming a conductive pattern includes forming a first partition and a second partition which are spaced apart from each other on a substrate, the first and second partitions defining a trench. The method includes discharging ink into the trench to form ink droplets pinned in a boundary region of the first and second partitions. The method further includes the boundary region including a region between a top side and an outer side of the first and second partitions, the ink including conductive particles. The method includes performing drying and sintering processes to form the conductive pattern in the trench, the conductive pattern including the conductive particles.
    Type: Application
    Filed: May 29, 2013
    Publication date: May 22, 2014
    Inventors: Jin-seok HONG, Young-ki HONG, Joong-hyuk KIM, Sung-gyu KANG, Seung-ho LEE
  • Publication number: 20140098160
    Abstract: Provided is an inkjet printing device. The inkjet printing device includes a passage forming substrate having a plurality of pressure chambers and a nozzle substrate. The nozzle substrate includes a plurality of nozzle blocks extending in a first direction, a plurality of nozzles connected to the pressure chambers and penetrating the nozzle blocks, and a plurality of trenches. Each of the trenches is disposed in a second direction perpendicular to the first direction with respect to the nozzle blocks, recessed from a bottom surface of the nozzle blocks, and extends in the first direction.
    Type: Application
    Filed: March 19, 2013
    Publication date: April 10, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-ki HONG, Sung-gyu KANG, Joong-hyuk KIM, Seung-ho LEE, Jin-Seok HONG
  • Patent number: 8678552
    Abstract: A nozzle plate including protruding nozzles and a method of manufacturing the nozzle plate. The nozzle plate may include a body unit and at least one nozzle protruding from the body unit. The at least one nozzle may include an exit part having a constant cross-sectional area and a damper part having a cross-sectional area that decreases in a direction toward the exit part, wherein the damper part of the at least one nozzle includes a plurality of inner wall surfaces having different angles of inclination.
    Type: Grant
    Filed: April 25, 2011
    Date of Patent: March 25, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Sung-gyu Kang
  • Patent number: 8556382
    Abstract: Provided are a nozzle plate and a method of fabricating the nozzle plate. In accordance with an example embodiment of the present invention, a nozzle plate may include a body and at least one nozzle protruding from the body, wherein the at least one nozzle includes a wall having a thickness that increases the farther the wall gets away from an exit of the at least one nozzle.
    Type: Grant
    Filed: August 13, 2009
    Date of Patent: October 15, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Sung-gyu Kang
  • Patent number: 8485641
    Abstract: Provided is a nozzle plate and methods of manufacturing the nozzle plate. The nozzle plate may include a substrate having a nozzle. The nozzle plate may also include a permittivity reducing area in an upper portion of the substrate around the nozzle, wherein the permittivity reducing area includes a plurality of porosities and a plurality of walls between the plurality of porosities. Additionally, the nozzle plate may include a protection layer on the substrate, wherein the protection layer covers the plurality of porosities and the plurality of walls.
    Type: Grant
    Filed: June 17, 2010
    Date of Patent: July 16, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-gyu Kang, Jae-woo Chung, Young-Ki Hong
  • Publication number: 20130164932
    Abstract: A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate, except on the first wire; forming a surface treatment film on the material layer; and forming a second wire on the first wire. The surface treatment film has physical properties opposite to the first wire. A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate and the first wire; removing a portion of the material layer from the first wire; forming a surface treatment film on the material layer and the first wire; removing a portion of the surface treatment film from the first wire; and forming a second wire on the first wire. A thickness of the material layer on the substrate is greater than a thickness of the first wire on the substrate.
    Type: Application
    Filed: August 31, 2012
    Publication date: June 27, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-ho LEE, Young-ki HONG, Sung-gyu KANG, Joong-hyuk KIM, Jae-woo CHUNG