Patents by Inventor Sung H. Jang

Sung H. Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermosetting polyimide resin composition
    Patent number: 5004774
    Abstract: A thermosetting polymide resin composition having an excellent molding processing property, heat resistance, low mold shrinkage, and good external appearance of its manufacture which comprises a modified bismaleimide resin prepared by reacting the Michael addition reaction of bismaleimides with aromatic primary diamines and aromatic secondary diamines, an inorganic filler, silicone oil, and a mixed catalyst composed of organic peroxides and imidazoles.
    Type: Grant
    Filed: December 23, 1988
    Date of Patent: April 2, 1991
    Assignee: Lucky, Ltd.
    Inventors: Jong K. Yeo, Chung S. Kim, Dong J. Lee, Sung H. Jang