Patents by Inventor Sung Hak Hong

Sung Hak Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9108536
    Abstract: A walk-in apparatus for vehicle seats can be constructed of parts required to realize the walk-in operation, thus reducing the production cost and the weight of the apparatus. Moreover, apparatus can reduce the volume of the entire apparatus so that it can be easily applied even to a small-sized seat, for example, that of a small vehicle.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: August 18, 2015
    Assignee: HYUNDAI MOTOR COMPANY
    Inventors: Eun Sue Kim, Hyeong Jun Kim, Sung Hak Hong
  • Publication number: 20150015053
    Abstract: A vehicle seat includes: a seat back pad of a vehicle; a rear cover coupled with the seat back pad on the rear side and made of flexible material; and a bracket formed along the periphery of the rear cover, the bracket being coupled with the seat back pad so that its front is supported by the seat back pad.
    Type: Application
    Filed: November 12, 2013
    Publication date: January 15, 2015
    Applicants: Kia Motors Corp., Hyundai Motor Company
    Inventor: Sung Hak Hong
  • Publication number: 20130147250
    Abstract: A walk-in apparatus for vehicle seats can be constructed of parts required to realize the walk-in operation, thus reducing the production cost and the weight of the apparatus. Moreover, apparatus can reduce the volume of the entire apparatus so that it can be easily applied even to a small-sized seat, for example, that of a small vehicle.
    Type: Application
    Filed: June 19, 2012
    Publication date: June 13, 2013
    Applicant: Hyundai Motor Company
    Inventors: Eun Sue KIM, Hyeong Jun KIM, Sung Hak HONG
  • Patent number: 7891720
    Abstract: A double folding seat for a vehicle may include a stationary bracket, coupled to the seatback frame and to the cushion frame, wherein the recliner bracket is coupled to the one end of the stationary bracket, a link unit elastically installed on the stationary bracket and configured to be selectively coupled to the recliner bracket and transmit a rotating force of the recliner bracket to a latch cam installed to the cushion frame, a stopper fixedly installed on the leg assembly which is connected to a vehicle body, a hinge member rotatably mounted on the cushion frame and rotated by the stopper, and an actuating wire connecting the hinge member and the link unit and displacing the link unit by a rotation force of the hinge member to a position where the link unit cooperates with the recliner bracket when the cushion frame moves backwards to the final position thereof.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: February 22, 2011
    Assignees: Hyundai Motor Company, Kia Motors Corp.
    Inventors: Chan Ho Jeong, Young Dong Kim, Sung Hak Hong
  • Publication number: 20100127545
    Abstract: A double folding seat for a vehicle may include a stationary bracket, coupled to the seatback frame and to the cushion frame, wherein the recliner bracket is coupled to the one end of the stationary bracket, a link unit elastically installed on the stationary bracket and configured to be selectively coupled to the recliner bracket and transmit a rotating force of the recliner bracket to a latch cam installed to the cushion frame, a stopper fixedly installed on the leg assembly which is connected to a vehicle body, a hinge member rotatably mounted on the cushion frame and rotated by the stopper, and an actuating wire connecting the hinge member and the link unit and displacing the link unit by a rotation force of the hinge member to a position where the link unit cooperates with the recliner bracket when the cushion frame moves backwards to the final position thereof.
    Type: Application
    Filed: August 26, 2009
    Publication date: May 27, 2010
    Applicants: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Chan Ho JEONG, Young Dong Kim, Sung Hak Hong
  • Patent number: 6522020
    Abstract: Disclosed is a wafer-level package.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: February 18, 2003
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventor: Sung Hak Hong
  • Patent number: 6297543
    Abstract: The present invention discloses a chip scale package. According to this invention, a lead frame 130 is bonded with an adhesive 140 to a bottom face of a semiconductor chip 110. An inner lead 131 of the lead frame 130 is connected to a pad 111 of the semiconductor chip with a metal wire 120, and thickness of the inner lead 131 is equal to an original thickness of the lead frame 130. An outer lead 132 of the lead frame 130 is formed by partially etching a bottom face of the lead frame 130. The entire resultant is encapsulated with a molding compound 100 such that the outer lead 132 is exposed therefrom, especially there is formed a downward protruding portion 101 at the molding compound 100 in the lower inner lead portion 131. This protruding portion raises the margin controlling the bonding height during the wire-bonding process such that the metal wire 120 is not exposed from the molding compound 100.
    Type: Grant
    Filed: December 7, 1999
    Date of Patent: October 2, 2001
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventors: Sung Hak Hong, Jong Tae Moon, Chang Jun Park, Yoon Hwa Choi
  • Publication number: 20010005040
    Abstract: Disclosed is a wafer-level package.
    Type: Application
    Filed: December 14, 2000
    Publication date: June 28, 2001
    Inventor: Sung Hak Hong
  • Patent number: D463064
    Type: Grant
    Filed: November 27, 2001
    Date of Patent: September 17, 2002
    Assignee: Colibri Corporation
    Inventor: Sung-Hak Hong
  • Patent number: D468481
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: January 7, 2003
    Assignee: Colibri Corporation
    Inventor: Sung-Hak Hong
  • Patent number: D469920
    Type: Grant
    Filed: June 25, 2002
    Date of Patent: February 4, 2003
    Assignee: Colibri Corporation
    Inventor: Sung-Hak Hong