Patents by Inventor Sung Han RYU
Sung Han RYU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240095484Abstract: Proposed is a dual band RFID tag including a first rectifier configured to receive and rectify a first RF signal modulated at a first frequency, a first regulator configured to regulate an output voltage of the first rectifier, a second rectifier configured to receive and rectify a second RF signal modulated at a second frequency, a second regulator configured to regulate an output voltage of the second rectifier, a voltage distributor connected to a first node and a ground in a state of being positioned therebetween, the output terminal of the first rectifier and the output terminal of the second rectifier being both connected to the first node, a multiplexer configured to output any one of an analog detection signal output from a sensor and an output signal of the voltage distributor, in response to a first selection signal or a second selection signal, and an analog-to-digital converter configured to receive as an operating voltage a voltage of a second node to which an output terminal of the first regulatType: ApplicationFiled: April 26, 2023Publication date: March 21, 2024Inventors: Sung Wan KIM, Pyeong Han LEE, Kwang Beom PARK, Sung Hun CHUN, Chang Ho RYU
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Patent number: 11804447Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: GrantFiled: January 22, 2021Date of Patent: October 31, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jun Ho Jeon, Kyeong Sool Seong, Seok Ho Na, Jeong Il Kim, Young Kyu Kim, Sung Ho Jeon, Deok In Lim, Sung Moo Hong, Sung Jung Kim, Sung Han Ryu, Kyung Nam Kang, Seong Hak Yoo
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Publication number: 20210143105Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: ApplicationFiled: January 22, 2021Publication date: May 13, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jun Ho JEON, Kyeong Sool SEONG, Seok Ho NA, Jeong Il KIM, Young Kyu KIM, Sung Ho JEON, Deok In LIM, Sung Moo HONG, Sung Jung KIM, Sung Han RYU, Kyung Nam KANG, Seong Hak YOO
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Patent number: 10943871Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: GrantFiled: October 18, 2018Date of Patent: March 9, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jun Ho Jeon, Kyeong Sool Seong, Seok Ho Na, Jeong Il Kim, Young Kyu Kim, Sung Ho Jeon, Deok In Lim, Sung Moo Hong, Sung Jung Kim, Sung Han Ryu, Kyung Nam Kang, Seong Hak Yoo
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Publication number: 20190051616Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: ApplicationFiled: October 18, 2018Publication date: February 14, 2019Applicant: AMKOR TECHNOLOGY INC.Inventors: Jun Ho JEON, Kyeong Sool SEONG, Seok Ho NA, Jeong Il KIM, Young Kyu KIM, Sung Ho JEON, Deok In LIM, Sung Moo HONG, Sung Jung KIM, Sung Han RYU, Kyung Nam KANG, Seong Hak YOO
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Patent number: 10141269Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: GrantFiled: December 3, 2016Date of Patent: November 27, 2018Assignee: Amkor Technology, Inc.Inventors: Jun Ho Jeon, Kyeong Sool Seong, Seok Ho Na, Jeong Il Kim, Young Kyu Kim, Sung Ho Jeon, Deok In Lim, Sung Moo Hong, Sung Jung Kim, Sung Han Ryu, Kyung Nam Kang, Seong Hak Yoo
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Publication number: 20170263568Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: ApplicationFiled: December 3, 2016Publication date: September 14, 2017Applicant: Amkor Technology, Inc.Inventors: Jun Ho JEON, Kyeong Sool SEONG, Seok Ho NA, Jeong Il KIM, Young Kyu KIM, Sung Ho JEON, Deok In LIM, Sung Moo HONG, Sung Jung KIM, Sung Han RYU, Kyung Nam KANG, Seong Hak YOO