Abstract: A sidewall protection layer is formed on sidewall spacers of a dummy gate structure of a semiconductor device prior to etching an underlying fin structure to form a source/drain recess. The sidewall protection layer enables the profile of the source/drain recess to be precisely controlled so that etching into residual dummy gate material near the source/drain recess is minimized or prevented. The sidewall protection layer may be removed or retained in the semiconductor device after formation of the source/drain recess. The sidewall protection layer reduces the likelihood of the source/drain regions of the semiconductor device contacting the metal gate structures of the semiconductor device after the dummy gate structures are replaced with the metal gate structures. Thus, the sidewall protection layer reduces the likelihood of electrical shorting between the source/drain regions and the metal gate structures.

Abstract: An integrated circuit (IC) with conductive structures and a method of fabricating the IC are disclosed. The method includes depositing a first dielectric layer on a semiconductor device, forming a conductive structure in the first dielectric layer, removing a portion of the first dielectric layer to expose a sidewall of the conductive structure, forming a barrier structure surrounding the sidewall of the conductive structure, depositing a conductive layer on the barrier structure, and performing a polishing process on the barrier structure and the conductive layer.

Abstract: A wireless power system receives an input voltage signal from a first node of a secondary side coil, comprises an active rectifier, a buck converter, and a linear charger comprising a first resistor, a second resistor, a third resistor, a mode switching circuit, a current mirror circuit. The active rectifier rectifies the input voltage signal to generate a rectified voltage signal. The first resistor couples between a first node point and second node point. The second resistor couples between the second node point and ground terminal. The third resistor couples between a third node point and ground terminal. The current mirror circuit outputs a reference current and charge current according to the rectified voltage signal and mode switching signal generated by the mode switching circuit. The buck converter outputs a first output voltage signal or second output voltage signal according to a first node point voltage.

Abstract: A wireless power system receives an input voltage signal from a first node of a secondary side coil, comprises an active rectifier, a buck converter, and a linear charger comprising a first resistor, a second resistor, a third resistor, a mode switching circuit, a current mirror circuit. The active rectifier rectifies the input voltage signal to generate a rectified voltage signal. The first resistor couples between a first node point and second node point. The second resistor couples between the second node point and ground terminal. The third resistor couples between a third node point and ground terminal. The current mirror circuit outputs a reference current and charge current according to the rectified voltage signal and mode switching signal generated by the mode switching circuit. The buck converter outputs a first output voltage signal or second output voltage signal according to a first node point voltage.