Abstract: Disclosed are shear wave parameter measurement method and ultrasound wave device. The shear wave parameter measurement method of one embodiment comprises the steps of: acquiring a plurality of shear wave data by repeating a plurality of shear wave acquisition sequences; and measuring a mechanical parameter of the plurality of acquired shear wave data, wherein the plurality of shear wave acquisition sequences comprise a first sequence and a second sequence, the first sequence comprises an operation for performing first acoustic radiation force impulse (ARFI) pushing for generating a shear wave in an area of interest, and detecting, from a plurality of detection lines, the shear wave generated by the first ARFI pushing, and the second sequence comprises an operation for performing second ARFI pushing for generating a shear wave in an area of interest, and detecting, from the plurality of detection lines, the shear wave generated by the second ARFI pushing.

Abstract: A method of testing a semiconductor memory device is provided. The method includes performing a test according to a plurality of cases corresponding to a first generation and generating modeled test results for the plurality of cases, determining optimum cases from among the plurality of cases based on the modeled test results, and generating a plurality of cases corresponding to a second generation based on the optimum cases.

Abstract: A method of testing a semiconductor memory device is provided. The method includes performing a test according to a plurality of cases corresponding to a first generation and generating modeled test results for the plurality of cases, determining optimum cases from among the plurality of cases based on the modeled test results, and generating a plurality of cases corresponding to a second generation based on the optimum cases.

Abstract: A three-dimensional semiconductor package and method for making the same include providing a first package layout parameter for a plurality of first terminals included in a first package, a second package layout parameter for a plurality of second terminals included in a second package disposed above or below the first package, and a connection terminal layout parameter for a plurality of connection terminals electrically connecting the first package and the second package; providing a first wiring connection layout between the first and second terminals and the connection terminals by applying a first process to the first package, second package, and connection terminal layout parameters; and providing a second wiring connection layout between the first and second terminals and the connection terminals by applying a second process, which is different from the first process, to the first wiring connection layout.

Abstract: A three-dimensional semiconductor package and method for making the same include providing a first package layout parameter for a plurality of first terminals included in a first package, a second package layout parameter for a plurality of second terminals included in a second package disposed above or below the first package, and a connection terminal layout parameter for a plurality of connection terminals electrically connecting the first package and the second package; providing a first wiring connection layout between the first and second terminals and the connection terminals by applying a first process to the first package, second package, and connection terminal layout parameters; and providing a second wiring connection layout between the first and second terminals and the connection terminals by applying a second process, which is different from the first process, to the first wiring connection layout.

Abstract: Disclosed is method for estimating statistical distribution characteristics of product parameters. The method comprises determining n number of product parameters, which characterize a product, and m number of characteristic parameters dependent on the product parameters, determining m number of correlation functions that represent the characteristic parameters in terms of the product parameters, and obtaining inverse functions of the correlation functions that represent the product parameters in terms of the characteristic parameters. After fabricating test products to empirically determine quantitative relations between the product and characteristic parameters, the method includes measuring k number of test products and preparing measured data of the characteristic parameters.

Abstract: Disclosed is method for estimating statistical distribution characteristics of product parameters. The method comprises determining n number of product parameters, which characterize a product, and m number of characteristic parameters dependent on the product parameters, determining m number of correlation functions that represent the characteristic parameters in terms of the product parameters, and obtaining inverse functions of the correlation functions that represent the product parameters in terms of the characteristic parameters. After fabricating test products to empirically determine quantitative relations between the product and characteristic parameters, the method includes measuring k number of test products and preparing measured data of the characteristic parameters.